JP4428792B2 - 露光装置 - Google Patents

露光装置 Download PDF

Info

Publication number
JP4428792B2
JP4428792B2 JP2000060269A JP2000060269A JP4428792B2 JP 4428792 B2 JP4428792 B2 JP 4428792B2 JP 2000060269 A JP2000060269 A JP 2000060269A JP 2000060269 A JP2000060269 A JP 2000060269A JP 4428792 B2 JP4428792 B2 JP 4428792B2
Authority
JP
Japan
Prior art keywords
substrate
exposure apparatus
chuck
glass substrate
size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000060269A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001249462A (ja
JP2001249462A5 (enExample
Inventor
毅 滝沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2000060269A priority Critical patent/JP4428792B2/ja
Publication of JP2001249462A publication Critical patent/JP2001249462A/ja
Publication of JP2001249462A5 publication Critical patent/JP2001249462A5/ja
Application granted granted Critical
Publication of JP4428792B2 publication Critical patent/JP4428792B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2000060269A 2000-03-06 2000-03-06 露光装置 Expired - Fee Related JP4428792B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000060269A JP4428792B2 (ja) 2000-03-06 2000-03-06 露光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000060269A JP4428792B2 (ja) 2000-03-06 2000-03-06 露光装置

Publications (3)

Publication Number Publication Date
JP2001249462A JP2001249462A (ja) 2001-09-14
JP2001249462A5 JP2001249462A5 (enExample) 2007-04-05
JP4428792B2 true JP4428792B2 (ja) 2010-03-10

Family

ID=18580611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000060269A Expired - Fee Related JP4428792B2 (ja) 2000-03-06 2000-03-06 露光装置

Country Status (1)

Country Link
JP (1) JP4428792B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4594745B2 (ja) * 2005-01-14 2010-12-08 パナソニック株式会社 反射防止構造体を有する部材の製造方法
TWI452437B (zh) * 2006-11-27 2014-09-11 尼康股份有限公司 An exposure method, a pattern forming method, and an exposure apparatus, and an element manufacturing method
JP5542456B2 (ja) 2010-01-18 2014-07-09 凸版印刷株式会社 カラーフィルタ基板の露光方法
JP5549233B2 (ja) * 2010-01-18 2014-07-16 凸版印刷株式会社 カラーフィルタ基板の露光方法

Also Published As

Publication number Publication date
JP2001249462A (ja) 2001-09-14

Similar Documents

Publication Publication Date Title
US8193100B2 (en) Exposure mask manufacturing method, drawing apparatus, semiconductor device manufacturing method, and mask blanks product
JP4794882B2 (ja) 走査型露光装置、走査型露光方法
US7289194B2 (en) Positioning apparatus, exposure apparatus, and device manufacturing method
JP2008103703A (ja) 基板保持装置、該基板保持装置を備える露光装置、およびデバイス製造方法
JP2001332480A (ja) 原版チャック、該原版チャックを備えた露光装置および半導体デバイス製造方法
JPH10321515A (ja) 半導体露光装置
JP4332409B2 (ja) 基板保持機構およびそれを用いた露光装置並びにデバイス製造方法
JP4428792B2 (ja) 露光装置
JP2001127144A (ja) 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
JP2006310446A (ja) 半導体装置の製造方法、および露光装置
JP3634539B2 (ja) マスク保持装置、露光装置、デバイス製造方法、及びマスク構造体
US6309212B1 (en) Substrate conveying system and device manufacturing method using the same
JP2000228355A (ja) 半導体露光装置およびデバイス製造方法
JP2000182936A (ja) 露光装置およびデバイス製造方法
JPH1174190A (ja) X線露光装置
JP3548375B2 (ja) 塗布処理方法および装置
JP2000138161A (ja) 露光装置
JPH10308434A (ja) 位置決め装置、ミラー曲り検出方法、位置決め方法およびデバイス製造方法
JP3473821B2 (ja) 露光量設定方法、露光方法、露光装置およびデバイス製造方法
US6784974B1 (en) Exposure method and exposure apparatus
JP3483403B2 (ja) 露光装置
JP2023173758A (ja) 露光装置、露光方法、および物品製造方法
US6856404B2 (en) Scanning exposure method and apparatus, and device manufacturing method using the same
KR20040016067A (ko) 감광막 노광 방법 및 이를 이용한 노광 설비
JP2000124125A (ja) 半導体露光装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070216

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070216

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20090406

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090630

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090728

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20091208

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20091215

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121225

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070216

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131225

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees