JP4428618B2 - 表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物 - Google Patents

表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物 Download PDF

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JP4428618B2
JP4428618B2 JP2003189578A JP2003189578A JP4428618B2 JP 4428618 B2 JP4428618 B2 JP 4428618B2 JP 2003189578 A JP2003189578 A JP 2003189578A JP 2003189578 A JP2003189578 A JP 2003189578A JP 4428618 B2 JP4428618 B2 JP 4428618B2
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Japan
Prior art keywords
spherical silica
resin
modified spherical
modified
epoxy resin
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Expired - Fee Related
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JP2003189578A
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Japanese (ja)
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JP2005022915A (ja
JP2005022915A5 (https=
Inventor
隆史 三橋
康裕 溶原
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
Mitsubishi Rayon Co Ltd
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Priority to JP2003189578A priority Critical patent/JP4428618B2/ja
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Publication of JP2005022915A5 publication Critical patent/JP2005022915A5/ja
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  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003189578A 2003-07-01 2003-07-01 表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物 Expired - Fee Related JP4428618B2 (ja)

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JP2003189578A JP4428618B2 (ja) 2003-07-01 2003-07-01 表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物

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JP2003189578A JP4428618B2 (ja) 2003-07-01 2003-07-01 表面改質球状シリカ及びその製造方法、並びに封止用樹脂組成物

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JP2005022915A JP2005022915A (ja) 2005-01-27
JP2005022915A5 JP2005022915A5 (https=) 2006-08-10
JP4428618B2 true JP4428618B2 (ja) 2010-03-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12580110B2 (en) 2022-03-17 2026-03-17 Kabushiki Kaisha Toshiba Superconducting coil, superconducting device, and liquid epoxy resin composition

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162846A (ja) * 2003-12-02 2005-06-23 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2008258429A (ja) * 2007-04-05 2008-10-23 Sekisui Chem Co Ltd 絶縁フィルム、電子部品装置の製造方法及び電子部品装置
US20110217512A1 (en) * 2008-09-01 2011-09-08 Sekisui Chemical Co., Ltd. Laminated body and method for producing laminated body
TW201119944A (en) * 2009-10-20 2011-06-16 Nippon Catalytic Chem Ind Amorphous silica and process for producing same
KR101208025B1 (ko) 2010-07-09 2012-12-04 주식회사 씰테크 표면이 기능화된 실리카 나노필러, 이를 포함하는 내플라즈마성 불소 고무 조성물, 성형품 및 반도체 제조 장치 밀봉용 실링재
KR101574085B1 (ko) 2012-11-22 2015-12-03 제일모직 주식회사 봉지재 및 상기 봉지재를 포함하는 전자 소자
CN113614036A (zh) 2019-03-26 2021-11-05 电化株式会社 球状二氧化硅粉末
KR102729015B1 (ko) * 2020-04-24 2024-11-13 덴카 주식회사 구상 실리카 분말
JP7584272B2 (ja) * 2020-10-21 2024-11-15 株式会社トクヤマ 樹脂組成物
JP7070646B2 (ja) * 2020-12-03 2022-05-18 堺化学工業株式会社 シリカ粒子分散体及び表面処理シリカ粒子
CN112931934B (zh) * 2021-03-24 2022-06-21 湖北中烟工业有限责任公司 一种持香降温添加剂及其制备方法和应用
KR20240037979A (ko) * 2021-07-28 2024-03-22 에이지씨 가부시키가이샤 구상 실리카 분말 및 구상 실리카 분말의 제조 방법
CN116120777A (zh) * 2023-01-03 2023-05-16 山东科翰硅源新材料有限公司 一种用于水性油墨的改性二氧化硅溶胶的制备方法
JPWO2024237111A1 (https=) * 2023-05-15 2024-11-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12580110B2 (en) 2022-03-17 2026-03-17 Kabushiki Kaisha Toshiba Superconducting coil, superconducting device, and liquid epoxy resin composition

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JP2005022915A (ja) 2005-01-27

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