JP4423443B2 - インク射出型プリンタヘッド及びその製造方法 - Google Patents
インク射出型プリンタヘッド及びその製造方法 Download PDFInfo
- Publication number
- JP4423443B2 JP4423443B2 JP2000084579A JP2000084579A JP4423443B2 JP 4423443 B2 JP4423443 B2 JP 4423443B2 JP 2000084579 A JP2000084579 A JP 2000084579A JP 2000084579 A JP2000084579 A JP 2000084579A JP 4423443 B2 JP4423443 B2 JP 4423443B2
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- ptfe
- printer head
- protrusion
- ink ejection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000000034 method Methods 0.000 claims description 21
- 230000003014 reinforcing effect Effects 0.000 claims description 17
- 229920000642 polymer Polymers 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 13
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 12
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 75
- 239000004810 polytetrafluoroethylene Substances 0.000 description 75
- 238000010894 electron beam technology Methods 0.000 description 18
- 239000010408 film Substances 0.000 description 18
- 231100000987 absorbed dose Toxicity 0.000 description 15
- 238000002425 crystallisation Methods 0.000 description 11
- 230000008025 crystallization Effects 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 230000005855 radiation Effects 0.000 description 10
- 238000004132 cross linking Methods 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000000153 supplemental effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 238000000371 solid-state nuclear magnetic resonance spectroscopy Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000005469 synchrotron radiation Effects 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005865 ionizing radiation Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004435 EPR spectroscopy Methods 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 241000135309 Processus Species 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006115 defluorination reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- URXNVXOMQQCBHS-UHFFFAOYSA-N naphthalene;sodium Chemical compound [Na].C1=CC=CC2=CC=CC=C21 URXNVXOMQQCBHS-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000084579A JP4423443B2 (ja) | 2000-03-24 | 2000-03-24 | インク射出型プリンタヘッド及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000084579A JP4423443B2 (ja) | 2000-03-24 | 2000-03-24 | インク射出型プリンタヘッド及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001270952A JP2001270952A (ja) | 2001-10-02 |
| JP2001270952A5 JP2001270952A5 (enExample) | 2007-05-10 |
| JP4423443B2 true JP4423443B2 (ja) | 2010-03-03 |
Family
ID=18601039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000084579A Expired - Fee Related JP4423443B2 (ja) | 2000-03-24 | 2000-03-24 | インク射出型プリンタヘッド及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4423443B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4567302B2 (ja) * | 2003-07-01 | 2010-10-20 | 住友重機械工業株式会社 | 微細構造体の製造方法 |
| JP6457285B2 (ja) * | 2014-03-24 | 2019-01-23 | Ntn株式会社 | 転がり軸受用保持器および転がり軸受 |
| JP7446854B2 (ja) * | 2020-03-02 | 2024-03-11 | 住友重機械工業株式会社 | インク塗布装置、インク塗布装置の制御装置、及びインク塗布方法 |
-
2000
- 2000-03-24 JP JP2000084579A patent/JP4423443B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001270952A (ja) | 2001-10-02 |
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