JP4397814B2 - 発光装置の製造方法 - Google Patents
発光装置の製造方法 Download PDFInfo
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- JP4397814B2 JP4397814B2 JP2004542811A JP2004542811A JP4397814B2 JP 4397814 B2 JP4397814 B2 JP 4397814B2 JP 2004542811 A JP2004542811 A JP 2004542811A JP 2004542811 A JP2004542811 A JP 2004542811A JP 4397814 B2 JP4397814 B2 JP 4397814B2
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- 150000002894 organic compounds Chemical class 0.000 claims description 39
- 239000011159 matrix material Substances 0.000 claims description 34
- 239000002216 antistatic agent Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 description 85
- 239000010408 film Substances 0.000 description 78
- 239000000463 material Substances 0.000 description 31
- 239000003566 sealing material Substances 0.000 description 25
- 238000005192 partition Methods 0.000 description 16
- 239000012212 insulator Substances 0.000 description 12
- 239000012467 final product Substances 0.000 description 10
- 229910045601 alloy Inorganic materials 0.000 description 9
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- 238000001704 evaporation Methods 0.000 description 9
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- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000002950 deficient Effects 0.000 description 6
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
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- 229910052710 silicon Inorganic materials 0.000 description 5
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
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- 229910017911 MgIn Inorganic materials 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical class [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
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- 229910052744 lithium Inorganic materials 0.000 description 3
- AHLBNYSZXLDEJQ-FWEHEUNISA-N orlistat Chemical compound CCCCCCCCCCC[C@H](OC(=O)[C@H](CC(C)C)NC=O)C[C@@H]1OC(=O)[C@H]1CCCCCC AHLBNYSZXLDEJQ-FWEHEUNISA-N 0.000 description 3
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- 238000004544 sputter deposition Methods 0.000 description 3
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- 239000011787 zinc oxide Substances 0.000 description 3
- STTGYIUESPWXOW-UHFFFAOYSA-N 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline Chemical compound C=12C=CC3=C(C=4C=CC=CC=4)C=C(C)N=C3C2=NC(C)=CC=1C1=CC=CC=C1 STTGYIUESPWXOW-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
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- 239000002274 desiccant Substances 0.000 description 2
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- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- IZMLNVKXKFSCDB-UHFFFAOYSA-N oxoindium;oxotin Chemical compound [In]=O.[Sn]=O IZMLNVKXKFSCDB-UHFFFAOYSA-N 0.000 description 2
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- 239000010453 quartz Substances 0.000 description 2
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- 238000007740 vapor deposition Methods 0.000 description 2
- OYQCBJZGELKKPM-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O-2].[Zn+2].[O-2].[In+3] OYQCBJZGELKKPM-UHFFFAOYSA-N 0.000 description 2
- UPSWHSOSMRAWEH-UHFFFAOYSA-N 2-n,3-n,4-n-tris(3-methylphenyl)-1-n,1-n,2-n,3-n,4-n-pentakis-phenylbenzene-1,2,3,4-tetramine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C(=C(N(C=3C=CC=CC=3)C=3C=C(C)C=CC=3)C(N(C=3C=CC=CC=3)C=3C=CC=CC=3)=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 UPSWHSOSMRAWEH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910004116 SrO 2 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
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- 229910052783 alkali metal Inorganic materials 0.000 description 1
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- 125000002843 carboxylic acid group Chemical group 0.000 description 1
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- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
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- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
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- 238000000059 patterning Methods 0.000 description 1
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- 239000000049 pigment Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000005518 polymer electrolyte Substances 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
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- 230000003068 static effect Effects 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
- G09G2330/028—Generation of voltages supplied to electrode drivers in a matrix display other than LCD
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
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- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
また、抜き取り検査を行う場合、抜き取った基板は検査後、最終的にパネル化されないため、1枚の基板における面取り数が多い場合、大幅な歩留まりの低減になる。
基板を複数のブロックに区画し、さらに各ブロックを複数の発光領域に区画して製造する発光装置の製造方法であって、
第1の場所にて、
第1の基板上に発光領域および端子部を複数形成する第1段階と、
前記発光素子を第2の基板で封止する第2段階と、
複数の端子部のうち、一部の端子部と重なる第2の基板の一部を分断により除去して、一部の端子部を露呈させる第3段階と、
前記一部の端子部のみに対して電流を流して検査する第4段階と、
第1の場所から第2の場所に搬送する第5段階と、
第2の場所にて、
第1の基板および第2の基板を分断して各発光領域を分割する第6段階と、
一つの発光領域に接続されている端子部にFPCを貼り付ける第7段階と、
を有することを特徴とする発光装置の製造方法である。
基板を複数のブロックに区画し、さらに各ブロックを複数の発光領域に区画して製造する発光装置の製造方法であって、
第1の場所にて、
第1の基板上に発光領域および端子部を複数形成する第1段階と、
前記発光素子を複数の第2の基板で封止する第2段階と、
前記第1の基板を分割する第3段階と、
複数の端子部のうち、一部の端子部と重なる第2の基板の一部を分断により除去して、一部の端子部を露呈させる第4段階と、
前記一部の端子部のみに対して電流を流して検査する第5段階と、
第1の場所から第2の場所に搬送する第6段階と、
第2の場所にて、
第1の基板および第2の基板を分断して各発光領域を分割する第7段階と、
一つの発光領域に接続されている端子部にFPCを貼り付ける第8段階と、
を有することを特徴とする発光装置の製造方法である。
図2は、実施の形態2を示す図である。
図3は、実施の形態2を示す図である。
図4は、実施の形態3を示す図である。
図5は、実施例1を示す図である。
図6は、実施例2を示す図である。
図7は、発光装置を示す図である。(実施例3)
図8は、発光装置を示す図である。(実施例3)
図9は、TFTと第1の電極との接続、隔壁形状を説明する図である。(実施例4)
図10は、電子機器の一例を示す図である。(実施例5)
図11は、電子機器の一例を示す図である。(実施例5)
図12は、モジュールを示す図である。(実施例6)
図13は、ブロック図を示す図である。(実施例6)
多面取りでパネルを作製する本発明のフローの一例を図1に示す。
このTFTを作製する途中で従来通り、抜き取り検査を行ってもよい。この抜き取り検査によって何らかのトラブルを発見した場合、トラブルに応じた処理を行えば、除去すべき不良の基板が大量に発生することを未然に防ぐことができ、最終製品の品質低下を防ぐことにも繋がる。基板上に設けられたTFT(pチャネル型TFTまたはnチャネル型TFT)は、発光するEL層に流れる電流を制御する素子であり、一つの画素には、他にもTFT(nチャネル型TFTまたはpチャネル型TFT)を一つ、または複数設ける。また、TFTからなる駆動回路も同一基板上に形成してもよい。
次いで、第1電極(陽極)上に、蒸着マスクを用いた蒸着法、またはインクジェット法によって有機化合物を含む層を選択的に形成する。有機化合物を含む層としては、高分子材料、低分子材料、無機材料、またはこれらを混合させた層、またはこれらを分散させた層、またはこれらの層を適宜組み合わせた積層とすればよい。
ここでは、アクティブマトリクス基板より小さいサイズの封止基板を複数枚用意し、アクティブマトリクス基板に貼り合わせた例を示す。
実施の形態1または実施の形態2では、パネルに帯電防止材を設け、出荷または搬送する例を示したが、ここでは、搬送または出荷の際に使用する基板のキャリアボックスに帯電防止材を設けた例を示す。
また、本実施例では、実施の形態2に示したような電極針を備えた検査装置でTFTを検査するのではなく、FPCを仮接着して電流源を備えた装置で検査する例を示す。
そして、それぞれFPC611を貼り合せることによって図6(G)に示すような異なるサイズのパネルを複数作製する。なお、断面図を図6(H)に示す。本実施例では、検査を行った8つのパネルを含め、14個のパネルを完成させることができる。検査を行ったパネルをも完成品とするため、歩留まりが向上する。
Claims (4)
- 第1の場所にて、一対の電極間に挟まれた有機化合物層で構成される発光素子がマトリクス状に配置された画素部および端子部を有する複数のパネルを、第1の基板上に形成する第1段階と、
第1の場所にて、前記画素部を第2の基板で封止する第2段階と、
第1の場所にて、前記複数のパネルのうち、一部のパネルの端子部と重なる前記第2の基板の一部を除去し、前記一部のパネルの端子部を露呈させる第3段階と、
第1の場所にて、前記一部の端子部に対して電流を流して検査する第4段階と、
第1の場所から第2の場所に基板を搬送する第5段階と、
第2の場所にて、前記複数のパネルをパネルごとに分割するように、前記第1の基板および前記第2の基板を分断する第6段階と、
第2の場所にて、前記複数のパネル各々の端子部にFPCを貼り付ける第7段階と、
を有することを特徴とする発光装置の製造方法。 - 請求項1において、
前記複数のパネルは、n×m個(n>1、かつ、m>1)のパネルがn行m列に配置されたものであることを特徴とする発光装置の製造方法。 - 請求項2において、
前記第4段階の検査は、m列目に配置されたパネルに対して行うことを特徴とする発光装置の製造方法。 - 請求項1乃至請求項3のいずれか1項において、
前記第4段階後に、前記一部のパネルの端子部に接するように帯電防止材を設けることを特徴とする発光装置の製造方法。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4397814B2 (ja) * | 2002-10-09 | 2010-01-13 | 株式会社半導体エネルギー研究所 | 発光装置の製造方法 |
KR100552975B1 (ko) * | 2003-11-22 | 2006-02-15 | 삼성에스디아이 주식회사 | 능동 매트릭스 유기전계발광표시장치 및 그의 제조방법 |
KR100554494B1 (ko) * | 2003-12-30 | 2006-03-03 | 엘지.필립스 엘시디 주식회사 | 유기전계 발광소자와 그 제조방법 |
KR101270180B1 (ko) * | 2004-01-30 | 2013-05-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 검사장치 및 검사방법과, 반도체장치 제작방법 |
US7348738B2 (en) * | 2004-09-02 | 2008-03-25 | General Electric Company | OLED area illumination source |
JP2006351382A (ja) * | 2005-06-16 | 2006-12-28 | Tohoku Pioneer Corp | 自発光パネル及びその製造方法、自発光パネル用封止部材 |
JP2007059209A (ja) * | 2005-08-24 | 2007-03-08 | Toyota Industries Corp | エレクトロルミネッセンスパネル及びその製造方法 |
EP1818860B1 (en) | 2006-02-08 | 2011-03-30 | Semiconductor Energy Laboratory Co., Ltd. | RFID device |
US20090058293A1 (en) * | 2007-08-31 | 2009-03-05 | Norihisa Maeda | Display device |
KR101016759B1 (ko) * | 2007-11-06 | 2011-02-25 | 엘지디스플레이 주식회사 | 유기발광표시장치 및 그 제조방법 |
DE102008054288A1 (de) * | 2008-11-03 | 2010-05-06 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zum Herstellen eines flexiblen Leuchtbands |
TWI616707B (zh) | 2008-11-28 | 2018-03-01 | 半導體能源研究所股份有限公司 | 液晶顯示裝置 |
KR101329456B1 (ko) * | 2009-11-06 | 2013-11-15 | 엘지디스플레이 주식회사 | 유기전계발광소자 및 그 제조방법 |
JP2012043689A (ja) * | 2010-08-20 | 2012-03-01 | Toshiba Tec Corp | 有機el装置の製造方法 |
CN102879926B (zh) | 2012-09-19 | 2014-12-10 | 深圳市华星光电技术有限公司 | 实现两种显示面板共用治具的排版结构及其方法 |
CN105379422B (zh) * | 2013-07-16 | 2017-05-31 | 夏普株式会社 | 柔性显示装置的制造方法和柔性显示装置 |
KR102122528B1 (ko) * | 2013-08-06 | 2020-06-12 | 엘지디스플레이 주식회사 | 플렉서블 유기발광다이오드 표시장치 및 그 제조방법 |
KR102126276B1 (ko) * | 2013-08-30 | 2020-06-25 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
CN104090677A (zh) * | 2014-06-20 | 2014-10-08 | 京东方科技集团股份有限公司 | 一种内嵌式触摸屏和显示装置 |
JP6999434B2 (ja) * | 2018-01-29 | 2022-01-18 | シャープ株式会社 | 表示装置、表示システム、および表示装置の製造方法 |
KR102569929B1 (ko) * | 2018-07-02 | 2023-08-24 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11295755A (ja) | 1998-04-09 | 1999-10-29 | Seiko Epson Corp | 配線基板の検査方法及び液晶装置の製造方法 |
US6839108B1 (en) * | 1998-05-16 | 2005-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and method of manufacturing the same |
JP2000002872A (ja) * | 1998-06-16 | 2000-01-07 | Semiconductor Energy Lab Co Ltd | 液晶表示装置およびその作製方法 |
JP3653200B2 (ja) * | 1998-10-02 | 2005-05-25 | シャープ株式会社 | 表示装置の製造方法 |
US6489952B1 (en) * | 1998-11-17 | 2002-12-03 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix type semiconductor display device |
TW459275B (en) * | 1999-07-06 | 2001-10-11 | Semiconductor Energy Lab | Semiconductor device and method of fabricating the same |
JP2001100167A (ja) * | 1999-09-29 | 2001-04-13 | Seiko Epson Corp | 液晶表示装置の製造方法 |
TW494447B (en) * | 2000-02-01 | 2002-07-11 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
US6828587B2 (en) * | 2000-06-19 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US6734924B2 (en) * | 2000-09-08 | 2004-05-11 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
US6924594B2 (en) * | 2000-10-03 | 2005-08-02 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
SG143946A1 (en) * | 2001-02-19 | 2008-07-29 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
JP2002277860A (ja) * | 2001-03-15 | 2002-09-25 | Sharp Corp | 液晶パネルおよびその製造方法 |
TW548860B (en) * | 2001-06-20 | 2003-08-21 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
JP2003017259A (ja) | 2001-06-29 | 2003-01-17 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示パネルの製造方法 |
JP4323115B2 (ja) * | 2001-07-06 | 2009-09-02 | シャープ株式会社 | 機能性パネルの製造方法 |
JP2003258210A (ja) * | 2001-12-27 | 2003-09-12 | Canon Inc | 表示装置及びその製造方法 |
JP2003248208A (ja) * | 2002-02-22 | 2003-09-05 | Fujitsu Display Technologies Corp | 液晶表示パネルの製造方法 |
JP2003271067A (ja) * | 2002-03-18 | 2003-09-25 | Seiko Epson Corp | 電気光学装置の製造方法、電気光学装置、および電子機器 |
JP4397814B2 (ja) * | 2002-10-09 | 2010-01-13 | 株式会社半導体エネルギー研究所 | 発光装置の製造方法 |
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