JP2017219848A - 表示装置及びその製造方法 - Google Patents
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- 238000000034 method Methods 0.000 title description 15
- 239000012790 adhesive layer Substances 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 239000004642 Polyimide Substances 0.000 claims abstract description 18
- 229920001721 polyimide Polymers 0.000 claims abstract description 18
- 230000003746 surface roughness Effects 0.000 claims description 7
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- 238000005452 bending Methods 0.000 abstract description 14
- 239000010410 layer Substances 0.000 description 62
- 230000001678 irradiating effect Effects 0.000 description 16
- 238000007789 sealing Methods 0.000 description 14
- -1 polyethylene terephthalate Polymers 0.000 description 12
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- 238000002425 crystallisation Methods 0.000 description 6
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- 229920002223 polystyrene Polymers 0.000 description 6
- 101150010973 GRA1 gene Proteins 0.000 description 5
- 101100069381 Toxoplasma gondii GRA4 gene Proteins 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
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- 230000004048 modification Effects 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 101150073248 GRA2 gene Proteins 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 101100122821 Toxoplasma gondii GRA3 gene Proteins 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
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- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- TYHJXGDMRRJCRY-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) tin(4+) Chemical compound [O-2].[Zn+2].[Sn+4].[In+3] TYHJXGDMRRJCRY-UHFFFAOYSA-N 0.000 description 1
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- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
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- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y02E10/549—Organic PV cells
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Abstract
Description
110:ベース基板
120:駆動素子層
130:有機発光素子層
140:封止層
200:第1フィルム
300:第2フィルム
400:粘着層
Claims (10)
- 互いに対向する下面と上面が定義された表示パネルと、
前記表示パネルの前記下面の下部に配置され、フィルム溝が配置された第1フィルムと、
前記表示パネルの前記上面に配置された第2フィルムと、
前記表示パネルの前記下面と前記第1フィルムの間に配置され、前記フィルム溝と重畳する粘着溝が配置された粘着層を含み、
前記表示パネルは、前記下面に配置されたポリイミドを含むベース基板を含み、
前記フィルム溝及び前記粘着溝により露出された前記ベース基板の第1部分と、前記第1フィルム及び前記粘着層と重畳する前記ベース基板の第2部分と、は互いに5%以内の結晶化度の違いを有する、表示装置。 - 前記第1部分は、前記第2部分に対してより低い結晶化度を有する請求項1に記載の表示装置。
- 前記ベース基板の前記第1部分は前記粘着溝の内面に連結され、
前記第1部分は、前記フィルム溝及び前記粘着溝により露出されて前記第1部分によって前記第2部分から離隔された第3部分に対して5%以内でより小さい結晶化度を有する請求項1に記載の表示装置。 - 前記第2部分と前記第3部分とは、互いに同じ結晶化度を有する請求項3に記載の表示装置。
- 前記第1部分の下面の表面粗さは、前記第3部分の下面の表面粗さより小さい請求項3に記載の表示装置。
- 前記フィルム溝を提供する前記第1フィルムの内面及び前記粘着溝を提供する前記粘着層の内面各々と前記ベース基板の前記第2部分がなす角度は鋭角である請求項1に記載の表示装置。
- 前記フィルム溝に接する前記第1フィルムの下面に提供されたバリ(Burr)をさらに含む請求項1に記載の表示装置。
- 前記表示パネルに映像を表示する表示領域と前記表示領域に隣接した非表示領域が定義され、前記フィルム溝及び前記粘着溝は前記非表示領域内に提供された請求項1に記載の表示装置。
- 前記表示パネルに映像を表示する表示領域と、前記表示領域に隣接した非表示領域が定義され、平面上で前記フィルム溝及び前記粘着溝は、前記表示領域を横切るように配置された請求項1に記載の表示装置。
- 互いに対向する下面と上面を有し、第1領域が定められた表示パネルと、
前記表示パネルの前記下面の下部に配置され、前記第1領域と重畳する第1溝が提供された第1フィルムと、
前記表示パネルの前記上面上に配置された第2フィルムと、
前記表示パネルの前記下面と前記第1フィルムの間に配置され、前記第1領域と重畳する第2溝が提供された粘着層を含み、
前記表示パネルは前記下面を提供してポリイミドを含むベース基板を含み、
前記第1領域内で前記第1フィルム及び前記粘着層に前記ベース基板を露出する複数の溝が提供され、
前記第1領域内で前記溝により前記第1フィルムの第1一部及び前記粘着層の第1部分は前記第1フィルムの第2部分と、前記粘着層の第2部分とに分離される表示装置。
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Application Number | Priority Date | Filing Date | Title |
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KR10-2016-0072734 | 2016-06-10 | ||
KR1020160072734A KR102597464B1 (ko) | 2016-06-10 | 2016-06-10 | 표시 장치 및 이의 제조 방법 |
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JP2017219848A true JP2017219848A (ja) | 2017-12-14 |
JP6937617B2 JP6937617B2 (ja) | 2021-09-22 |
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US (4) | US10056568B2 (ja) |
EP (1) | EP3255694B1 (ja) |
JP (1) | JP6937617B2 (ja) |
KR (1) | KR102597464B1 (ja) |
CN (1) | CN107492556B (ja) |
TW (2) | TWI749017B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2021534271A (ja) * | 2018-08-07 | 2021-12-09 | デュポン エレクトロニクス インコーポレイテッド | 電子デバイスで使用するためのポリマー |
JP2023536175A (ja) * | 2020-08-04 | 2023-08-23 | エルジー イノテック カンパニー リミテッド | 弾性部材及びこれを含むディスプレイ装置{elasticity member and display device having the same} |
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KR102597464B1 (ko) * | 2016-06-10 | 2023-11-06 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
KR102490923B1 (ko) * | 2017-09-28 | 2023-01-26 | 삼성디스플레이 주식회사 | 표시 패널 및 이의 제조 방법 |
US11081660B2 (en) * | 2018-05-03 | 2021-08-03 | Samsung Display Co., Ltd. | Display device and support film structure for display device |
CN110497091A (zh) * | 2018-05-18 | 2019-11-26 | 大族激光科技产业集团股份有限公司 | 一种柔性显示屏的加工方法及装置 |
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EP3255694A1 (en) | 2017-12-13 |
CN107492556B (zh) | 2023-06-06 |
CN107492556A (zh) | 2017-12-19 |
TWI749017B (zh) | 2021-12-11 |
TWI825509B (zh) | 2023-12-11 |
EP3255694B1 (en) | 2022-04-20 |
US20180358567A1 (en) | 2018-12-13 |
US11711964B2 (en) | 2023-07-25 |
KR20170140489A (ko) | 2017-12-21 |
US10056568B2 (en) | 2018-08-21 |
US20200144523A1 (en) | 2020-05-07 |
US10553802B2 (en) | 2020-02-04 |
TW201800810A (zh) | 2018-01-01 |
US20170358762A1 (en) | 2017-12-14 |
US20210296601A1 (en) | 2021-09-23 |
KR102597464B1 (ko) | 2023-11-06 |
JP6937617B2 (ja) | 2021-09-22 |
TW202219601A (zh) | 2022-05-16 |
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