JP6937617B2 - 表示装置 - Google Patents
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- JP6937617B2 JP6937617B2 JP2017114738A JP2017114738A JP6937617B2 JP 6937617 B2 JP6937617 B2 JP 6937617B2 JP 2017114738 A JP2017114738 A JP 2017114738A JP 2017114738 A JP2017114738 A JP 2017114738A JP 6937617 B2 JP6937617 B2 JP 6937617B2
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- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/50—OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/821—Patterning of a layer by embossing, e.g. stamping to form trenches in an insulating layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
- H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electroluminescent Light Sources (AREA)
Description
110:ベース基板
120:駆動素子層
130:有機発光素子層
140:封止層
200:第1フィルム
300:第2フィルム
400:粘着層
Claims (6)
- 互いに対向する下面と上面が定義された表示パネルと、
前記表示パネルの前記下面の下部に配置され、フィルム溝が配置された第1フィルムと、
前記表示パネルの前記上面に配置された第2フィルムと、
前記表示パネルの前記下面と前記第1フィルムの間に配置され、前記フィルム溝と重畳する粘着溝が配置された粘着層を含み、
前記表示パネルは、前記下面に配置されたポリイミドを含むベース基板を含み、
前記フィルム溝及び前記粘着溝により露出された前記ベース基板の第1部分と、前記第1フィルム及び前記粘着層と重畳する前記ベース基板の第2部分と、前記フィルム溝及び前記粘着溝により露出されて前記第1部分によって前記第2部分から離隔された第3部分と、は互いに5%以内の結晶化度の違いを有し、
前記第1部分は、前記第2部分に対してより低い結晶化度を有し、
前記第2部分と前記第3部分とは、互いに同じ結晶化度を有する、表示装置。 - 前記第1部分の下面の表面粗さは、前記第3部分の下面の表面粗さより小さい請求項1に記載の表示装置。
- 前記フィルム溝を提供する前記第1フィルムの内面及び前記粘着溝を提供する前記粘着層の内面各々と前記ベース基板の前記第2部分がなす角度は鋭角である請求項1に記載の表示装置。
- 前記フィルム溝に接する前記第1フィルムの下面に提供されたバリ(Burr)をさらに含む請求項1に記載の表示装置。
- 前記表示パネルに映像を表示する表示領域と前記表示領域に隣接した非表示領域が定義され、前記フィルム溝及び前記粘着溝は前記非表示領域内に提供された請求項1に記載の表示装置。
- 前記表示パネルに映像を表示する表示領域と、前記表示領域に隣接した非表示領域が定義され、平面上で前記フィルム溝及び前記粘着溝は、前記表示領域を横切るように配置された請求項1に記載の表示装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020160072734A KR102597464B1 (ko) | 2016-06-10 | 2016-06-10 | 표시 장치 및 이의 제조 방법 |
KR10-2016-0072734 | 2016-06-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017219848A JP2017219848A (ja) | 2017-12-14 |
JP6937617B2 true JP6937617B2 (ja) | 2021-09-22 |
Family
ID=58714904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017114738A Active JP6937617B2 (ja) | 2016-06-10 | 2017-06-09 | 表示装置 |
Country Status (6)
Country | Link |
---|---|
US (4) | US10056568B2 (ja) |
EP (1) | EP3255694B1 (ja) |
JP (1) | JP6937617B2 (ja) |
KR (1) | KR102597464B1 (ja) |
CN (1) | CN107492556B (ja) |
TW (2) | TWI825509B (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102597464B1 (ko) * | 2016-06-10 | 2023-11-06 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
KR102490923B1 (ko) * | 2017-09-28 | 2023-01-26 | 삼성디스플레이 주식회사 | 표시 패널 및 이의 제조 방법 |
US11081660B2 (en) * | 2018-05-03 | 2021-08-03 | Samsung Display Co., Ltd. | Display device and support film structure for display device |
CN110497091A (zh) * | 2018-05-18 | 2019-11-26 | 大族激光科技产业集团股份有限公司 | 一种柔性显示屏的加工方法及装置 |
KR102580292B1 (ko) | 2018-05-29 | 2023-09-19 | 삼성디스플레이 주식회사 | 표시 장치, 그 제조 방법 및 표시 장치 제조를 위한 레이저 가공 장치 |
KR102562373B1 (ko) | 2018-05-31 | 2023-08-02 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
CN110570754B (zh) * | 2018-06-05 | 2022-01-04 | 上海和辉光电股份有限公司 | 柔性显示面板的制作方法以及柔性显示面板 |
CN108890123B (zh) * | 2018-06-25 | 2020-06-26 | 武汉华星光电半导体显示技术有限公司 | 一种集成激光剥离和激光切割的设备系统及其操作方法 |
JP7444851B2 (ja) * | 2018-08-07 | 2024-03-06 | デュポン エレクトロニクス インコーポレイテッド | 電子デバイスで使用するためのポリマー |
KR102670077B1 (ko) | 2018-10-05 | 2024-05-28 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
KR102471275B1 (ko) * | 2019-01-24 | 2022-11-28 | 삼성전자주식회사 | 칩 온 필름(cof) 및 이의 제조방법 |
KR20210011540A (ko) * | 2019-07-22 | 2021-02-02 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
US10762331B1 (en) * | 2019-10-11 | 2020-09-01 | Zebra Technologies Corporation | Three-dimensional (3D) depth and two-dimensional (2D) imaging systems and methods for automatic container door status recognition |
KR20210044342A (ko) | 2019-10-14 | 2021-04-23 | 삼성디스플레이 주식회사 | 회로기판의 제조 방법 및 이를 포함한 표시장치 |
KR20210116764A (ko) | 2020-03-13 | 2021-09-28 | 삼성디스플레이 주식회사 | 디스플레이 장치의 제조방법 |
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KR102597464B1 (ko) | 2023-11-06 |
CN107492556A (zh) | 2017-12-19 |
EP3255694A1 (en) | 2017-12-13 |
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US20170358762A1 (en) | 2017-12-14 |
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JP2017219848A (ja) | 2017-12-14 |
TW201800810A (zh) | 2018-01-01 |
TW202219601A (zh) | 2022-05-16 |
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US20200144523A1 (en) | 2020-05-07 |
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