JP4397326B2 - ボンディング装置 - Google Patents

ボンディング装置 Download PDF

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Publication number
JP4397326B2
JP4397326B2 JP2004377541A JP2004377541A JP4397326B2 JP 4397326 B2 JP4397326 B2 JP 4397326B2 JP 2004377541 A JP2004377541 A JP 2004377541A JP 2004377541 A JP2004377541 A JP 2004377541A JP 4397326 B2 JP4397326 B2 JP 4397326B2
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Japan
Prior art keywords
circuit
capacitance
wire
bonding
target device
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Expired - Lifetime
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JP2004377541A
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English (en)
Japanese (ja)
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JP2006186087A (ja
JP2006186087A5 (enExample
Inventor
敏理 宮原
湧 杜
洋 川本
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Shinkawa Ltd
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Shinkawa Ltd
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Priority to JP2004377541A priority Critical patent/JP4397326B2/ja
Priority to TW094134911A priority patent/TW200633094A/zh
Priority to KR1020050105873A priority patent/KR100730046B1/ko
Priority to US11/317,276 priority patent/US7842897B2/en
Publication of JP2006186087A publication Critical patent/JP2006186087A/ja
Publication of JP2006186087A5 publication Critical patent/JP2006186087A5/ja
Application granted granted Critical
Publication of JP4397326B2 publication Critical patent/JP4397326B2/ja
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2004377541A 2004-12-27 2004-12-27 ボンディング装置 Expired - Lifetime JP4397326B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004377541A JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置
TW094134911A TW200633094A (en) 2004-12-27 2005-10-06 Bonding apparatus
KR1020050105873A KR100730046B1 (ko) 2004-12-27 2005-11-07 본딩 장치
US11/317,276 US7842897B2 (en) 2004-12-27 2005-12-23 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004377541A JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置

Publications (3)

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JP2006186087A JP2006186087A (ja) 2006-07-13
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KR101672510B1 (ko) * 2012-11-16 2016-11-03 가부시키가이샤 신가와 와이어 본딩 장치 및 와이어 본딩 방법
TWI562252B (en) * 2014-02-17 2016-12-11 Shinkawa Kk Detecting discharging device, wire bonding device and detecting discharging method
TWI585927B (zh) * 2014-02-21 2017-06-01 新川股份有限公司 半導體裝置的製造方法、半導體裝置以及打線裝置
CN109155260B (zh) * 2016-03-25 2021-10-29 株式会社新川 引线接合装置、其电路以及半导体装置的制造方法
JP7122740B2 (ja) * 2018-03-29 2022-08-22 株式会社新川 接続状態判定装置及び接続状態判定方法
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US20060186839A1 (en) 2006-08-24

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