JP2006186087A5 - - Google Patents

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Publication number
JP2006186087A5
JP2006186087A5 JP2004377541A JP2004377541A JP2006186087A5 JP 2006186087 A5 JP2006186087 A5 JP 2006186087A5 JP 2004377541 A JP2004377541 A JP 2004377541A JP 2004377541 A JP2004377541 A JP 2004377541A JP 2006186087 A5 JP2006186087 A5 JP 2006186087A5
Authority
JP
Japan
Prior art keywords
bonding apparatus
capacitance
target device
wire
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004377541A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006186087A (ja
JP4397326B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004377541A priority Critical patent/JP4397326B2/ja
Priority claimed from JP2004377541A external-priority patent/JP4397326B2/ja
Priority to TW094134911A priority patent/TW200633094A/zh
Priority to KR1020050105873A priority patent/KR100730046B1/ko
Priority to US11/317,276 priority patent/US7842897B2/en
Publication of JP2006186087A publication Critical patent/JP2006186087A/ja
Publication of JP2006186087A5 publication Critical patent/JP2006186087A5/ja
Application granted granted Critical
Publication of JP4397326B2 publication Critical patent/JP4397326B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004377541A 2004-12-27 2004-12-27 ボンディング装置 Expired - Lifetime JP4397326B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004377541A JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置
TW094134911A TW200633094A (en) 2004-12-27 2005-10-06 Bonding apparatus
KR1020050105873A KR100730046B1 (ko) 2004-12-27 2005-11-07 본딩 장치
US11/317,276 US7842897B2 (en) 2004-12-27 2005-12-23 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004377541A JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置

Publications (3)

Publication Number Publication Date
JP2006186087A JP2006186087A (ja) 2006-07-13
JP2006186087A5 true JP2006186087A5 (enExample) 2007-04-05
JP4397326B2 JP4397326B2 (ja) 2010-01-13

Family

ID=36738984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004377541A Expired - Lifetime JP4397326B2 (ja) 2004-12-27 2004-12-27 ボンディング装置

Country Status (4)

Country Link
US (1) US7842897B2 (enExample)
JP (1) JP4397326B2 (enExample)
KR (1) KR100730046B1 (enExample)
TW (1) TW200633094A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810508B1 (ko) * 2007-01-05 2008-03-07 삼성전자주식회사 시스템 에어컨 및 그 제어방법
US8919632B2 (en) * 2012-11-09 2014-12-30 Asm Technology Singapore Pte. Ltd. Method of detecting wire bonding failures
JP5827758B2 (ja) * 2012-11-16 2015-12-02 株式会社新川 ワイヤボンディング装置及びワイヤボンディング方法
TWI562252B (en) * 2014-02-17 2016-12-11 Shinkawa Kk Detecting discharging device, wire bonding device and detecting discharging method
TWI585927B (zh) * 2014-02-21 2017-06-01 新川股份有限公司 半導體裝置的製造方法、半導體裝置以及打線裝置
TWI639202B (zh) * 2016-03-25 2018-10-21 日商新川股份有限公司 打線裝置、打線裝置用電路及半導體裝置之製造方法
JP7122740B2 (ja) * 2018-03-29 2022-08-22 株式会社新川 接続状態判定装置及び接続状態判定方法
WO2022249262A1 (ja) * 2021-05-25 2022-12-01 株式会社新川 ワイヤボンディングシステム、検査装置、ワイヤボンディング方法、および、プログラム
US20250113441A1 (en) * 2023-09-29 2025-04-03 Biosense Webster (Israel) Ltd. System and method to control height between a joining tool and a connection pad
US20250170664A1 (en) * 2023-11-28 2025-05-29 Biosense Webster (Israel) Ltd. Automated control of an electrical connection joining process

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3283577A (en) * 1964-06-29 1966-11-08 Honeywell Inc Divided capacitance probe level gauge
US5037023A (en) * 1988-11-28 1991-08-06 Hitachi, Ltd. Method and apparatus for wire bonding
JP3041812B2 (ja) * 1993-09-21 2000-05-15 株式会社新川 ワイヤボンデイング装置
KR100193903B1 (ko) * 1995-12-30 1999-06-15 윤종용 본딩 와이어의 단선 불량을 감지할 수 있는 회로 기판 및 와이어 본딩 장치
JPH09213752A (ja) 1996-01-31 1997-08-15 Kaijo Corp ワイヤボンディング装置における不着検出回路
JP3025648B2 (ja) * 1996-08-30 2000-03-27 株式会社九州エレクトロニクスシステム 半導体のボンディング不良検出装置
JPH11176868A (ja) * 1997-12-16 1999-07-02 Kaijo Corp ワイヤボンディング装置
KR100275377B1 (en) * 1997-12-24 2001-01-15 Samsung Techwin Co Ltd Apparatus and method for detecting wire bonding
KR20020068858A (ko) * 2001-02-23 2002-08-28 삼성전자 주식회사 하면 접지부를 포함하는 비지에이용 비금속 리드 프레임
US6750734B2 (en) * 2002-05-29 2004-06-15 Ukom, Inc. Methods and apparatus for tuning an LC filter

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