JP4390368B2 - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP4390368B2
JP4390368B2 JP2000171955A JP2000171955A JP4390368B2 JP 4390368 B2 JP4390368 B2 JP 4390368B2 JP 2000171955 A JP2000171955 A JP 2000171955A JP 2000171955 A JP2000171955 A JP 2000171955A JP 4390368 B2 JP4390368 B2 JP 4390368B2
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Japan
Prior art keywords
hole
core
wiring
resin
layer
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Expired - Fee Related
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JP2000171955A
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English (en)
Japanese (ja)
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JP2001352166A5 (enExample
JP2001352166A (ja
Inventor
正行 佐々木
正司 小平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2000171955A priority Critical patent/JP4390368B2/ja
Publication of JP2001352166A publication Critical patent/JP2001352166A/ja
Publication of JP2001352166A5 publication Critical patent/JP2001352166A5/ja
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Publication of JP4390368B2 publication Critical patent/JP4390368B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2000171955A 2000-06-08 2000-06-08 配線基板の製造方法 Expired - Fee Related JP4390368B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000171955A JP4390368B2 (ja) 2000-06-08 2000-06-08 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000171955A JP4390368B2 (ja) 2000-06-08 2000-06-08 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2001352166A JP2001352166A (ja) 2001-12-21
JP2001352166A5 JP2001352166A5 (enExample) 2007-03-15
JP4390368B2 true JP4390368B2 (ja) 2009-12-24

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ID=18674436

Family Applications (1)

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JP2000171955A Expired - Fee Related JP4390368B2 (ja) 2000-06-08 2000-06-08 配線基板の製造方法

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JP (1) JP4390368B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635331B2 (ja) * 2000-12-08 2011-02-23 イビデン株式会社 プリント配線板
JP3495727B2 (ja) 2001-11-07 2004-02-09 新光電気工業株式会社 半導体パッケージおよびその製造方法
US6770822B2 (en) * 2002-02-22 2004-08-03 Bridgewave Communications, Inc. High frequency device packages and methods
JP4551135B2 (ja) * 2004-06-14 2010-09-22 新光電気工業株式会社 配線基板の製造方法
DE102005002707B4 (de) * 2005-01-19 2007-07-26 Infineon Technologies Ag Verfahren zur Herstellung elektrischer Verbindungen in einem Halbleiterbauteil mittels koaxialer Mikroverbindungselemente
JP2007027451A (ja) 2005-07-19 2007-02-01 Shinko Electric Ind Co Ltd 回路基板及びその製造方法
JP5178277B2 (ja) * 2008-03-27 2013-04-10 京セラ株式会社 セラミック基板およびセラミック基板の製造方法
US8273995B2 (en) * 2008-06-27 2012-09-25 Qualcomm Incorporated Concentric vias in electronic substrate
KR101167427B1 (ko) * 2010-09-29 2012-07-19 삼성전기주식회사 양극산화 방열기판 및 그 제조방법
US9123738B1 (en) * 2014-05-16 2015-09-01 Xilinx, Inc. Transmission line via structure
JP6922177B2 (ja) * 2016-09-20 2021-08-18 日本電気株式会社 配線構造体の積層造形工法における製造方法
KR20220146907A (ko) 2021-04-26 2022-11-02 삼성전기주식회사 인쇄회로기판
CN115484729A (zh) * 2021-06-16 2022-12-16 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法

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Publication number Publication date
JP2001352166A (ja) 2001-12-21

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