JP4388717B2 - Ｃｖｄ成膜装置及びｃｖｄ成膜方法 - Google Patents
Ｃｖｄ成膜装置及びｃｖｄ成膜方法 Download PDFInfo
- Publication number
- JP4388717B2 JP4388717B2 JP2001194386A JP2001194386A JP4388717B2 JP 4388717 B2 JP4388717 B2 JP 4388717B2 JP 2001194386 A JP2001194386 A JP 2001194386A JP 2001194386 A JP2001194386 A JP 2001194386A JP 4388717 B2 JP4388717 B2 JP 4388717B2
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chamber
- fine particles
- film forming
- internal electrode
- cvd film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000010408 film Substances 0.000 claims description 95
- 239000010419 fine particle Substances 0.000 claims description 60
- 239000010409 thin film Substances 0.000 claims description 37
- 230000015572 biosynthetic process Effects 0.000 claims description 22
- 239000002994 raw material Substances 0.000 claims description 16
- 230000008021 deposition Effects 0.000 claims description 9
- 230000005484 gravity Effects 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000005229 chemical vapour deposition Methods 0.000 description 32
- 239000000843 powder Substances 0.000 description 25
- 239000004215 Carbon black (E152) Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 229930195733 hydrocarbon Natural products 0.000 description 8
- 150000002430 hydrocarbons Chemical class 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 5
- 239000011553 magnetic fluid Substances 0.000 description 5
- 239000003595 mist Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021385 hard carbon Inorganic materials 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910003481 amorphous carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
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- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001194386A JP4388717B2 (ja) | 2001-06-27 | 2001-06-27 | Ｃｖｄ成膜装置及びｃｖｄ成膜方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001194386A JP4388717B2 (ja) | 2001-06-27 | 2001-06-27 | Ｃｖｄ成膜装置及びｃｖｄ成膜方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009180938A Division JP5277442B2 (ja) | 2009-08-03 | 2009-08-03 | 微粒子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003013229A JP2003013229A (ja) | 2003-01-15 |
| JP2003013229A5 JP2003013229A5 (enExample) | 2008-03-21 |
| JP4388717B2 true JP4388717B2 (ja) | 2009-12-24 |
Family
ID=19032528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001194386A Expired - Fee Related JP4388717B2 (ja) | 2001-06-27 | 2001-06-27 | Ｃｖｄ成膜装置及びｃｖｄ成膜方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4388717B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1696984A (zh) * | 2004-05-14 | 2005-11-16 | 魏宗兴 | 新信用卡的低成本防盗刷方法 |
| JP2006016661A (ja) * | 2004-07-01 | 2006-01-19 | Utec:Kk | 被覆微粒子、ｃｖｄ装置及びｃｖｄ成膜方法、マイクロカプセル及びその製造方法 |
| JP2006022176A (ja) * | 2004-07-07 | 2006-01-26 | Takayuki Abe | 被覆微粒子 |
| JP4750436B2 (ja) * | 2005-03-16 | 2011-08-17 | 孝之 阿部 | 表面処理物の製造方法、表面処理方法及び表面処理装置 |
| WO2006115242A1 (ja) * | 2005-04-25 | 2006-11-02 | Youtec Co., Ltd. | 表面処理微粒子、表面処理装置及び微粒子の表面処理方法 |
| CN101939466B (zh) * | 2008-02-06 | 2012-07-18 | 友技科株式会社 | 等离子体cvd装置、等离子体cvd方法 |
| JP6496898B2 (ja) * | 2014-07-02 | 2019-04-10 | アドバンストマテリアルテクノロジーズ株式会社 | 電子部品の製造方法 |
| JP6543982B2 (ja) * | 2015-03-20 | 2019-07-17 | 株式会社豊田中央研究所 | 成膜装置および成膜方法 |
| WO2017195449A1 (ja) * | 2016-05-12 | 2017-11-16 | 株式会社ユーテック | 潤滑剤及びその製造方法、潤滑剤用品、潤滑剤エアゾール、潤滑剤付き部材及び潤滑剤付き可動部材の製造方法 |
| ES3032418T3 (en) | 2016-07-15 | 2025-07-18 | Oned Mat Inc | Manufacturing apparatus and method for making silicon nanowires on carbon based powders for use in batteries |
| KR102194067B1 (ko) * | 2018-01-25 | 2020-12-22 | 주식회사 모만 | 분말 또는 섬유 균일 코팅장치 |
| WO2021167067A1 (ja) * | 2020-02-21 | 2021-08-26 | 株式会社ユーパテンター | 複合装置及び被覆微粒子の製造方法 |
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2001
- 2001-06-27 JP JP2001194386A patent/JP4388717B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003013229A (ja) | 2003-01-15 |
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