JP4385504B2 - 窒化物半導体基板及びその製造方法 - Google Patents
窒化物半導体基板及びその製造方法 Download PDFInfo
- Publication number
- JP4385504B2 JP4385504B2 JP2000212926A JP2000212926A JP4385504B2 JP 4385504 B2 JP4385504 B2 JP 4385504B2 JP 2000212926 A JP2000212926 A JP 2000212926A JP 2000212926 A JP2000212926 A JP 2000212926A JP 4385504 B2 JP4385504 B2 JP 4385504B2
- Authority
- JP
- Japan
- Prior art keywords
- nitride semiconductor
- protective film
- substrate
- semiconductor layer
- growth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
Landscapes
- Chemical Vapour Deposition (AREA)
- Led Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000212926A JP4385504B2 (ja) | 2000-07-13 | 2000-07-13 | 窒化物半導体基板及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000212926A JP4385504B2 (ja) | 2000-07-13 | 2000-07-13 | 窒化物半導体基板及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002033282A JP2002033282A (ja) | 2002-01-31 |
JP2002033282A5 JP2002033282A5 (enrdf_load_stackoverflow) | 2007-08-30 |
JP4385504B2 true JP4385504B2 (ja) | 2009-12-16 |
Family
ID=18708764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000212926A Expired - Fee Related JP4385504B2 (ja) | 2000-07-13 | 2000-07-13 | 窒化物半導体基板及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4385504B2 (enrdf_load_stackoverflow) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1625612B1 (en) * | 2003-05-21 | 2015-10-21 | Saint-Gobain Cristaux & Détecteurs | Manufacturing gallium nitride substrates by lateral overgrowth through masks |
JP2006005044A (ja) * | 2004-06-16 | 2006-01-05 | Rohm Co Ltd | 窒化物系半導体発光素子及びその製造方法 |
CN100444319C (zh) * | 2004-09-06 | 2008-12-17 | 璨圆光电股份有限公司 | 氮化物外延层制作方法及其结构 |
JP4140606B2 (ja) | 2005-01-11 | 2008-08-27 | ソニー株式会社 | GaN系半導体発光素子の製造方法 |
JP4857616B2 (ja) * | 2005-06-17 | 2012-01-18 | ソニー株式会社 | GaN系化合物半導体層の形成方法、及び、GaN系半導体発光素子の製造方法 |
KR20090008321A (ko) * | 2006-04-28 | 2009-01-21 | 스미토모덴키고교가부시키가이샤 | 질화갈륨 결정을 제작하는 방법 및 질화갈륨 웨이퍼 |
JP4964026B2 (ja) * | 2007-05-28 | 2012-06-27 | 三洋電機株式会社 | 窒化物系半導体レーザ素子の作製方法 |
JP4964027B2 (ja) * | 2007-05-28 | 2012-06-27 | 三洋電機株式会社 | 窒化物系半導体レーザ素子の作製方法 |
CN116344698B (zh) * | 2023-05-22 | 2023-08-29 | 江西兆驰半导体有限公司 | 图形化衬底GaN基LED外延片及其制备方法 |
-
2000
- 2000-07-13 JP JP2000212926A patent/JP4385504B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2002033282A (ja) | 2002-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5146481B2 (ja) | ナイトライド系iii−v族化合物半導体装置、及び半導体装置の製造方法 | |
JP4032538B2 (ja) | 半導体薄膜および半導体素子の製造方法 | |
JP3587081B2 (ja) | Iii族窒化物半導体の製造方法及びiii族窒化物半導体発光素子 | |
JP4288743B2 (ja) | 窒化物半導体の成長方法 | |
JP4947867B2 (ja) | 窒化ガリウム系半導体構造及び該半導体構造を製造する方法 | |
US20010053618A1 (en) | Nitride semiconductor substrate and method for manufacturing the same, and nitride semiconductor device using nitride semiconductor substrate | |
JP3491538B2 (ja) | 窒化物半導体の成長方法及び窒化物半導体素子 | |
JP3620269B2 (ja) | GaN系半導体素子の製造方法 | |
JP4304750B2 (ja) | 窒化物半導体の成長方法及び窒化物半導体素子 | |
US7163876B2 (en) | Method for manufacturing group-III nitride compound semiconductor, and group-III nitride compound semiconductor device | |
JP2001313259A (ja) | Iii族窒化物系化合物半導体基板の製造方法及び半導体素子 | |
JP4529846B2 (ja) | Iii−v族窒化物系半導体基板及びその製造方法 | |
JP2001196697A (ja) | 半導体素子用基板およびその製造方法およびその半導体素子用基板を用いた半導体素子 | |
JP2002008985A (ja) | 窒化物半導体の製造方法及び窒化物半導体基板 | |
JP4406999B2 (ja) | Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子 | |
JP4322187B2 (ja) | 窒化物半導体発光素子 | |
JP4385504B2 (ja) | 窒化物半導体基板及びその製造方法 | |
JP2005503037A (ja) | Iii−v−ニトリド半導体をベースとする半導体層の製造法 | |
JP3438675B2 (ja) | 窒化物半導体の成長方法 | |
JP3555657B2 (ja) | 低欠陥窒化物半導体基板及びその製造方法 | |
JP2002100579A (ja) | 窒化物半導体基板及びその製造方法 | |
JP4232326B2 (ja) | 低欠陥窒化物半導体の成長方法 | |
JP3823781B2 (ja) | 窒化物半導体基板およびその製造方法 | |
JP3826581B2 (ja) | 半導体基板および半導体基板の製造方法 | |
JP2004304203A (ja) | 窒化物半導体基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20050823 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20050823 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20051014 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070713 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070713 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20070713 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090828 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090908 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090921 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121009 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121009 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121009 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131009 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |