JP4384899B2 - デバイスチップ位置測定方法 - Google Patents
デバイスチップ位置測定方法 Download PDFInfo
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- JP4384899B2 JP4384899B2 JP2003407058A JP2003407058A JP4384899B2 JP 4384899 B2 JP4384899 B2 JP 4384899B2 JP 2003407058 A JP2003407058 A JP 2003407058A JP 2003407058 A JP2003407058 A JP 2003407058A JP 4384899 B2 JP4384899 B2 JP 4384899B2
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003407058A JP4384899B2 (ja) | 2003-12-05 | 2003-12-05 | デバイスチップ位置測定方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003407058A JP4384899B2 (ja) | 2003-12-05 | 2003-12-05 | デバイスチップ位置測定方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005164522A JP2005164522A (ja) | 2005-06-23 |
| JP2005164522A5 JP2005164522A5 (enExample) | 2006-12-28 |
| JP4384899B2 true JP4384899B2 (ja) | 2009-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003407058A Expired - Lifetime JP4384899B2 (ja) | 2003-12-05 | 2003-12-05 | デバイスチップ位置測定方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4384899B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4706366B2 (ja) * | 2005-07-22 | 2011-06-22 | 株式会社テクノホロン | 位置検出方法 |
| WO2017210576A1 (en) * | 2016-06-02 | 2017-12-07 | Universal Instruments Corporation | Semiconductor die offset compensation variation |
| JP6295355B1 (ja) * | 2017-03-31 | 2018-03-14 | 株式会社ピーエムティー | 露光装置、露光方法、半導体モジュールの製造方法、パターン形成装置、及びパターン形成方法 |
| CN112541949B (zh) * | 2020-12-25 | 2024-03-29 | 铜陵三佳山田科技股份有限公司 | 用于半导体芯片封装的芯片定位方法 |
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2003
- 2003-12-05 JP JP2003407058A patent/JP4384899B2/ja not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| JP2005164522A (ja) | 2005-06-23 |
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