JP2005164522A5 - - Google Patents

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Publication number
JP2005164522A5
JP2005164522A5 JP2003407058A JP2003407058A JP2005164522A5 JP 2005164522 A5 JP2005164522 A5 JP 2005164522A5 JP 2003407058 A JP2003407058 A JP 2003407058A JP 2003407058 A JP2003407058 A JP 2003407058A JP 2005164522 A5 JP2005164522 A5 JP 2005164522A5
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JP
Japan
Prior art keywords
initial
measurement
points
device chip
reference measurement
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JP2003407058A
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English (en)
Japanese (ja)
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JP2005164522A (ja
JP4384899B2 (ja
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Priority to JP2003407058A priority Critical patent/JP4384899B2/ja
Priority claimed from JP2003407058A external-priority patent/JP4384899B2/ja
Publication of JP2005164522A publication Critical patent/JP2005164522A/ja
Publication of JP2005164522A5 publication Critical patent/JP2005164522A5/ja
Application granted granted Critical
Publication of JP4384899B2 publication Critical patent/JP4384899B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2003407058A 2003-12-05 2003-12-05 デバイスチップ位置測定方法 Expired - Lifetime JP4384899B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003407058A JP4384899B2 (ja) 2003-12-05 2003-12-05 デバイスチップ位置測定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003407058A JP4384899B2 (ja) 2003-12-05 2003-12-05 デバイスチップ位置測定方法

Publications (3)

Publication Number Publication Date
JP2005164522A JP2005164522A (ja) 2005-06-23
JP2005164522A5 true JP2005164522A5 (enExample) 2006-12-28
JP4384899B2 JP4384899B2 (ja) 2009-12-16

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ID=34729220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003407058A Expired - Lifetime JP4384899B2 (ja) 2003-12-05 2003-12-05 デバイスチップ位置測定方法

Country Status (1)

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JP (1) JP4384899B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4706366B2 (ja) * 2005-07-22 2011-06-22 株式会社テクノホロン 位置検出方法
WO2017210576A1 (en) * 2016-06-02 2017-12-07 Universal Instruments Corporation Semiconductor die offset compensation variation
JP6295355B1 (ja) * 2017-03-31 2018-03-14 株式会社ピーエムティー 露光装置、露光方法、半導体モジュールの製造方法、パターン形成装置、及びパターン形成方法
CN112541949B (zh) * 2020-12-25 2024-03-29 铜陵三佳山田科技股份有限公司 用于半导体芯片封装的芯片定位方法

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