JP4380327B2 - 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 - Google Patents

回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 Download PDF

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Publication number
JP4380327B2
JP4380327B2 JP2004002305A JP2004002305A JP4380327B2 JP 4380327 B2 JP4380327 B2 JP 4380327B2 JP 2004002305 A JP2004002305 A JP 2004002305A JP 2004002305 A JP2004002305 A JP 2004002305A JP 4380327 B2 JP4380327 B2 JP 4380327B2
Authority
JP
Japan
Prior art keywords
circuit
connection
electrodes
particles
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004002305A
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English (en)
Japanese (ja)
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JP2005197089A (ja
Inventor
潤 竹田津
伊津夫 渡辺
泰史 後藤
一夫 山口
正規 藤井
綾 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2004002305A priority Critical patent/JP4380327B2/ja
Priority to US10/585,461 priority patent/US20100025089A1/en
Priority to SG200908709-9A priority patent/SG158842A1/en
Priority to KR1020097008205A priority patent/KR100996035B1/ko
Priority to PCT/JP2005/000070 priority patent/WO2005066298A1/ja
Priority to KR1020067015544A priority patent/KR100865204B1/ko
Priority to EP05703338A priority patent/EP1702968A4/en
Priority to KR1020087014740A priority patent/KR100908370B1/ko
Priority to CN201010245654.2A priority patent/CN101944659B/zh
Priority to CNA200580001944XA priority patent/CN1906265A/zh
Priority to CN2013103506129A priority patent/CN103409082A/zh
Priority to KR1020097008206A priority patent/KR100981483B1/ko
Priority to TW098120262A priority patent/TW200951201A/zh
Priority to TW098120264A priority patent/TW200945373A/zh
Priority to TW098120260A priority patent/TW200942596A/zh
Priority to TW094100507A priority patent/TW200525005A/zh
Publication of JP2005197089A publication Critical patent/JP2005197089A/ja
Application granted granted Critical
Publication of JP4380327B2 publication Critical patent/JP4380327B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
JP2004002305A 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 Expired - Lifetime JP4380327B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
US10/585,461 US20100025089A1 (en) 2004-01-07 2005-01-01 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
KR1020097008206A KR100981483B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 회로부재의 접속구조 및 그 제조방법
PCT/JP2005/000070 WO2005066298A1 (ja) 2004-01-07 2005-01-06 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
KR1020067015544A KR100865204B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법
EP05703338A EP1702968A4 (en) 2004-01-07 2005-01-06 CIRCUIT CONNECTING MATERIAL, FILM-FORMED CIRCUIT CONNECTING MATERIAL THEREOF, CIRCUIT MEMBRANE CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
KR1020087014740A KR100908370B1 (ko) 2004-01-07 2005-01-06 회로접속재료용 피복입자
CN201010245654.2A CN101944659B (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法
SG200908709-9A SG158842A1 (en) 2004-01-07 2005-01-06 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
CN2013103506129A CN103409082A (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法
KR1020097008205A KR100996035B1 (ko) 2004-01-07 2005-01-06 필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법
CNA200580001944XA CN1906265A (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法
TW098120262A TW200951201A (en) 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof
TW098120264A TW200945373A (en) 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof
TW098120260A TW200942596A (en) 2004-01-07 2005-01-07 Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof
TW094100507A TW200525005A (en) 2004-01-07 2005-01-07 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2009113616A Division JP4386145B2 (ja) 2009-05-08 2009-05-08 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2009113618A Division JP4386146B2 (ja) 2009-05-08 2009-05-08 フィルム状回路接続材料、回路部材の接続構造及びその製造方法

Publications (2)

Publication Number Publication Date
JP2005197089A JP2005197089A (ja) 2005-07-21
JP4380327B2 true JP4380327B2 (ja) 2009-12-09

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Family Applications (1)

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JP2004002305A Expired - Lifetime JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Country Status (2)

Country Link
JP (1) JP4380327B2 (zh)
CN (1) CN1906265A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150090018A (ko) 2012-11-28 2015-08-05 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200739612A (en) * 2006-02-27 2007-10-16 Hitachi Chemical Co Ltd Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
EP2073316A4 (en) 2006-09-26 2010-07-21 Hitachi Chemical Co Ltd ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT ELEMENT CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING COATED PARTICLES
JP2008291161A (ja) * 2007-05-28 2008-12-04 Sony Chemical & Information Device Corp 接着剤の製造方法、電気部品の接続方法
WO2009054387A1 (ja) * 2007-10-22 2009-04-30 Nippon Chemical Industrial Co., Ltd. 被覆導電性粉体およびそれを用いた導電性接着剤
JP5141456B2 (ja) * 2007-10-24 2013-02-13 日立化成工業株式会社 回路接続材料及び接続構造体
JP2009275079A (ja) * 2008-05-13 2009-11-26 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路部材の接続構造
KR20150037198A (ko) 2013-09-30 2015-04-08 삼성디스플레이 주식회사 표시패널 및 이를 갖는 표시장치
JP2017183239A (ja) * 2016-03-31 2017-10-05 デクセリアルズ株式会社 異方性導電接続構造体
JP7077963B2 (ja) * 2017-01-27 2022-05-31 昭和電工マテリアルズ株式会社 絶縁被覆導電粒子、異方導電フィルム、異方導電フィルムの製造方法、接続構造体及び接続構造体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150090018A (ko) 2012-11-28 2015-08-05 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체

Also Published As

Publication number Publication date
CN1906265A (zh) 2007-01-31
JP2005197089A (ja) 2005-07-21

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