JP4380115B2 - 耐熱性接着剤、耐熱性積層フィルム、金属箔付き積層フィルム及びこれを用いた半導体装置 - Google Patents

耐熱性接着剤、耐熱性積層フィルム、金属箔付き積層フィルム及びこれを用いた半導体装置 Download PDF

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Publication number
JP4380115B2
JP4380115B2 JP2002179807A JP2002179807A JP4380115B2 JP 4380115 B2 JP4380115 B2 JP 4380115B2 JP 2002179807 A JP2002179807 A JP 2002179807A JP 2002179807 A JP2002179807 A JP 2002179807A JP 4380115 B2 JP4380115 B2 JP 4380115B2
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Japan
Prior art keywords
heat
laminated film
resistant
group
adhesive
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Expired - Fee Related
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JP2002179807A
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Japanese (ja)
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JP2003105306A (ja
JP2003105306A5 (https=
Inventor
拓生 渡邉
利夫 吉村
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Toray Industries Inc
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Toray Industries Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

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  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Wire Bonding (AREA)
  • Laminated Bodies (AREA)
JP2002179807A 2001-07-04 2002-06-20 耐熱性接着剤、耐熱性積層フィルム、金属箔付き積層フィルム及びこれを用いた半導体装置 Expired - Fee Related JP4380115B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002179807A JP4380115B2 (ja) 2001-07-04 2002-06-20 耐熱性接着剤、耐熱性積層フィルム、金属箔付き積層フィルム及びこれを用いた半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-203509 2001-07-04
JP2001203509 2001-07-04
JP2002179807A JP4380115B2 (ja) 2001-07-04 2002-06-20 耐熱性接着剤、耐熱性積層フィルム、金属箔付き積層フィルム及びこれを用いた半導体装置

Publications (3)

Publication Number Publication Date
JP2003105306A JP2003105306A (ja) 2003-04-09
JP2003105306A5 JP2003105306A5 (https=) 2005-10-20
JP4380115B2 true JP4380115B2 (ja) 2009-12-09

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JP2002179807A Expired - Fee Related JP4380115B2 (ja) 2001-07-04 2002-06-20 耐熱性接着剤、耐熱性積層フィルム、金属箔付き積層フィルム及びこれを用いた半導体装置

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JP (1) JP4380115B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4708134B2 (ja) * 2005-09-14 2011-06-22 日東電工株式会社 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法
WO2011040194A1 (ja) * 2009-10-02 2011-04-07 新日鐵化学株式会社 接着剤樹脂組成物、カバーレイフィルム及び回路基板
JP5148760B2 (ja) * 2009-10-27 2013-02-20 新日鉄住金化学株式会社 接着剤樹脂組成物、カバーレイフィルム及び回路基板
KR101365257B1 (ko) * 2012-02-15 2014-02-21 도레이첨단소재 주식회사 내열성 접착테이프
US20200317963A1 (en) * 2016-05-23 2020-10-08 Nissan Chemical Corporation Detachable layer-forming composition and detachable layer

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JP2003105306A (ja) 2003-04-09

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