JP4378980B2 - 制御端子付き電子部品 - Google Patents

制御端子付き電子部品 Download PDF

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Publication number
JP4378980B2
JP4378980B2 JP2003068345A JP2003068345A JP4378980B2 JP 4378980 B2 JP4378980 B2 JP 4378980B2 JP 2003068345 A JP2003068345 A JP 2003068345A JP 2003068345 A JP2003068345 A JP 2003068345A JP 4378980 B2 JP4378980 B2 JP 4378980B2
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JP
Japan
Prior art keywords
package
inspection
electronic component
terminal
substrate
Prior art date
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Expired - Fee Related
Application number
JP2003068345A
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English (en)
Japanese (ja)
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JP2004007469A (ja
JP2004007469A5 (https=
Inventor
克彦 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2003068345A priority Critical patent/JP4378980B2/ja
Publication of JP2004007469A publication Critical patent/JP2004007469A/ja
Publication of JP2004007469A5 publication Critical patent/JP2004007469A5/ja
Application granted granted Critical
Publication of JP4378980B2 publication Critical patent/JP4378980B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2003068345A 2002-03-25 2003-03-13 制御端子付き電子部品 Expired - Fee Related JP4378980B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003068345A JP4378980B2 (ja) 2002-03-25 2003-03-13 制御端子付き電子部品

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002084333 2002-03-25
JP2003068345A JP4378980B2 (ja) 2002-03-25 2003-03-13 制御端子付き電子部品

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2009069526A Division JP5024317B2 (ja) 2002-03-25 2009-03-23 電子部品および電子部品の製造方法
JP2009108871A Division JP2009171607A (ja) 2002-03-25 2009-04-28 制御端子付き電子部品
JP2009108870A Division JP2009175155A (ja) 2002-03-25 2009-04-28 制御端子付き電子部品

Publications (3)

Publication Number Publication Date
JP2004007469A JP2004007469A (ja) 2004-01-08
JP2004007469A5 JP2004007469A5 (https=) 2006-04-20
JP4378980B2 true JP4378980B2 (ja) 2009-12-09

Family

ID=30445934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003068345A Expired - Fee Related JP4378980B2 (ja) 2002-03-25 2003-03-13 制御端子付き電子部品

Country Status (1)

Country Link
JP (1) JP4378980B2 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7710002B2 (en) 2006-06-21 2010-05-04 Epson Toyocom Corporation Piezoelectric resonator for oscillator and surface mount type piezoelectric oscillator
JP4251070B2 (ja) 2003-12-10 2009-04-08 エプソントヨコム株式会社 圧電発振器、電子部品、及び圧電発振器の製造方法
JP4848676B2 (ja) * 2005-06-10 2011-12-28 株式会社村田製作所 部品内蔵基板、この部品内蔵基板を用いた部品内蔵モジュール、および部品内蔵基板の製造方法
JP4654837B2 (ja) * 2005-08-24 2011-03-23 エプソントヨコム株式会社 表面実装型圧電発振器用パッケージ、表面実装型圧電発振器
JP4724519B2 (ja) * 2005-09-29 2011-07-13 京セラキンセキ株式会社 圧電発振器
JP2007103994A (ja) * 2005-09-30 2007-04-19 Kyocera Kinseki Corp 圧電発振器
JP4894248B2 (ja) * 2005-12-01 2012-03-14 セイコーエプソン株式会社 電子デバイスの外部信号入力方法
JP2007243536A (ja) * 2006-03-08 2007-09-20 Epson Toyocom Corp 圧電デバイス及びその製造方法
JP2008141412A (ja) * 2006-11-30 2008-06-19 Kyocera Kinseki Corp 圧電デバイス
JP2009174910A (ja) 2008-01-22 2009-08-06 Olympus Corp 積層実装構造体
JP2009194725A (ja) * 2008-02-15 2009-08-27 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP5252992B2 (ja) * 2008-05-21 2013-07-31 京セラ株式会社 水晶発振器用パッケージおよび水晶発振器
JP5459985B2 (ja) * 2008-06-19 2014-04-02 京セラ株式会社 パッケージ及びそれを用いた電子装置、並びに発光装置
JP5188916B2 (ja) * 2008-09-30 2013-04-24 京セラクリスタルデバイス株式会社 圧電発振器
JP5613370B2 (ja) * 2008-10-29 2014-10-22 日本電波工業株式会社 セット基板に対する表面実装水晶発振器の実装方法
JP2010141875A (ja) * 2008-11-13 2010-06-24 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器
JP2011014951A (ja) * 2009-06-30 2011-01-20 Kyocera Kinseki Corp 圧電発振器
JP5368208B2 (ja) * 2009-07-30 2013-12-18 京セラクリスタルデバイス株式会社 圧電デバイス
JP5468327B2 (ja) * 2009-07-30 2014-04-09 京セラクリスタルデバイス株式会社 圧電デバイス
JP2010154565A (ja) * 2010-03-24 2010-07-08 Seiko Epson Corp 圧電発振器、電子機器および圧電発振器の製造方法
JP5747574B2 (ja) 2011-03-11 2015-07-15 セイコーエプソン株式会社 圧電デバイス及び電子機器
JP6334192B2 (ja) * 2014-02-21 2018-05-30 京セラ株式会社 圧電デバイスおよびその実装構造
JP2016076514A (ja) * 2014-10-02 2016-05-12 大日本印刷株式会社 配線板、電子モジュール
JP6524679B2 (ja) 2015-02-02 2019-06-05 富士通株式会社 水晶振動子の検査方法
JP6451367B2 (ja) 2015-02-06 2019-01-16 富士通株式会社 水晶振動子
CN112485640B (zh) * 2020-11-18 2023-06-27 苏州华兴源创科技股份有限公司 内置电容器的检测方法、装置、检测设备和存储介质

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Publication number Publication date
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