JP4376448B2 - プリント配線基板およびそれを用いたｉｃカード用モジュールならびにその製造方法 - Google Patents
プリント配線基板およびそれを用いたｉｃカード用モジュールならびにその製造方法 Download PDFInfo
- Publication number
- JP4376448B2 JP4376448B2 JP2000369833A JP2000369833A JP4376448B2 JP 4376448 B2 JP4376448 B2 JP 4376448B2 JP 2000369833 A JP2000369833 A JP 2000369833A JP 2000369833 A JP2000369833 A JP 2000369833A JP 4376448 B2 JP4376448 B2 JP 4376448B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- resin
- base material
- semiconductor device
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000369833A JP4376448B2 (ja) | 2000-03-30 | 2000-12-05 | プリント配線基板およびそれを用いたｉｃカード用モジュールならびにその製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-93188 | 2000-03-30 | ||
| JP2000093188 | 2000-03-30 | ||
| JP2000369833A JP4376448B2 (ja) | 2000-03-30 | 2000-12-05 | プリント配線基板およびそれを用いたｉｃカード用モジュールならびにその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001344587A JP2001344587A (ja) | 2001-12-14 |
| JP2001344587A5 JP2001344587A5 (https=) | 2006-08-17 |
| JP4376448B2 true JP4376448B2 (ja) | 2009-12-02 |
Family
ID=26588818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000369833A Expired - Fee Related JP4376448B2 (ja) | 2000-03-30 | 2000-12-05 | プリント配線基板およびそれを用いたｉｃカード用モジュールならびにその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4376448B2 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3866178B2 (ja) | 2002-10-08 | 2007-01-10 | 株式会社ルネサステクノロジ | Ｉｃカード |
| JP5187305B2 (ja) * | 2007-06-15 | 2013-04-24 | パナソニック株式会社 | メモリカードおよびその製造方法 |
| JP4634436B2 (ja) * | 2007-12-14 | 2011-02-16 | ルネサスエレクトロニクス株式会社 | Ｉｃカードの製造方法 |
| JPWO2013132815A1 (ja) * | 2012-03-09 | 2015-07-30 | 日本電気株式会社 | 電子部品内蔵モジュールおよび電子機器並びに電子部品内蔵モジュールの製造方法 |
| JP2015130379A (ja) * | 2014-01-06 | 2015-07-16 | アピックヤマダ株式会社 | 樹脂封止製品の製造方法および樹脂封止製品 |
| JP6016965B2 (ja) | 2015-03-02 | 2016-10-26 | 三菱電機株式会社 | 電子機器ユニット及びその製造金型装置 |
-
2000
- 2000-12-05 JP JP2000369833A patent/JP4376448B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001344587A (ja) | 2001-12-14 |
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