JP4370341B2 - Ａｃｆ貼り付け装置 - Google Patents

Ａｃｆ貼り付け装置 Download PDF

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Publication number
JP4370341B2
JP4370341B2 JP2007086927A JP2007086927A JP4370341B2 JP 4370341 B2 JP4370341 B2 JP 4370341B2 JP 2007086927 A JP2007086927 A JP 2007086927A JP 2007086927 A JP2007086927 A JP 2007086927A JP 4370341 B2 JP4370341 B2 JP 4370341B2
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JP
Japan
Prior art keywords
acf
substrate
tape
unit
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007086927A
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English (en)
Japanese (ja)
Other versions
JP2008242400A (ja
Inventor
淳 斧城
秀樹 野本
弘司 平迫
英明 峰川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2007086927A priority Critical patent/JP4370341B2/ja
Priority to TW97109626A priority patent/TW200905341A/zh
Priority to CN200810087992A priority patent/CN100591196C/zh
Publication of JP2008242400A publication Critical patent/JP2008242400A/ja
Application granted granted Critical
Publication of JP4370341B2 publication Critical patent/JP4370341B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2007086927A 2007-03-29 2007-03-29 Ａｃｆ貼り付け装置 Expired - Fee Related JP4370341B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007086927A JP4370341B2 (ja) 2007-03-29 2007-03-29 Ａｃｆ貼り付け装置
TW97109626A TW200905341A (en) 2007-03-29 2008-03-19 ACF paste device and flat panel display
CN200810087992A CN100591196C (zh) 2007-03-29 2008-03-28 Acf粘贴装置及平板显示器装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007086927A JP4370341B2 (ja) 2007-03-29 2007-03-29 Ａｃｆ貼り付け装置

Publications (2)

Publication Number Publication Date
JP2008242400A JP2008242400A (ja) 2008-10-09
JP4370341B2 true JP4370341B2 (ja) 2009-11-25

Family

ID=39913778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007086927A Expired - Fee Related JP4370341B2 (ja) 2007-03-29 2007-03-29 Ａｃｆ貼り付け装置

Country Status (3)

Country Link
JP (1) JP4370341B2 (enrdf_load_stackoverflow)
CN (1) CN100591196C (enrdf_load_stackoverflow)
TW (1) TW200905341A (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4392766B2 (ja) * 2007-08-21 2010-01-06 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け装置
WO2010084728A1 (ja) * 2009-01-22 2010-07-29 パナソニック株式会社 粘着テープ貼付装置及び圧着装置
JP5325669B2 (ja) * 2009-06-22 2013-10-23 株式会社日立ハイテクノロジーズ Ａｃｆ貼着装置
JP2011149756A (ja) * 2010-01-20 2011-08-04 Hitachi High-Technologies Corp 処理作業装置またはａｃｆ貼付け状態検査方法あるいは表示基板モジュール組立ライン
JP2012004336A (ja) * 2010-06-17 2012-01-05 Panasonic Corp テープ貼付け装置およびテープ貼付け方法
JP5273128B2 (ja) 2010-11-15 2013-08-28 パナソニック株式会社 テープ貼着装置及びテープ貼着方法
JP5605215B2 (ja) * 2010-12-24 2014-10-15 パナソニック株式会社 テープ貼着装置及びテープ貼着方法
CN102866517A (zh) * 2012-08-29 2013-01-09 昆山维信诺显示技术有限公司 一种acf贴附方法
CN104914595B (zh) * 2014-03-10 2018-01-09 旭东机械工业股份有限公司 基板压制机构
CN106154608B (zh) 2016-09-09 2019-04-19 京东方科技集团股份有限公司 导电胶贴附装置及显示面板的制备方法
CN108475484B (zh) * 2017-06-22 2022-02-15 深圳市柔宇科技股份有限公司 承载装置和压合设备
CN107087348B (zh) * 2017-06-26 2019-04-09 潍坊路加精工有限公司 一种电路板的贴装方法及装置
CN108663863B (zh) * 2018-06-25 2021-01-26 Tcl华星光电技术有限公司 阵列基板
CN110187528B (zh) * 2019-05-22 2022-02-01 深圳汉和智造有限公司 邦定设备及其贴付装置
CN116864433B (zh) * 2023-09-04 2023-11-10 砺铸智能设备(天津)有限公司 一种用于芯片封装的自动进给热压封装机构

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI243386B (en) * 2004-02-26 2005-11-11 Au Optronics Corp Anisotropic conductive film pad

Also Published As

Publication number Publication date
CN100591196C (zh) 2010-02-17
TWI375843B (enrdf_load_stackoverflow) 2012-11-01
JP2008242400A (ja) 2008-10-09
TW200905341A (en) 2009-02-01
CN101277588A (zh) 2008-10-01

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