JP4366777B2 - 電子部品 - Google Patents

電子部品 Download PDF

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Publication number
JP4366777B2
JP4366777B2 JP24750399A JP24750399A JP4366777B2 JP 4366777 B2 JP4366777 B2 JP 4366777B2 JP 24750399 A JP24750399 A JP 24750399A JP 24750399 A JP24750399 A JP 24750399A JP 4366777 B2 JP4366777 B2 JP 4366777B2
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JP
Japan
Prior art keywords
electrode pad
substrate
protective film
electrode
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP24750399A
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English (en)
Japanese (ja)
Other versions
JP2001077517A (ja
JP2001077517A5 (https=
Inventor
泰治 木下
聖治 星徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP24750399A priority Critical patent/JP4366777B2/ja
Publication of JP2001077517A publication Critical patent/JP2001077517A/ja
Publication of JP2001077517A5 publication Critical patent/JP2001077517A5/ja
Application granted granted Critical
Publication of JP4366777B2 publication Critical patent/JP4366777B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP24750399A 1999-09-01 1999-09-01 電子部品 Expired - Fee Related JP4366777B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24750399A JP4366777B2 (ja) 1999-09-01 1999-09-01 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24750399A JP4366777B2 (ja) 1999-09-01 1999-09-01 電子部品

Publications (3)

Publication Number Publication Date
JP2001077517A JP2001077517A (ja) 2001-03-23
JP2001077517A5 JP2001077517A5 (https=) 2006-10-05
JP4366777B2 true JP4366777B2 (ja) 2009-11-18

Family

ID=17164452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24750399A Expired - Fee Related JP4366777B2 (ja) 1999-09-01 1999-09-01 電子部品

Country Status (1)

Country Link
JP (1) JP4366777B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5043563B2 (ja) * 2007-08-29 2012-10-10 新光電気工業株式会社 配線基板及びその製造方法
TWI599276B (zh) * 2015-06-26 2017-09-11 矽創電子股份有限公司 電子元件與製造方法
JP7064325B2 (ja) * 2017-12-18 2022-05-10 スタンレー電気株式会社 半導体発光装置、および、それを用いた半導体発光装置の製造方法

Also Published As

Publication number Publication date
JP2001077517A (ja) 2001-03-23

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