JP4359954B2 - 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 - Google Patents

半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 Download PDF

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Publication number
JP4359954B2
JP4359954B2 JP08107899A JP8107899A JP4359954B2 JP 4359954 B2 JP4359954 B2 JP 4359954B2 JP 08107899 A JP08107899 A JP 08107899A JP 8107899 A JP8107899 A JP 8107899A JP 4359954 B2 JP4359954 B2 JP 4359954B2
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JP
Japan
Prior art keywords
adhesive
layer
semiconductor device
adhesive sheet
weight
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP08107899A
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English (en)
Japanese (ja)
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JP2000273415A (ja
JP2000273415A5 (enExample
Inventor
英樹 篠原
昭弘 田畑
将次 木越
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP08107899A priority Critical patent/JP4359954B2/ja
Publication of JP2000273415A publication Critical patent/JP2000273415A/ja
Publication of JP2000273415A5 publication Critical patent/JP2000273415A5/ja
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Publication of JP4359954B2 publication Critical patent/JP4359954B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

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  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
JP08107899A 1999-03-25 1999-03-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 Expired - Fee Related JP4359954B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08107899A JP4359954B2 (ja) 1999-03-25 1999-03-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08107899A JP4359954B2 (ja) 1999-03-25 1999-03-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Publications (3)

Publication Number Publication Date
JP2000273415A JP2000273415A (ja) 2000-10-03
JP2000273415A5 JP2000273415A5 (enExample) 2006-03-30
JP4359954B2 true JP4359954B2 (ja) 2009-11-11

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Application Number Title Priority Date Filing Date
JP08107899A Expired - Fee Related JP4359954B2 (ja) 1999-03-25 1999-03-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

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JP (1) JP4359954B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102898966A (zh) * 2011-07-25 2013-01-30 日东电工株式会社 胶粘片及其用途

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4721309B2 (ja) * 2001-02-14 2011-07-13 日東電工株式会社 熱硬化性樹脂組成物および半導体装置
JP2002241469A (ja) * 2001-02-14 2002-08-28 Nitto Denko Corp 熱硬化性樹脂組成物および半導体装置
JP2010006929A (ja) * 2008-06-26 2010-01-14 Shin-Etsu Chemical Co Ltd 接着剤組成物、接着用シート及びダイシング・ダイアタッチフィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102898966A (zh) * 2011-07-25 2013-01-30 日东电工株式会社 胶粘片及其用途

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JP2000273415A (ja) 2000-10-03

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