JP4348412B2 - 計測システムクラスター - Google Patents

計測システムクラスター Download PDF

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Publication number
JP4348412B2
JP4348412B2 JP2002585932A JP2002585932A JP4348412B2 JP 4348412 B2 JP4348412 B2 JP 4348412B2 JP 2002585932 A JP2002585932 A JP 2002585932A JP 2002585932 A JP2002585932 A JP 2002585932A JP 4348412 B2 JP4348412 B2 JP 4348412B2
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JP
Japan
Prior art keywords
measurement
wafer
measurement system
information
cluster
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Expired - Fee Related
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JP2002585932A
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English (en)
Japanese (ja)
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JP2004535666A (ja
JP2004535666A5 (enExample
Inventor
ハサン、ターラート
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of JP2004535666A publication Critical patent/JP2004535666A/ja
Publication of JP2004535666A5 publication Critical patent/JP2004535666A5/ja
Application granted granted Critical
Publication of JP4348412B2 publication Critical patent/JP4348412B2/ja
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G01N21/211—Ellipsometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2002585932A 2001-04-26 2002-04-24 計測システムクラスター Expired - Fee Related JP4348412B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28648501P 2001-04-26 2001-04-26
PCT/US2002/013158 WO2002088677A1 (en) 2001-04-26 2002-04-24 Measurement system cluster

Publications (3)

Publication Number Publication Date
JP2004535666A JP2004535666A (ja) 2004-11-25
JP2004535666A5 JP2004535666A5 (enExample) 2005-12-22
JP4348412B2 true JP4348412B2 (ja) 2009-10-21

Family

ID=23098810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002585932A Expired - Fee Related JP4348412B2 (ja) 2001-04-26 2002-04-24 計測システムクラスター

Country Status (3)

Country Link
US (3) US6999164B2 (enExample)
JP (1) JP4348412B2 (enExample)
WO (1) WO2002088677A1 (enExample)

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US7315765B1 (en) * 2005-07-29 2008-01-01 Advanced Micro Devices, Inc. Automated control thread determination based upon post-process consideration
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US7625680B2 (en) * 2006-09-29 2009-12-01 Tokyo Electron Limited Method of real time dynamic CD control
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JP5134944B2 (ja) * 2007-12-27 2013-01-30 株式会社ニューフレアテクノロジー 描画装置及び描画方法
TWI483224B (zh) * 2009-03-03 2015-05-01 Acer Inc 多功能模式之切換方法及其電子裝置
WO2011086366A2 (en) * 2010-01-12 2011-07-21 Kromek Limited Calibration of dataset
WO2011104713A1 (en) * 2010-02-25 2011-09-01 Nova Measuring Instruments Ltd. Method and system for measurng in patterned structures
KR20130019495A (ko) * 2011-08-17 2013-02-27 한국표준과학연구원 광소자-회전형 타원계측기 및 이를 이용한 시료의 물성 측정 방법
US10330608B2 (en) * 2012-05-11 2019-06-25 Kla-Tencor Corporation Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools
TW201514473A (zh) * 2013-10-15 2015-04-16 Utechzone Co Ltd 檢測混合類型物件的方法
KR102254033B1 (ko) * 2014-06-13 2021-05-20 삼성전자주식회사 광학 측정 방법 및 광학 측정 시스템
US10514614B2 (en) 2015-02-13 2019-12-24 Asml Netherlands B.V. Process variability aware adaptive inspection and metrology
US10228678B2 (en) * 2015-07-22 2019-03-12 Tokyo Electron Limited Tool failure analysis using space-distorted similarity
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry
KR102426823B1 (ko) 2016-09-30 2022-07-28 가부시키가이샤 니콘 계측 시스템 및 기판 처리 시스템, 그리고 디바이스 제조 방법
US11662324B1 (en) 2022-03-18 2023-05-30 Applied Materials Israel Ltd. Three-dimensional surface metrology of wafers

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Also Published As

Publication number Publication date
US20050094138A1 (en) 2005-05-05
WO2002088677A1 (en) 2002-11-07
US20060274306A1 (en) 2006-12-07
US7283226B2 (en) 2007-10-16
JP2004535666A (ja) 2004-11-25
US20020176074A1 (en) 2002-11-28
US6999164B2 (en) 2006-02-14
US7106433B2 (en) 2006-09-12

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