JP2004535666A5 - - Google Patents
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- Publication number
- JP2004535666A5 JP2004535666A5 JP2002585932A JP2002585932A JP2004535666A5 JP 2004535666 A5 JP2004535666 A5 JP 2004535666A5 JP 2002585932 A JP2002585932 A JP 2002585932A JP 2002585932 A JP2002585932 A JP 2002585932A JP 2004535666 A5 JP2004535666 A5 JP 2004535666A5
- Authority
- JP
- Japan
- Prior art keywords
- measurement
- measurement system
- wafer
- measuring
- cluster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005259 measurement Methods 0.000 claims 45
- 235000012431 wafers Nutrition 0.000 claims 20
- 238000000034 method Methods 0.000 claims 14
- 239000004065 semiconductor Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 5
- 230000007547 defect Effects 0.000 claims 1
- 238000012015 optical character recognition Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28648501P | 2001-04-26 | 2001-04-26 | |
| PCT/US2002/013158 WO2002088677A1 (en) | 2001-04-26 | 2002-04-24 | Measurement system cluster |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004535666A JP2004535666A (ja) | 2004-11-25 |
| JP2004535666A5 true JP2004535666A5 (enExample) | 2005-12-22 |
| JP4348412B2 JP4348412B2 (ja) | 2009-10-21 |
Family
ID=23098810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002585932A Expired - Fee Related JP4348412B2 (ja) | 2001-04-26 | 2002-04-24 | 計測システムクラスター |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US6999164B2 (enExample) |
| JP (1) | JP4348412B2 (enExample) |
| WO (1) | WO2002088677A1 (enExample) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7541201B2 (en) | 2000-08-30 | 2009-06-02 | Kla-Tencor Technologies Corporation | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
| US7317531B2 (en) | 2002-12-05 | 2008-01-08 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| WO2002088677A1 (en) * | 2001-04-26 | 2002-11-07 | Therma-Wave, Inc. | Measurement system cluster |
| DE10141051A1 (de) * | 2001-08-22 | 2003-03-06 | Leica Microsystems | Anordnung und Verfahren zur Inspektion von unstruktuierten Wafern |
| US6986280B2 (en) * | 2002-01-22 | 2006-01-17 | Fei Company | Integrated measuring instrument |
| US6742168B1 (en) * | 2002-03-19 | 2004-05-25 | Advanced Micro Devices, Inc. | Method and structure for calibrating scatterometry-based metrology tool used to measure dimensions of features on a semiconductor device |
| US6886423B2 (en) * | 2002-03-27 | 2005-05-03 | Rudolph Technologies, Inc. | Scalable, automated metrology system and method of making the system |
| JP2004177377A (ja) | 2002-11-29 | 2004-06-24 | Hitachi Ltd | 検査方法および検査装置 |
| DE10308258A1 (de) * | 2003-02-25 | 2004-09-02 | Leica Microsystems Jena Gmbh | Vorrichtung und Verfahren zur Dünnschichtmetrologie |
| US7085676B2 (en) * | 2003-06-27 | 2006-08-01 | Tokyo Electron Limited | Feed forward critical dimension control |
| US20050052197A1 (en) * | 2003-07-14 | 2005-03-10 | Cory Watkins | Multi-tool manager |
| US6968252B1 (en) * | 2003-07-15 | 2005-11-22 | Advanced Micro Devices, Inc. | Method and apparatus for dispatching based on metrology tool performance |
| US7106434B1 (en) | 2003-07-28 | 2006-09-12 | Kla-Tencor Technologies, Inc. | Inspection tool |
| US20060058979A1 (en) * | 2004-09-14 | 2006-03-16 | Markle Richard J | Method and system for calibrating integrated metrology systems and stand-alone metrology systems that acquire wafer state data |
| US7076321B2 (en) * | 2004-10-05 | 2006-07-11 | Advanced Micro Devices, Inc. | Method and system for dynamically adjusting metrology sampling based upon available metrology capacity |
| US7397555B2 (en) * | 2004-12-17 | 2008-07-08 | Lam Research Corporation | System, method and apparatus for in-situ substrate inspection |
| US7315765B1 (en) * | 2005-07-29 | 2008-01-01 | Advanced Micro Devices, Inc. | Automated control thread determination based upon post-process consideration |
| JP4720991B2 (ja) * | 2005-08-01 | 2011-07-13 | 株式会社ニコン | 情報表示システム |
| US7561282B1 (en) | 2006-03-27 | 2009-07-14 | Kla-Tencor Technologies Corporation | Techniques for determining overlay and critical dimension using a single metrology tool |
| US7445446B2 (en) * | 2006-09-29 | 2008-11-04 | Tokyo Electron Limited | Method for in-line monitoring and controlling in heat-treating of resist coated wafers |
| US7625680B2 (en) * | 2006-09-29 | 2009-12-01 | Tokyo Electron Limited | Method of real time dynamic CD control |
| DE102006051495B4 (de) * | 2006-10-31 | 2017-11-02 | Globalfoundries Inc. | Verfahren und System zur zufälligen Verteilung von Scheiben in einer komplexen Prozesslinie |
| US8282984B2 (en) * | 2007-12-03 | 2012-10-09 | Tokyo Electron Limited | Processing condition inspection and optimization method of damage recovery process, damage recovering system and storage medium |
| JP5134944B2 (ja) * | 2007-12-27 | 2013-01-30 | 株式会社ニューフレアテクノロジー | 描画装置及び描画方法 |
| TWI483224B (zh) * | 2009-03-03 | 2015-05-01 | Acer Inc | 多功能模式之切換方法及其電子裝置 |
| WO2011086366A2 (en) * | 2010-01-12 | 2011-07-21 | Kromek Limited | Calibration of dataset |
| WO2011104713A1 (en) * | 2010-02-25 | 2011-09-01 | Nova Measuring Instruments Ltd. | Method and system for measurng in patterned structures |
| KR20130019495A (ko) * | 2011-08-17 | 2013-02-27 | 한국표준과학연구원 | 광소자-회전형 타원계측기 및 이를 이용한 시료의 물성 측정 방법 |
| US10330608B2 (en) * | 2012-05-11 | 2019-06-25 | Kla-Tencor Corporation | Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools |
| TW201514473A (zh) * | 2013-10-15 | 2015-04-16 | Utechzone Co Ltd | 檢測混合類型物件的方法 |
| KR102254033B1 (ko) * | 2014-06-13 | 2021-05-20 | 삼성전자주식회사 | 광학 측정 방법 및 광학 측정 시스템 |
| US10514614B2 (en) | 2015-02-13 | 2019-12-24 | Asml Netherlands B.V. | Process variability aware adaptive inspection and metrology |
| US10228678B2 (en) * | 2015-07-22 | 2019-03-12 | Tokyo Electron Limited | Tool failure analysis using space-distorted similarity |
| US10451412B2 (en) | 2016-04-22 | 2019-10-22 | Kla-Tencor Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| KR102426823B1 (ko) | 2016-09-30 | 2022-07-28 | 가부시키가이샤 니콘 | 계측 시스템 및 기판 처리 시스템, 그리고 디바이스 제조 방법 |
| US11662324B1 (en) | 2022-03-18 | 2023-05-30 | Applied Materials Israel Ltd. | Three-dimensional surface metrology of wafers |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR970003907B1 (ko) * | 1988-02-12 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 기판처리 장치 및 기판처리 방법 |
| US5393624A (en) * | 1988-07-29 | 1995-02-28 | Tokyo Electron Limited | Method and apparatus for manufacturing a semiconductor device |
| US5270222A (en) * | 1990-12-31 | 1993-12-14 | Texas Instruments Incorporated | Method and apparatus for semiconductor device fabrication diagnosis and prognosis |
| JP2598353B2 (ja) * | 1991-12-04 | 1997-04-09 | アネルバ株式会社 | 基板処理装置、基板搬送装置及び基板交換方法 |
| US5766360A (en) * | 1992-03-27 | 1998-06-16 | Kabushiki Kaisha Toshiba | Substrate processing apparatus and substrate processing method |
| US5474410A (en) * | 1993-03-14 | 1995-12-12 | Tel-Varian Limited | Multi-chamber system provided with carrier units |
| KR100267617B1 (ko) * | 1993-04-23 | 2000-10-16 | 히가시 데쓰로 | 진공처리장치 및 진공처리방법 |
| KR100390293B1 (ko) * | 1993-09-21 | 2003-09-02 | 가부시끼가이샤 도시바 | 폴리싱장치 |
| US5461559A (en) * | 1993-10-04 | 1995-10-24 | The United States Of America As Represented By The Secretary Of The Air Force | Hierarchical control system for molecular beam epitaxy |
| US5492594A (en) * | 1994-09-26 | 1996-02-20 | International Business Machines Corp. | Chemical-mechanical polishing tool with end point measurement station |
| US5646870A (en) * | 1995-02-13 | 1997-07-08 | Advanced Micro Devices, Inc. | Method for setting and adjusting process parameters to maintain acceptable critical dimensions across each die of mass-produced semiconductor wafers |
| TW315504B (enExample) * | 1995-03-20 | 1997-09-11 | Tokyo Electron Co Ltd | |
| IL113829A (en) * | 1995-05-23 | 2000-12-06 | Nova Measuring Instr Ltd | Apparatus for optical inspection of wafers during polishing |
| US5719796A (en) * | 1995-12-04 | 1998-02-17 | Advanced Micro Devices, Inc. | System for monitoring and analyzing manufacturing processes using statistical simulation with single step feedback |
| US5695601A (en) * | 1995-12-27 | 1997-12-09 | Kabushiki Kaisha Toshiba | Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method |
| US6021380A (en) * | 1996-07-09 | 2000-02-01 | Scanis, Inc. | Automatic semiconductor wafer sorter/prober with extended optical inspection |
| US5948203A (en) * | 1996-07-29 | 1999-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Optical dielectric thickness monitor for chemical-mechanical polishing process monitoring |
| US6028664A (en) * | 1997-01-29 | 2000-02-22 | Inspex, Inc. | Method and system for establishing a common reference point on a semiconductor wafer inspected by two or more scanning mechanisms |
| JP4527205B2 (ja) * | 1997-03-31 | 2010-08-18 | リアル・タイム・メトロジー,インコーポレーテッド | 光学検査モジュール、及び統合プロセス工具内で基板上の粒子及び欠陥を検出するための方法 |
| US5996415A (en) * | 1997-04-30 | 1999-12-07 | Sensys Instruments Corporation | Apparatus and method for characterizing semiconductor wafers during processing |
| JP3936030B2 (ja) * | 1997-06-23 | 2007-06-27 | 東京エレクトロン株式会社 | 被処理体の回収方法 |
| US6019000A (en) * | 1997-11-20 | 2000-02-01 | Sensys Instruments Corporation | In-situ measurement of deposition on reactor chamber members |
| JPH11220004A (ja) * | 1997-11-26 | 1999-08-10 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| US6157450A (en) * | 1998-03-09 | 2000-12-05 | Chapman Instruments | Automated optical surface profile measurement system |
| IL125337A0 (en) * | 1998-07-14 | 1999-03-12 | Nova Measuring Instr Ltd | Method and apparatus for lithography monitoring and process control |
| US6177287B1 (en) * | 1998-09-28 | 2001-01-23 | Advanced Micro Devices, Inc. | Simplified inter database communication system |
| AU5703100A (en) * | 1999-07-13 | 2001-01-30 | Mv Research Limited | A circuit production method |
| US7069101B1 (en) * | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| IL132639A (en) * | 1999-10-28 | 2003-11-23 | Nova Measuring Instr Ltd | Optical measurements of patterned structures |
| US6640151B1 (en) * | 1999-12-22 | 2003-10-28 | Applied Materials, Inc. | Multi-tool control system, method and medium |
| US6684122B1 (en) * | 2000-01-03 | 2004-01-27 | Advanced Micro Devices, Inc. | Control mechanism for matching process parameters in a multi-chamber process tool |
| US6362116B1 (en) * | 2000-02-09 | 2002-03-26 | Advanced Micro Devices, Inc. | Method for controlling photoresist baking processes |
| AU2001249724A1 (en) * | 2000-04-03 | 2001-10-15 | Speed-Fam-Ipec Corporation | System and method for predicting software models using material-centric process instrumentation |
| US7139083B2 (en) * | 2000-09-20 | 2006-11-21 | Kla-Tencor Technologies Corp. | Methods and systems for determining a composition and a thickness of a specimen |
| US6673637B2 (en) * | 2000-09-20 | 2004-01-06 | Kla-Tencor Technologies | Methods and systems for determining a presence of macro defects and overlay of a specimen |
| US6701259B2 (en) * | 2000-10-02 | 2004-03-02 | Applied Materials, Inc. | Defect source identifier |
| IL140179A (en) * | 2000-12-07 | 2004-09-27 | Nova Measuring Instr Ltd | Method and system for measuring in patterned structures |
| WO2002088677A1 (en) * | 2001-04-26 | 2002-11-07 | Therma-Wave, Inc. | Measurement system cluster |
| US7089075B2 (en) * | 2001-05-04 | 2006-08-08 | Tokyo Electron Limited | Systems and methods for metrology recipe and model generation |
-
2002
- 2002-04-24 WO PCT/US2002/013158 patent/WO2002088677A1/en not_active Ceased
- 2002-04-24 US US10/132,538 patent/US6999164B2/en not_active Expired - Fee Related
- 2002-04-24 JP JP2002585932A patent/JP4348412B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-15 US US11/012,940 patent/US7106433B2/en not_active Expired - Fee Related
-
2006
- 2006-07-28 US US11/494,924 patent/US7283226B2/en not_active Expired - Fee Related
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