JP4347751B2 - 不良解析システム及び不良箇所表示方法 - Google Patents

不良解析システム及び不良箇所表示方法 Download PDF

Info

Publication number
JP4347751B2
JP4347751B2 JP2004168939A JP2004168939A JP4347751B2 JP 4347751 B2 JP4347751 B2 JP 4347751B2 JP 2004168939 A JP2004168939 A JP 2004168939A JP 2004168939 A JP2004168939 A JP 2004168939A JP 4347751 B2 JP4347751 B2 JP 4347751B2
Authority
JP
Japan
Prior art keywords
semiconductor device
circuit
fault
fault circuit
layout
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004168939A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005347713A5 (enExample
JP2005347713A (ja
Inventor
克史 長野
秀一郎 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP2004168939A priority Critical patent/JP4347751B2/ja
Priority to US10/869,821 priority patent/US7071833B2/en
Priority to EP05751421A priority patent/EP1755158A4/en
Priority to PCT/JP2005/010265 priority patent/WO2005122239A1/ja
Priority to TW094118700A priority patent/TWI370256B/zh
Publication of JP2005347713A publication Critical patent/JP2005347713A/ja
Publication of JP2005347713A5 publication Critical patent/JP2005347713A5/ja
Application granted granted Critical
Publication of JP4347751B2 publication Critical patent/JP4347751B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36539—Different colours for program and machine error, failure display
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2004168939A 2004-06-07 2004-06-07 不良解析システム及び不良箇所表示方法 Expired - Fee Related JP4347751B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004168939A JP4347751B2 (ja) 2004-06-07 2004-06-07 不良解析システム及び不良箇所表示方法
US10/869,821 US7071833B2 (en) 2004-06-07 2004-06-16 Failure analyzing system and method for displaying the failure
EP05751421A EP1755158A4 (en) 2004-06-07 2005-06-03 ERROR ANALYSIS SYSTEM AND ERROR DISPLAY METHOD
PCT/JP2005/010265 WO2005122239A1 (ja) 2004-06-07 2005-06-03 不良解析システム及び不良箇所表示方法
TW094118700A TWI370256B (en) 2004-06-07 2005-06-07 Fault analysis system and display method for fault locatins for displaying a failure postion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004168939A JP4347751B2 (ja) 2004-06-07 2004-06-07 不良解析システム及び不良箇所表示方法

Publications (3)

Publication Number Publication Date
JP2005347713A JP2005347713A (ja) 2005-12-15
JP2005347713A5 JP2005347713A5 (enExample) 2007-07-05
JP4347751B2 true JP4347751B2 (ja) 2009-10-21

Family

ID=35447063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004168939A Expired - Fee Related JP4347751B2 (ja) 2004-06-07 2004-06-07 不良解析システム及び不良箇所表示方法

Country Status (5)

Country Link
US (1) US7071833B2 (enExample)
EP (1) EP1755158A4 (enExample)
JP (1) JP4347751B2 (enExample)
TW (1) TWI370256B (enExample)
WO (1) WO2005122239A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11162995B2 (en) 2018-03-15 2021-11-02 Toshiba Memory Corporation Failure analyzing apparatus and failure analyzing method

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
JP5037826B2 (ja) * 2006-01-25 2012-10-03 株式会社アドバンテスト 解析装置および解析方法
US8626460B2 (en) * 2006-03-31 2014-01-07 Teseda Corporation Secure test-for-yield chip diagnostics management system and method
US7765444B2 (en) * 2006-11-06 2010-07-27 Nec Electronics Corporation Failure diagnosis for logic circuits
WO2008086282A2 (en) 2007-01-05 2008-07-17 Kla-Tencor Corporation Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7669100B2 (en) * 2007-03-08 2010-02-23 Freescale Semiconductor, Inc. System and method for testing and providing an integrated circuit having multiple modules or submodules
RU2365966C2 (ru) * 2007-05-07 2009-08-27 Государственное образовательное учреждение высшего профессионального образования Академия Федеральной службы охраны Российской Федерации (Академия ФСО России) Автоматизированная система диагностирования
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
WO2008157498A1 (en) * 2007-06-15 2008-12-24 Shell Oil Company Methods and systems for predicting equipment operation
JP5425779B2 (ja) 2007-08-20 2014-02-26 ケーエルエー−テンカー・コーポレーション 実際の欠陥が潜在的にシステム的な欠陥であるか、または潜在的にランダムな欠陥であるかを判断する、コンピューターに実装された方法
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101841897B1 (ko) * 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US8539389B2 (en) 2010-09-27 2013-09-17 Teseda Corporation Correlation of device manufacturing defect data with device electrical test data
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
CN102385843A (zh) * 2011-08-11 2012-03-21 上海华碧检测技术有限公司 一种液晶面板显示驱动芯片的电性分析方法
US9939488B2 (en) 2011-08-31 2018-04-10 Teseda Corporation Field triage of EOS failures in semiconductor devices
US8907697B2 (en) 2011-08-31 2014-12-09 Teseda Corporation Electrical characterization for a semiconductor device pin
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
KR102019534B1 (ko) 2013-02-01 2019-09-09 케이엘에이 코포레이션 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
CN115831794A (zh) * 2022-12-07 2023-03-21 广东省大湾区集成电路与系统应用研究院 一种故障诊断方法和故障诊断装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0714898A (ja) * 1993-06-23 1995-01-17 Mitsubishi Electric Corp 半導体ウエハの試験解析装置および解析方法
JPH08203973A (ja) * 1995-01-25 1996-08-09 Sony Corp 半導体装置および半導体装置の良否選別方法
JP3436456B2 (ja) * 1996-06-14 2003-08-11 三菱電機株式会社 エミッション顕微鏡による半導体装置の故障解析方法及び半導体装置故障解析システム
JPH1167853A (ja) * 1997-08-26 1999-03-09 Mitsubishi Electric Corp ウェーハマップ解析補助システムおよびウェーハマップ解析方法
JP3995768B2 (ja) * 1997-10-02 2007-10-24 株式会社ルネサステクノロジ 不良解析方法及びその装置
US6476913B1 (en) * 1998-11-30 2002-11-05 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
JP2001267389A (ja) * 2000-03-21 2001-09-28 Hiroshima Nippon Denki Kk 半導体メモリ生産システム及び半導体メモリ生産方法
JP3767677B2 (ja) * 2000-10-24 2006-04-19 富士通株式会社 半導体試験データ処理方法
JP4146074B2 (ja) * 2000-11-28 2008-09-03 株式会社アドバンテスト フェイル解析装置
JP2002217252A (ja) * 2001-01-22 2002-08-02 Nec Yamagata Ltd マーキングプローバーシステム、マーキング方法及び半導体装置の製造方法
JP2002237506A (ja) * 2001-02-09 2002-08-23 Mitsubishi Electric Corp 故障解析装置及び故障解析方法、並びに半導体装置の製造方法
JP2005109056A (ja) * 2003-09-30 2005-04-21 Matsushita Electric Ind Co Ltd 半導体素子の検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11162995B2 (en) 2018-03-15 2021-11-02 Toshiba Memory Corporation Failure analyzing apparatus and failure analyzing method

Also Published As

Publication number Publication date
TWI370256B (en) 2012-08-11
EP1755158A4 (en) 2010-06-16
US20050270165A1 (en) 2005-12-08
TW200604544A (en) 2006-02-01
EP1755158A1 (en) 2007-02-21
US7071833B2 (en) 2006-07-04
JP2005347713A (ja) 2005-12-15
WO2005122239A1 (ja) 2005-12-22

Similar Documents

Publication Publication Date Title
JP2005347713A (ja) 不良解析システム及び不良箇所表示方法
US20140310670A1 (en) Failure analysis and inline defect characterization
JP4759597B2 (ja) 半導体集積回路の故障解析方法及び故障解析装置
Orbon et al. Integrated electrical and SEM-based defect characterization for rapid yield ramp
Keim et al. A rapid yield learning flow based on production integrated layout-aware diagnosis
US8826209B2 (en) Automated inline defect characterization
US9689923B2 (en) Adaptive electrical testing of wafers
KR100809340B1 (ko) 반도체 집적 회로 장치의 불량 분석 방법 및 시스템
CN110494965B (zh) 检查系统、晶圆图显示器、晶圆图显示方法以及存储介质
CN104916559A (zh) 结合实体坐标的位失效侦测方法
US6639417B2 (en) Semiconductor parametric testing apparatus
US7257507B1 (en) System and method for determining probing locations on IC
CN104576430A (zh) 一种晶圆版图的cdsem测量方法
KR102427207B1 (ko) Gis 기반 스파샬 웨이퍼 맵 생성 방법, 이를 이용한 웨이퍼 테스트 결과 제공 방법
US8487641B2 (en) Pad structure and test method
Mittal et al. Test chip design for optimal cell-aware diagnosability
KR20070030743A (ko) 불량 해석 시스템 및 불량 개소 표시 방법
TWI811629B (zh) 半導體裝置之缺陷解析系統、半導體裝置之缺陷解析方法及半導體裝置之缺陷解析用程式
KR20090070235A (ko) 웨이퍼 맵 동일 불량 유형 분류 방법
US20050114058A1 (en) Method for analyzing inspected data, apparatus and its program
US7243039B1 (en) System and method for determining probing locations on IC
KR100683386B1 (ko) 레이저 스캔을 이용한 반도체 소자 불량 검색 방법 및 장치
De Jesus et al. Case Studies on Failure Localization Technique through Avalon Hotspot Analyzer and Focused Ion Beam Circuit Edit
US6810344B1 (en) Semiconductor testing method and semiconductor testing apparatus for semiconductor devices, and program for executing semiconductor testing method
Gattiker Using test data to improve IC quality and yield

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070309

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070518

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090414

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090603

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090630

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090716

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120724

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120724

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130724

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130724

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees