TWI370256B - Fault analysis system and display method for fault locatins for displaying a failure postion - Google Patents
Fault analysis system and display method for fault locatins for displaying a failure postionInfo
- Publication number
- TWI370256B TWI370256B TW094118700A TW94118700A TWI370256B TW I370256 B TWI370256 B TW I370256B TW 094118700 A TW094118700 A TW 094118700A TW 94118700 A TW94118700 A TW 94118700A TW I370256 B TWI370256 B TW I370256B
- Authority
- TW
- Taiwan
- Prior art keywords
- fault
- locatins
- postion
- displaying
- failure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2894—Aspects of quality control [QC]
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/36—Nc in input of data, input key till input tape
- G05B2219/36539—Different colours for program and machine error, failure display
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Automation & Control Theory (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004168939A JP4347751B2 (ja) | 2004-06-07 | 2004-06-07 | 不良解析システム及び不良箇所表示方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200604544A TW200604544A (en) | 2006-02-01 |
TWI370256B true TWI370256B (en) | 2012-08-11 |
Family
ID=35447063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094118700A TWI370256B (en) | 2004-06-07 | 2005-06-07 | Fault analysis system and display method for fault locatins for displaying a failure postion |
Country Status (5)
Country | Link |
---|---|
US (1) | US7071833B2 (zh) |
EP (1) | EP1755158A4 (zh) |
JP (1) | JP4347751B2 (zh) |
TW (1) | TWI370256B (zh) |
WO (1) | WO2005122239A1 (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7676077B2 (en) | 2005-11-18 | 2010-03-09 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
US8041103B2 (en) | 2005-11-18 | 2011-10-18 | Kla-Tencor Technologies Corp. | Methods and systems for determining a position of inspection data in design data space |
US7570796B2 (en) | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
JP5037826B2 (ja) | 2006-01-25 | 2012-10-03 | 株式会社アドバンテスト | 解析装置および解析方法 |
US8626460B2 (en) * | 2006-03-31 | 2014-01-07 | Teseda Corporation | Secure test-for-yield chip diagnostics management system and method |
US7765444B2 (en) * | 2006-11-06 | 2010-07-27 | Nec Electronics Corporation | Failure diagnosis for logic circuits |
WO2008086282A2 (en) | 2007-01-05 | 2008-07-17 | Kla-Tencor Corporation | Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions |
US7669100B2 (en) * | 2007-03-08 | 2010-02-23 | Freescale Semiconductor, Inc. | System and method for testing and providing an integrated circuit having multiple modules or submodules |
US8213704B2 (en) | 2007-05-09 | 2012-07-03 | Kla-Tencor Corp. | Methods and systems for detecting defects in a reticle design pattern |
CA2689237C (en) * | 2007-06-15 | 2016-11-22 | Shell Internationale Research Maatschappij B.V. | Framework and method for monitoring equipment |
CN101785009B (zh) | 2007-08-20 | 2012-10-10 | 恪纳腾公司 | 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法 |
US8139844B2 (en) | 2008-04-14 | 2012-03-20 | Kla-Tencor Corp. | Methods and systems for determining a defect criticality index for defects on wafers |
US9659670B2 (en) | 2008-07-28 | 2017-05-23 | Kla-Tencor Corp. | Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer |
US8775101B2 (en) | 2009-02-13 | 2014-07-08 | Kla-Tencor Corp. | Detecting defects on a wafer |
US8204297B1 (en) | 2009-02-27 | 2012-06-19 | Kla-Tencor Corp. | Methods and systems for classifying defects detected on a reticle |
US8112241B2 (en) | 2009-03-13 | 2012-02-07 | Kla-Tencor Corp. | Methods and systems for generating an inspection process for a wafer |
US8781781B2 (en) | 2010-07-30 | 2014-07-15 | Kla-Tencor Corp. | Dynamic care areas |
US8453088B2 (en) | 2010-09-27 | 2013-05-28 | Teseda Corporation | Suspect logical region synthesis and simulation using device design and test information |
US9170211B2 (en) | 2011-03-25 | 2015-10-27 | Kla-Tencor Corp. | Design-based inspection using repeating structures |
CN102385843A (zh) * | 2011-08-11 | 2012-03-21 | 上海华碧检测技术有限公司 | 一种液晶面板显示驱动芯片的电性分析方法 |
US8907697B2 (en) | 2011-08-31 | 2014-12-09 | Teseda Corporation | Electrical characterization for a semiconductor device pin |
US9939488B2 (en) | 2011-08-31 | 2018-04-10 | Teseda Corporation | Field triage of EOS failures in semiconductor devices |
US9087367B2 (en) | 2011-09-13 | 2015-07-21 | Kla-Tencor Corp. | Determining design coordinates for wafer defects |
US8831334B2 (en) | 2012-01-20 | 2014-09-09 | Kla-Tencor Corp. | Segmentation for wafer inspection |
US8826200B2 (en) | 2012-05-25 | 2014-09-02 | Kla-Tencor Corp. | Alteration for wafer inspection |
US9189844B2 (en) | 2012-10-15 | 2015-11-17 | Kla-Tencor Corp. | Detecting defects on a wafer using defect-specific information |
US9053527B2 (en) | 2013-01-02 | 2015-06-09 | Kla-Tencor Corp. | Detecting defects on a wafer |
US9134254B2 (en) | 2013-01-07 | 2015-09-15 | Kla-Tencor Corp. | Determining a position of inspection system output in design data space |
US9311698B2 (en) | 2013-01-09 | 2016-04-12 | Kla-Tencor Corp. | Detecting defects on a wafer using template image matching |
US9092846B2 (en) | 2013-02-01 | 2015-07-28 | Kla-Tencor Corp. | Detecting defects on a wafer using defect-specific and multi-channel information |
US9865512B2 (en) | 2013-04-08 | 2018-01-09 | Kla-Tencor Corp. | Dynamic design attributes for wafer inspection |
US9310320B2 (en) | 2013-04-15 | 2016-04-12 | Kla-Tencor Corp. | Based sampling and binning for yield critical defects |
JP6917930B2 (ja) | 2018-03-15 | 2021-08-11 | キオクシア株式会社 | 不良解析装置および不良解析方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0714898A (ja) * | 1993-06-23 | 1995-01-17 | Mitsubishi Electric Corp | 半導体ウエハの試験解析装置および解析方法 |
JPH08203973A (ja) * | 1995-01-25 | 1996-08-09 | Sony Corp | 半導体装置および半導体装置の良否選別方法 |
JP3436456B2 (ja) * | 1996-06-14 | 2003-08-11 | 三菱電機株式会社 | エミッション顕微鏡による半導体装置の故障解析方法及び半導体装置故障解析システム |
JPH1167853A (ja) * | 1997-08-26 | 1999-03-09 | Mitsubishi Electric Corp | ウェーハマップ解析補助システムおよびウェーハマップ解析方法 |
JP3995768B2 (ja) * | 1997-10-02 | 2007-10-24 | 株式会社ルネサステクノロジ | 不良解析方法及びその装置 |
US6476913B1 (en) * | 1998-11-30 | 2002-11-05 | Hitachi, Ltd. | Inspection method, apparatus and system for circuit pattern |
JP2001267389A (ja) * | 2000-03-21 | 2001-09-28 | Hiroshima Nippon Denki Kk | 半導体メモリ生産システム及び半導体メモリ生産方法 |
JP3767677B2 (ja) * | 2000-10-24 | 2006-04-19 | 富士通株式会社 | 半導体試験データ処理方法 |
JP4146074B2 (ja) * | 2000-11-28 | 2008-09-03 | 株式会社アドバンテスト | フェイル解析装置 |
JP2002217252A (ja) * | 2001-01-22 | 2002-08-02 | Nec Yamagata Ltd | マーキングプローバーシステム、マーキング方法及び半導体装置の製造方法 |
JP2002237506A (ja) * | 2001-02-09 | 2002-08-23 | Mitsubishi Electric Corp | 故障解析装置及び故障解析方法、並びに半導体装置の製造方法 |
JP2005109056A (ja) * | 2003-09-30 | 2005-04-21 | Matsushita Electric Ind Co Ltd | 半導体素子の検査装置 |
-
2004
- 2004-06-07 JP JP2004168939A patent/JP4347751B2/ja not_active Expired - Fee Related
- 2004-06-16 US US10/869,821 patent/US7071833B2/en active Active
-
2005
- 2005-06-03 WO PCT/JP2005/010265 patent/WO2005122239A1/ja not_active Application Discontinuation
- 2005-06-03 EP EP05751421A patent/EP1755158A4/en not_active Withdrawn
- 2005-06-07 TW TW094118700A patent/TWI370256B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20050270165A1 (en) | 2005-12-08 |
TW200604544A (en) | 2006-02-01 |
WO2005122239A1 (ja) | 2005-12-22 |
JP4347751B2 (ja) | 2009-10-21 |
EP1755158A1 (en) | 2007-02-21 |
JP2005347713A (ja) | 2005-12-15 |
EP1755158A4 (en) | 2010-06-16 |
US7071833B2 (en) | 2006-07-04 |
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