JP4333686B2 - アクチュエータ装置及び液体噴射ヘッド並びに液体噴射装置 - Google Patents
アクチュエータ装置及び液体噴射ヘッド並びに液体噴射装置 Download PDFInfo
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- JP4333686B2 JP4333686B2 JP2006102353A JP2006102353A JP4333686B2 JP 4333686 B2 JP4333686 B2 JP 4333686B2 JP 2006102353 A JP2006102353 A JP 2006102353A JP 2006102353 A JP2006102353 A JP 2006102353A JP 4333686 B2 JP4333686 B2 JP 4333686B2
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- 239000007788 liquid Substances 0.000 title claims description 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 83
- 239000000758 substrate Substances 0.000 claims description 53
- 229910052697 platinum Inorganic materials 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 23
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- 239000000956 alloy Substances 0.000 claims description 17
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 239000011651 chromium Substances 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
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- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 238000001459 lithography Methods 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
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- 230000008021 deposition Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 159
- 239000010410 layer Substances 0.000 description 94
- 239000010936 titanium Substances 0.000 description 49
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 39
- 229910052719 titanium Inorganic materials 0.000 description 38
- 230000001681 protective effect Effects 0.000 description 24
- 239000011133 lead Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
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- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
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- 239000010703 silicon Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052746 lanthanum Inorganic materials 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
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- 239000000853 adhesive Substances 0.000 description 3
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
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- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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- 229910052737 gold Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
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- 150000004706 metal oxides Chemical class 0.000 description 2
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- 239000010955 niobium Substances 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
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- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
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- 238000000354 decomposition reaction Methods 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
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- 238000011049 filling Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
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- 239000002344 surface layer Substances 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
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- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/16—Production of nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14419—Manifold
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
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Description
かかる第1の態様では、下電極をヤング率が200GPa以上の高硬度とすることで、圧電素子を繰り返し駆動することによって、下電極の展性が失われて塑性変形することなく、圧電素子の変位低下を防止することができる。
かかる第2の態様では、下電極として、白金、酸素及びその他の金属の合金を用いることで、所望の硬度の下電極とすることができると共に、優れた導電性を保持させることができる。
かかる第3の態様では、下電極に用いる合金の白金とチタンとの比を規定することで、所望の硬度を得ることができる。
かかる第4の態様では、下電極に用いる合金の白金と鉛との比を規定することで、所望の硬度を得ることができる。
かかる第5の態様では、下電極に所定の金属を用いることで、所望の硬度の下電極とすることができると共に、優れた導電性を保持させることができる。
かかる第6の態様では、所定硬度の下電極を振動板の一部として機能させることで、圧電素子の優れた変位を維持させることができる。
かかる第7の態様では、優れた変位特性を有する圧電素子を得ることができると共に、圧電素子の高密度化を図ることができる。
かかる第8の態様では、圧電素子の変位低下による液滴の噴射特性の低下を防止して、耐久性及び信頼性を向上した液体噴射ヘッドを実現できる。
かかる第9の態様では、耐久性及び信頼性を向上した液体噴射装置を実現できる。
(実施形態1)
図1は、本発明の実施形態1に係るインクジェット式記録ヘッドの概略構成を示す分解斜視図であり、図2は、インクジェット式記録ヘッドの要部平面図及びそのA−A′断面図である。
以上、本発明の各実施形態について説明したが、本発明の基本的構成は上述した実施形態に限定されるものではない。例えば、上述した実施形態1のインクジェット式記録ヘッドの製造方法では、密着層61としてチタン(Ti)を用いたため、下電極膜60として、密着層61及び白金層62を設けるようにしたが、密着層61としてチタン(Ti)以外の金属、例えば、クロム(Cr)、タンタル(Ta)、ジルコニウム(Zr)及びタングステン(W)等を用いた場合には、密着層61上にチタン(Ti)からなり厚さが5〜50nmの金属層を設けるようにすれば、上述した実施形態1と同様に、下電極膜60のチタンの白金に対する含有率を3〜30%とすることができる。
Claims (6)
- 基板上に振動板を介して変位自在に設けられた下電極、圧電体層及び上電極からなる圧電素子を具備し、
前記下電極のヤング率が200Gpa以上であって、前記下電極の靭性(MN/m 2/3 )が前記振動板の靭性(MN/m 2/3 )以上であることを特徴とするアクチュエータ装置。 - 前記下電極が、白金、酸素及びその他の金属で構成される合金からなることを特徴とする請求項1記載のアクチュエータ装置。
- 前記下電極の主成分が、モリブデン、タンタル、イリジウム、バナジウム、タングステン及びクロムから選択される少なくとも一種の金属であることを特徴とする請求項1記載のアクチュエータ装置。
- 前記圧電素子の各層が、成膜及びリソグラフィ法により形成されていることを特徴とする請求項1〜3の何れかに記載のアクチュエータ装置。
- 請求項1〜4の何れかに記載のアクチュエータ装置をノズル開口から液体を噴射させるための圧力変化を生じさせる圧力発生手段として具備することを特徴とする液体噴射ヘッド。
- 請求項5記載の液体噴射ヘッドを具備することを特徴とする液体噴射装置。
Priority Applications (3)
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JP2006102353A JP4333686B2 (ja) | 2006-04-03 | 2006-04-03 | アクチュエータ装置及び液体噴射ヘッド並びに液体噴射装置 |
CN200710091649A CN100595942C (zh) | 2006-04-03 | 2007-04-03 | 驱动装置、液体喷头及液体喷射装置 |
US11/730,645 US7810915B2 (en) | 2006-04-03 | 2007-04-03 | Actuator device, liquid-jet head and liquid-jet apparatus |
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JP4811266B2 (ja) * | 2006-12-20 | 2011-11-09 | 富士ゼロックス株式会社 | 液滴吐出ヘッド、画像形成装置及び液滴吐出ヘッドの製造方法 |
KR101113479B1 (ko) * | 2006-12-27 | 2012-02-29 | 삼성전기주식회사 | 비수용성 잉크를 사용하는 잉크젯 프린트헤드 |
US7755656B2 (en) * | 2007-03-15 | 2010-07-13 | Hewlett-Packard Development Company, L.P. | Systems and methods for adjusting loading of media onto a print surface |
JP2009220310A (ja) * | 2008-03-13 | 2009-10-01 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
JP5641185B2 (ja) * | 2010-01-05 | 2014-12-17 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
JP5852822B2 (ja) * | 2011-01-07 | 2016-02-03 | 学校法人 関西大学 | アクチュエータ及びアクチュエータの駆動方法 |
JP6074130B2 (ja) * | 2011-03-24 | 2017-02-01 | セイコーエプソン株式会社 | 圧電素子の製造方法、圧電素子、液体噴射ヘッド及び液体噴射装置 |
US8866367B2 (en) | 2011-10-17 | 2014-10-21 | The United States Of America As Represented By The Secretary Of The Army | Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making |
US9761785B2 (en) | 2011-10-17 | 2017-09-12 | The United States Of America As Represented By The Secretary Of The Army | Stylo-epitaxial piezoelectric and ferroelectric devices and method of manufacturing |
JP6318682B2 (ja) * | 2014-02-19 | 2018-05-09 | セイコーエプソン株式会社 | 圧電アクチュエーター、及び液体噴射ヘッド |
JP6708412B2 (ja) * | 2016-01-06 | 2020-06-10 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
JP6714851B2 (ja) * | 2016-06-28 | 2020-07-01 | セイコーエプソン株式会社 | Memsデバイス、液体噴射ヘッド、memsデバイスの製造方法、及び、液体噴射ヘッドの製造方法 |
US10707832B2 (en) * | 2016-09-01 | 2020-07-07 | Tdk Corporation | Vibrating device |
CN109819152B (zh) * | 2019-02-27 | 2022-07-01 | 维沃移动通信有限公司 | 对焦摄像模组及终端设备 |
CN115425155A (zh) * | 2022-09-09 | 2022-12-02 | 深圳黑晶光电技术有限公司 | 一种钙钛矿太阳能电池组件的加工方法 |
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EP0991130B1 (en) * | 1998-03-04 | 2007-12-12 | Seiko Epson Corporation | Piezoelectric device, ink-jet recording head, method for manufacture, and printer |
JP2000307164A (ja) | 1999-04-21 | 2000-11-02 | Matsushita Electric Ind Co Ltd | 薄板圧電素子、それを用いた圧電音響素子、圧電振動子、圧電アクチュエータ、圧電トランス及びそれを用いた冷陰極蛍光灯駆動回路 |
CN1310757C (zh) | 1999-05-24 | 2007-04-18 | 松下电器产业株式会社 | 墨水喷射头及其制造方法 |
JP4268354B2 (ja) | 2001-09-13 | 2009-05-27 | 日本碍子株式会社 | 圧電/電歪素子 |
US7235917B2 (en) | 2004-08-10 | 2007-06-26 | Canon Kabushiki Kaisha | Piezoelectric member element and liquid discharge head comprising element thereof |
US7381353B2 (en) * | 2005-03-09 | 2008-06-03 | E.I. Du Pont De Nemours And Company | Black conductive thick film compositions, black electrodes, and methods of forming thereof |
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JP2007281032A (ja) | 2007-10-25 |
US20080074473A1 (en) | 2008-03-27 |
CN101051669A (zh) | 2007-10-10 |
US7810915B2 (en) | 2010-10-12 |
CN100595942C (zh) | 2010-03-24 |
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