JP4313414B2 - ピックアンドプレース装置 - Google Patents
ピックアンドプレース装置 Download PDFInfo
- Publication number
- JP4313414B2 JP4313414B2 JP2008017372A JP2008017372A JP4313414B2 JP 4313414 B2 JP4313414 B2 JP 4313414B2 JP 2008017372 A JP2008017372 A JP 2008017372A JP 2008017372 A JP2008017372 A JP 2008017372A JP 4313414 B2 JP4313414 B2 JP 4313414B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- pick
- unit
- elevating
- fastening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Automatic Assembly (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
- De-Stacking Of Articles (AREA)
- Transmission Devices (AREA)
Description
12・・・支持ブロック
14・・・弾発スプリング
16・・・チップピッカー
18・・・ピックアップユニット
20・・・昇降フレーム
22・・・サーボモータ
24・・・昇降ユニット
26・・・締結ユニット
28・・・上部支持フレーム
30・・・移動レール
32・・・真空ライン
34・・・アウターレール
36・・・下部支持フレーム
38・・・ラックブロック
40・・・昇降レール
42・・・ピニオンブロック
44・・・回転軸
46・・・締結コア
48・・・ソレノイド
50・・・整列バー
52・・・緩衝パッド
54・・・空圧装置
56・・・ブラケット
58・・・整列スプリング
Claims (6)
- ピックアンドプレースシステムに備えられる固定フレーム(10)内に設置され固定された構造物を提供する支持ブロック(12)と、
前記支持ブロック(12)を貫通してスライディングしながら昇降または下降可能に設置される移動レール(30)、前記移動レール(30)の一側端部にパッケージを吸着するために設置されたピッカー(16)、前記移動レール(30)の上側に設置された上部支持フレーム(28)を備えるピックアップユニット(18)と、
前記ピックアップユニット(18)を上下に移動させる昇降フレーム(20)、この昇降フレーム(20)を駆動するためのサーボモータ(22)、及び前記サーボモータ(22)の動力を昇降フレーム(20)に伝達して昇降フレーム(20)を上下に駆動するための動力伝達手段を備える昇降ユニット(24)と、および、
前記昇降フレーム(20)に、前記上部支持フレーム(28)から突出するように形成された締結コア(46)と、前記上部支持フレーム(28)に形成され前記締結コア(46)を収容するように形成されるソレノイド(48)からなる締結ユニット(26)と、を備え、
前記移動レール(30)の外側には、前記支持ブロック(12)に一側が支持され、他側が上部支持フレーム(28)に支持される弾発スプリング(14)が形成され、
前記締結ユニット(26)のソレノイド(48)と前記締結コア(46)との締結力は、ピックアップユニット(18)がピックアップ工程の位置を超えて移動する場合の弾発スプリング(14)の反発力より小さく設定されることを特徴とするピックアンドプレース装置。 - 前記ピックアップユニット(18)は、前記移動レール(30)の下側に固定されて前記上部支持フレーム(28)と共にフレーム形状をなす下部支持フレーム(36)を含んで構成されることを特徴とする請求項1に記載のピックアンドプレース装置。
- 前記動力伝達手段は、前記昇降フレーム(20)の下側から延長され、内側にはラックギヤが形成され、支持ブロック(12)を貫通するスライディングしながら昇降又は下降運動がガイドされるラックブロック(38)と、前記サーボモータ(22)に接続され、前記ラックギヤに噛み合うことによりサーボモータ(22)の動力を伝達するピニオンが形成されたピニオンブロック(42)からなることを特徴とする請求項1または請求項2に記載のピックアンドプレース装置。
- 前記昇降フレーム(20)のラックブロック(38)の外側には、支持ブロック(12)を貫通してスライディングしながら昇降または下降運動可能な昇降レール(40)がさらに形成されていることを特徴とする請求項3に記載のピックアンドプレース装置。
- 前記固定フレーム(10)の上側には、この前記固定フレーム(10)に対して回転可能にヒンジ締結される整列バー(50)が設置され、前記固定フレーム(10)と前記整列バー(50)の間には整列スプリング(58)が設置されることにより、前記ピックアップユニット(18)のピックアップ工程待機の位置で前記整列スプリング(58)により整列バー(50)が上部支持フレーム(28)を下方に加圧することを特徴とする請求項1または2に記載のピックアンドプレース装置。
- 前記昇降フレーム(20)の上側には、上部支持フレーム(28)との衝撃を緩衝するための緩衝パッド(52)が設置されていることを特徴とする請求項1または2に記載のピックアンドプレース装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070050175A KR100820328B1 (ko) | 2007-05-23 | 2007-05-23 | 픽 앤 플레이스 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008294400A JP2008294400A (ja) | 2008-12-04 |
JP4313414B2 true JP4313414B2 (ja) | 2009-08-12 |
Family
ID=39534133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008017372A Expired - Fee Related JP4313414B2 (ja) | 2007-05-23 | 2008-01-29 | ピックアンドプレース装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4313414B2 (ja) |
KR (1) | KR100820328B1 (ja) |
CN (1) | CN101312142B (ja) |
SG (1) | SG148087A1 (ja) |
TW (1) | TWI365018B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101017674B1 (ko) * | 2008-05-23 | 2011-02-25 | (주)아이콘 | 픽 앤 플레이스 장치 |
KR101361494B1 (ko) * | 2009-11-12 | 2014-02-14 | (주)테크윙 | 픽앤플레이스장치 |
JP5415349B2 (ja) * | 2010-04-22 | 2014-02-12 | ヒーハイスト精工株式会社 | 微小部品配置ユニット |
KR101438977B1 (ko) | 2012-12-31 | 2014-09-11 | 현대자동차주식회사 | 다중 독립 이동 시스템 |
JP2014184998A (ja) | 2013-03-22 | 2014-10-02 | Dainippon Screen Mfg Co Ltd | 板状被搬送物の受渡方法、受渡装置およびパターン形成装置 |
KR101870394B1 (ko) * | 2017-03-24 | 2018-06-22 | ㈜토니텍 | 반도체 패키지용 픽커장치 |
KR102302618B1 (ko) * | 2019-12-27 | 2021-09-16 | 삼일테크(주) | 반도체 칩 이송용 피커 어셈블리 |
JP7498674B2 (ja) * | 2021-01-18 | 2024-06-12 | Towa株式会社 | 搬送機構、切断装置及び切断品の製造方法 |
-
2007
- 2007-05-23 KR KR1020070050175A patent/KR100820328B1/ko active IP Right Grant
-
2008
- 2008-01-29 JP JP2008017372A patent/JP4313414B2/ja not_active Expired - Fee Related
- 2008-01-29 CN CN2008100092027A patent/CN101312142B/zh not_active Expired - Fee Related
- 2008-01-31 SG SG200800903-7A patent/SG148087A1/en unknown
- 2008-02-01 TW TW097104137A patent/TWI365018B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI365018B (en) | 2012-05-21 |
CN101312142B (zh) | 2011-03-09 |
KR100820328B1 (ko) | 2008-04-08 |
JP2008294400A (ja) | 2008-12-04 |
CN101312142A (zh) | 2008-11-26 |
TW200847862A (en) | 2008-12-01 |
SG148087A1 (en) | 2008-12-31 |
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