KR101017674B1 - 픽 앤 플레이스 장치 - Google Patents
픽 앤 플레이스 장치 Download PDFInfo
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- KR101017674B1 KR101017674B1 KR1020080047851A KR20080047851A KR101017674B1 KR 101017674 B1 KR101017674 B1 KR 101017674B1 KR 1020080047851 A KR1020080047851 A KR 1020080047851A KR 20080047851 A KR20080047851 A KR 20080047851A KR 101017674 B1 KR101017674 B1 KR 101017674B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (3)
- 픽 앤 플레이스 시스템에 설치되어 고정된 구조물을 제공하는 지지블럭(12)과; 이 지지블럭(12)을 관통하여 슬라이딩되면서 승강가능하게 설치됨과 더불어, 상기 지지블럭(12)으로부터 상승위치를 보유지지하기 위해 상기 지지블럭을 지지점으로 탄발스프링(14)이 설치되며, 팩키지를 픽업하기 위한 피커(16)가 포함된 픽업유닛(18)과; 일렬로 배치된 상기 픽업유닛(18)들 사이를 가로질러 마련된 승강프레임(20) 및 이 승강프레임(20)에 설치되고 랙/피니언이 매개되어 상기 승강프레임(20)을 승강시키는 서보모터(22)를 포함하는 승강유닛(24)과; 상기 승강유닛(24)의 승강시 연동되어 상기 배치된 픽업유닛(18)들이 선택적으로 승강되도록 상기 픽업유닛(18)을 전원단속에 의해 선택적으로 상기 승강프레임(20)에 결속시키는 결속유닛(26)과; 상기 픽업유닛에서 상기 픽업된 패키지를 회전시키기 위하여 상기 피커(16)를 포함하는 공압라인(32)에 설치된 회전유닛(100)으로 이루어진 픽 앤 플레이스 장치에 있어서,상기 픽업유닛(18)은 승강프레임(20)을 가로지르는 방향으로 상부지지프레임(28)이 마련되고, 이 상부지지프레임(28)의 양단에 승강레일(30)이 설치되고 어느 하나의 승강레일에는 진공라인(32)이 형성되어 하단부에 피커(16)가 설치되며 상단부는 공압장치와 연결된 외부의 진공라인(32)과 로타리 조인트(102)로 연결되는 한편, 상기 진공라인(32)이 형성된 승강레일(30)은 지지블럭을 관통하여 승강이동경로가 보유지지되면서 회동되도록 상기 승강레일(30)의 외주에 스플라인구(104)가 설치되고 스플라인구(104)는 베어링(106)이 매개되어 지지블럭(12)에 설치됨과 더불어, 상기 승강레일(30)의 하단에 하부지지프레임이 설치되고, 상기 상부지지프레임과 하부지지프레임에서 상기 진공라인(32)이 형성된 승강레일(30) 설치부분에는 상기 승강레일(30)의 회전을 위하여 베어링(107)이 매개되며;상기 회전유닛(100)은 상기 픽업유닛(18)의 승강과 함께 회전을 보유지지하기 위하여 상기 픽업유닛(18)의 승강레일(30)에 설치된 스플라인구(104) 외주에 피동기어(108)가 설치되고, 상기 지지블럭(12)에는 피동기어(108)를 구동시키는 구동기어(110)를 갖는 구동모우터(112)가 설치되며, 상기 피동기어(108)와 구동기어(110)는 기어벨트(114)로 연결되어 이루어진 것을 특징으로 하는 픽 앤 플레이스 장치.
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020080047851A KR101017674B1 (ko) | 2008-05-23 | 2008-05-23 | 픽 앤 플레이스 장치 |
Applications Claiming Priority (1)
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KR1020080047851A KR101017674B1 (ko) | 2008-05-23 | 2008-05-23 | 픽 앤 플레이스 장치 |
Publications (2)
Publication Number | Publication Date |
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KR20090121781A KR20090121781A (ko) | 2009-11-26 |
KR101017674B1 true KR101017674B1 (ko) | 2011-02-25 |
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KR1020080047851A KR101017674B1 (ko) | 2008-05-23 | 2008-05-23 | 픽 앤 플레이스 장치 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200470543Y1 (ko) | 2009-12-14 | 2013-12-23 | 세메스 주식회사 | 기판 픽업 장치 및 이를 포함하는 기판 소잉 장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102302618B1 (ko) * | 2019-12-27 | 2021-09-16 | 삼일테크(주) | 반도체 칩 이송용 피커 어셈블리 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100730594B1 (ko) * | 2006-06-08 | 2007-06-20 | 세크론 주식회사 | 소잉소터 시스템의 칩 피커 장치 |
KR100820328B1 (ko) * | 2007-05-23 | 2008-04-08 | (주)아이콘 | 픽 앤 플레이스 장치 |
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- 2008-05-23 KR KR1020080047851A patent/KR101017674B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100730594B1 (ko) * | 2006-06-08 | 2007-06-20 | 세크론 주식회사 | 소잉소터 시스템의 칩 피커 장치 |
KR100820328B1 (ko) * | 2007-05-23 | 2008-04-08 | (주)아이콘 | 픽 앤 플레이스 장치 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200470543Y1 (ko) | 2009-12-14 | 2013-12-23 | 세메스 주식회사 | 기판 픽업 장치 및 이를 포함하는 기판 소잉 장치 |
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