JP4308314B2 - パターン化された基板上にルテニウム金属層を形成する方法 - Google Patents
パターン化された基板上にルテニウム金属層を形成する方法 Download PDFInfo
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- JP4308314B2 JP4308314B2 JP2008501891A JP2008501891A JP4308314B2 JP 4308314 B2 JP4308314 B2 JP 4308314B2 JP 2008501891 A JP2008501891 A JP 2008501891A JP 2008501891 A JP2008501891 A JP 2008501891A JP 4308314 B2 JP4308314 B2 JP 4308314B2
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- ruthenium
- substrate
- metal layer
- gas
- vapor
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- 239000000758 substrate Substances 0.000 title claims description 123
- 238000000034 method Methods 0.000 title claims description 103
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 title claims description 69
- 239000002243 precursor Substances 0.000 claims description 120
- 239000007789 gas Substances 0.000 claims description 106
- 238000012545 processing Methods 0.000 claims description 81
- 229910052707 ruthenium Inorganic materials 0.000 claims description 79
- 230000008569 process Effects 0.000 claims description 64
- 238000000151 deposition Methods 0.000 claims description 34
- 238000000231 atomic layer deposition Methods 0.000 claims description 26
- 230000008021 deposition Effects 0.000 claims description 22
- 230000004888 barrier function Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000002230 thermal chemical vapour deposition Methods 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 5
- 238000010926 purge Methods 0.000 claims description 5
- ITWBWJFEJCHKSN-UHFFFAOYSA-N 1,4,7-triazonane Chemical compound C1CNCCNCCN1 ITWBWJFEJCHKSN-UHFFFAOYSA-N 0.000 claims description 2
- WYILUGVDWAFRSG-UHFFFAOYSA-N 2,4-dimethylpenta-1,3-diene;ruthenium(2+) Chemical compound [Ru+2].CC(C)=CC(C)=[CH-].CC(C)=CC(C)=[CH-] WYILUGVDWAFRSG-UHFFFAOYSA-N 0.000 claims description 2
- OXJUCLBTTSNHOF-UHFFFAOYSA-N 5-ethylcyclopenta-1,3-diene;ruthenium(2+) Chemical compound [Ru+2].CC[C-]1C=CC=C1.CC[C-]1C=CC=C1 OXJUCLBTTSNHOF-UHFFFAOYSA-N 0.000 claims description 2
- XOSBQSGUNCVAIL-UHFFFAOYSA-N CC(=C[Ru]C1(C=CC=C1)CC)C=C(C)C Chemical compound CC(=C[Ru]C1(C=CC=C1)CC)C=C(C)C XOSBQSGUNCVAIL-UHFFFAOYSA-N 0.000 claims description 2
- -1 pentadienyl Chemical group 0.000 claims description 2
- KHGFCRAFGVKXQK-UHFFFAOYSA-N CC1(C=CC=C1)[Ru] Chemical compound CC1(C=CC=C1)[Ru] KHGFCRAFGVKXQK-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 103
- 238000009826 distribution Methods 0.000 description 39
- 229910052751 metal Inorganic materials 0.000 description 39
- 239000002184 metal Substances 0.000 description 39
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 33
- 229910052739 hydrogen Inorganic materials 0.000 description 32
- 239000001257 hydrogen Substances 0.000 description 32
- 239000010408 film Substances 0.000 description 25
- 239000010949 copper Substances 0.000 description 20
- 238000001704 evaporation Methods 0.000 description 18
- 230000008020 evaporation Effects 0.000 description 18
- 239000012159 carrier gas Substances 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000010790 dilution Methods 0.000 description 8
- 239000012895 dilution Substances 0.000 description 8
- 239000012530 fluid Substances 0.000 description 6
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- 239000007788 liquid Substances 0.000 description 4
- 239000012705 liquid precursor Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
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- 238000009713 electroplating Methods 0.000 description 3
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- 230000007246 mechanism Effects 0.000 description 3
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- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000010948 rhodium Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- BZORFPDSXLZWJF-UHFFFAOYSA-N N,N-dimethyl-1,4-phenylenediamine Chemical compound CN(C)C1=CC=C(N)C=C1 BZORFPDSXLZWJF-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052743 krypton Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052754 neon Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- QJRXYAQPTRTMEE-UHFFFAOYSA-N CC(=C[Ru]C1(C=CC=C1)C)C=C(C)C Chemical compound CC(=C[Ru]C1(C=CC=C1)C)C=C(C)C QJRXYAQPTRTMEE-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- NQZFAUXPNWSLBI-UHFFFAOYSA-N carbon monoxide;ruthenium Chemical group [Ru].[Ru].[Ru].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-].[O+]#[C-] NQZFAUXPNWSLBI-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000012702 metal oxide precursor Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000005036 potential barrier Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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Description
成膜システムの処理チャンバ内に、パターン化された基板を提供するステップであって、前記パターン化された基板は、1もしくは2以上のビアもしくは溝またはこれらの組み合わせを有するステップと、
原子層成膜処理法で、前記基板上に、第1のルテニウム金属層を成膜するステップと、
熱化学気相成膜処理法で、前記第1のルテニウム金属層の上部に、第2のルテニウム金属層を成膜するステップと、
を有する。
成膜システムの処理チャンバ内に、パターン化された基板を提供するステップであって、前記パターン化された基板は、1もしくは2以上のビアもしくは溝またはこれらの組み合わせを有するステップと、
プラズマ中で、a)ルテニウム有機金属前駆体、およびb)水素含有ガスに、前記基板を交互に暴露するステップを有するプラズマ加速原子層成膜処理法で、前記基板上に、第1のルテニウム金属層を成膜するステップと、
熱化学気相成膜処理法において、ルテニウム有機金属前駆体および水素含有ガスに、前記基板を同時に暴露することにより、前記第1のルテニウム金属層上に、第2のルテニウム金属層を成膜するステップと、
を有する。
成膜システムの処理チャンバ内に、パターン化された基板を提供するステップであって、前記パターン化された基板は、1もしくは2以上のビアもしくは溝またはこれらの組み合わせを有するステップと、
原子層成膜処理法で、前記基板上に、第1のルテニウム金属層を成膜するステップであって、前記原子層成膜処理法は、a)ルテニウム有機金属前駆体、およびb)水素含有ガスに、前記基板を交互に暴露する、熱原子層成膜処理法を有するステップと、
熱化学気相成膜処理法において、ルテニウム有機金属前駆体および水素含有ガスに、前記基板を暴露することにより、前記第1のルテニウム金属層上に、第2のルテニウム金属層を成膜するステップと、
を有する。
Claims (9)
- ルテニウム金属層を形成する方法であって、
成膜システムの処理チャンバ内に、パターン化された基板を提供するステップであって、前記パターン化された基板は、1もしくは2以上のビアもしくは溝またはこれらの組み合わせを有するステップと、
前記パターン化された基板を、第1の温度に加熱して、前記処理チャンバ内に、第1の圧力を形成するステップと、
前記第1の温度および前記第1の圧力を維持したまま、原子層成膜処理法で、前記パターン化された基板上に、第1のルテニウム金属層を成膜するステップであって、第1の、前記基板をルテニウム有機金属前駆体に暴露するステップと、第2の、前記基板をH 2 および/またはNH 3 ガスに暴露するステップとの交互ステップを有するステップと、
前記第1の温度からより高温の第2の温度まで、前記パターン化された基板の温度を高め、前記第1の圧力からより高圧の第2の圧力まで、前記処理チャンバ内の圧力を高めるステップと、
前記第2の温度および前記第2の圧力を維持したまま、熱化学気相成膜処理法で、前記第1のルテニウム金属層の上部に、第2のルテニウム金属層を成膜するステップであって、前記パターン化された基板を、ルテニウム有機金属前駆体と、H 2 および/またはNH 3 ガスとに同時に暴露するステップを有するステップと、
を有する方法。 - 前記第1のルテニウム金属層を成膜するステップは、プラズマ加速原子層成膜処理法を含み、
前記第2の暴露ステップは、前記H 2 および/またはNH 3 ガスのプラズマに、前記基板を暴露するステップを有することを特徴とする請求項1に記載の方法。 - さらに、
前記交互の暴露ステップの間に、前記処理チャンバを不活性ガスでパージするステップを有することを特徴とする請求項1に記載の方法。 - 前記第1および第2の交互の暴露ステップは、所望の回数だけ実施され、厚さが約1乃至10nmの前記第1のルテニウム金属層が成膜されることを特徴とする請求項1に記載の方法。
- 前記第1のルテニウム金属層を成膜するステップは、熱原子層成膜処理法を有することを特徴とする請求項1に記載の方法。
- 前記第2のルテニウム金属層の厚さは、前記第1のルテニウム金属層の厚さよりも厚いことを特徴とする請求項1に記載の方法。
- 前記第1および第2のルテニウム金属層は、(2,4−ジメチルペンタジエニル)(エチルシクロペンタジエニル)ルテニウム、ビス(2,4−ジメチルペンタジエニル)ルテニウム、(2,4−ジメチルペンタジエニル)(メチルシクロペンタジエニル)ルテニウム、ビス(エチルシクロペンタジエニル)ルテニウム、およびこれらの組み合わせのうちの少なくとも一つを含む、ルテニウム有機金属前駆体から成膜されることを特徴とする請求項1に記載の方法。
- 前記第1の圧力は、約5mTorrから約500mTorrの間であり、前記第2の圧力は、約500mTorrから約30Torrの間であることを特徴とする請求項1に記載の方法。
- さらに、前記パターン化された基板は、該基板上に形成されたバリア層を有し、該バリア層の上に、前記第1のルテニウム金属層が成膜され、
前記バリア層は、Ta、TaN、TaCN、W、WN、またはこれらの組み合わせであることを特徴とする請求項1に記載の方法。
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US10/907,022 US7273814B2 (en) | 2005-03-16 | 2005-03-16 | Method for forming a ruthenium metal layer on a patterned substrate |
PCT/US2006/006031 WO2006101646A1 (en) | 2005-03-16 | 2006-02-21 | Method for forming a ruthenium metal layer on a patterned substrate |
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JP2008538126A JP2008538126A (ja) | 2008-10-09 |
JP2008538126A5 JP2008538126A5 (ja) | 2009-04-09 |
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US (1) | US7273814B2 (ja) |
JP (1) | JP4308314B2 (ja) |
KR (1) | KR101069299B1 (ja) |
CN (1) | CN100514599C (ja) |
TW (1) | TWI307139B (ja) |
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US20060211228A1 (en) | 2006-09-21 |
US7273814B2 (en) | 2007-09-25 |
KR20070112190A (ko) | 2007-11-22 |
TWI307139B (en) | 2009-03-01 |
KR101069299B1 (ko) | 2011-10-05 |
TW200717709A (en) | 2007-05-01 |
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