JP4297614B2 - モデル予測制御を用いた、半導体製作における個別部品の生産を制御するための方法およびコントローラ装置 - Google Patents

モデル予測制御を用いた、半導体製作における個別部品の生産を制御するための方法およびコントローラ装置 Download PDF

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Publication number
JP4297614B2
JP4297614B2 JP2000557182A JP2000557182A JP4297614B2 JP 4297614 B2 JP4297614 B2 JP 4297614B2 JP 2000557182 A JP2000557182 A JP 2000557182A JP 2000557182 A JP2000557182 A JP 2000557182A JP 4297614 B2 JP4297614 B2 JP 4297614B2
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tool
semiconductor manufacturing
wafer
model
input
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JP2002519779A (ja
JP2002519779A5 (https=
Inventor
キャンベル，ウィリアム・ジェイ
マリンズ，ジェイムズ・エイ
トプラック，アンソニー・ジェイ
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • General Factory Administration (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2000557182A 1998-06-26 1998-12-18 モデル予測制御を用いた、半導体製作における個別部品の生産を制御するための方法およびコントローラ装置 Expired - Lifetime JP4297614B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/105,979 US6230069B1 (en) 1998-06-26 1998-06-26 System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
US09/105,979 1998-06-26
PCT/US1998/027074 WO2000000874A1 (en) 1998-06-26 1998-12-18 System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control

Related Child Applications (1)

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JP2007088643A Division JP4880512B2 (ja) 1998-06-26 2007-03-29 モデル予測制御を用いた、半導体製作における個別部品の生産を制御するための方法およびコントローラ装置

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JP2002519779A JP2002519779A (ja) 2002-07-02
JP2002519779A5 JP2002519779A5 (https=) 2006-02-02
JP4297614B2 true JP4297614B2 (ja) 2009-07-15

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JP2000557182A Expired - Lifetime JP4297614B2 (ja) 1998-06-26 1998-12-18 モデル予測制御を用いた、半導体製作における個別部品の生産を制御するための方法およびコントローラ装置
JP2007088643A Expired - Lifetime JP4880512B2 (ja) 1998-06-26 2007-03-29 モデル予測制御を用いた、半導体製作における個別部品の生産を制御するための方法およびコントローラ装置

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Country Link
US (1) US6230069B1 (https=)
EP (1) EP1090335B1 (https=)
JP (2) JP4297614B2 (https=)
KR (1) KR100572039B1 (https=)
DE (1) DE69811742T2 (https=)
WO (1) WO2000000874A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031090A1 (ja) * 2011-09-01 2013-03-07 信越半導体株式会社 シリコンウェーハの研磨方法及び研磨装置

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JP2013055143A (ja) * 2011-09-01 2013-03-21 Shin Etsu Handotai Co Ltd シリコンウェーハの研磨方法及び研磨装置

Also Published As

Publication number Publication date
KR20010053210A (ko) 2001-06-25
DE69811742T2 (de) 2003-12-04
JP2002519779A (ja) 2002-07-02
WO2000000874A1 (en) 2000-01-06
DE69811742D1 (de) 2003-04-03
US6230069B1 (en) 2001-05-08
JP2007281460A (ja) 2007-10-25
EP1090335A1 (en) 2001-04-11
JP4880512B2 (ja) 2012-02-22
EP1090335B1 (en) 2003-02-26
KR100572039B1 (ko) 2006-04-18

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