JP4287378B2 - アクセス可能なコンポーネントを含むスマートカードおよびその製造方法 - Google Patents

アクセス可能なコンポーネントを含むスマートカードおよびその製造方法 Download PDF

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Publication number
JP4287378B2
JP4287378B2 JP2004547703A JP2004547703A JP4287378B2 JP 4287378 B2 JP4287378 B2 JP 4287378B2 JP 2004547703 A JP2004547703 A JP 2004547703A JP 2004547703 A JP2004547703 A JP 2004547703A JP 4287378 B2 JP4287378 B2 JP 4287378B2
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JP
Japan
Prior art keywords
component
microcircuit
smart card
accessible
support film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004547703A
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English (en)
Japanese (ja)
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JP2006504193A (ja
Inventor
ローネイ，フランソワ
ベナンブル，ジャック
Original Assignee
オベルトゥル カード システムズ ソシエテ アノニム
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Application filed by オベルトゥル カード システムズ ソシエテ アノニム filed Critical オベルトゥル カード システムズ ソシエテ アノニム
Publication of JP2006504193A publication Critical patent/JP2006504193A/ja
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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Credit Cards Or The Like (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Ceramic Capacitors (AREA)
  • Details Of Resistors (AREA)
JP2004547703A 2002-10-28 2003-10-23 アクセス可能なコンポーネントを含むスマートカードおよびその製造方法 Expired - Lifetime JP4287378B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0213465A FR2846446B1 (fr) 2002-10-28 2002-10-28 Carte a puce comportant un composant debouchant et un procede de fabrication
PCT/FR2003/003139 WO2004040507A1 (fr) 2002-10-28 2003-10-23 Carte a puce comportant un composant debouchant et un procede de fabrication

Publications (2)

Publication Number Publication Date
JP2006504193A JP2006504193A (ja) 2006-02-02
JP4287378B2 true JP4287378B2 (ja) 2009-07-01

Family

ID=32088335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004547703A Expired - Lifetime JP4287378B2 (ja) 2002-10-28 2003-10-23 アクセス可能なコンポーネントを含むスマートカードおよびその製造方法

Country Status (12)

Country Link
US (1) US9792541B2 (fr)
EP (1) EP1556832B1 (fr)
JP (1) JP4287378B2 (fr)
CN (1) CN100424722C (fr)
AT (1) ATE349049T1 (fr)
AU (1) AU2003285440A1 (fr)
CA (1) CA2503688C (fr)
DE (1) DE60310599T2 (fr)
ES (1) ES2276132T3 (fr)
FR (1) FR2846446B1 (fr)
MX (1) MXPA05004469A (fr)
WO (1) WO2004040507A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2428445B (en) 2005-07-20 2009-01-28 Multiclip Co Ltd Device, method and apparatus for lifting a railway rail
FR2997535B1 (fr) 2012-10-30 2016-07-08 Oberthur Technologies Procede de fabrication d'une carte a puce a plusieurs composants et carte ainsi obtenue
EP2973238B1 (fr) * 2013-03-14 2019-08-07 X-Card Holdings, LLC Carte porteuse d'informations pour afficher des mots de passe à usage unique, et son procédé de fabrication
US10789524B2 (en) 2013-09-08 2020-09-29 Amatech Group Limited Smartcard with a booster antenna and a wireless connection between modules
US11410010B2 (en) 2014-08-21 2022-08-09 Amatech Group Limiied Smartcard with a coupling frame and a wireless connection between modules
FR3115904B1 (fr) * 2020-10-30 2023-11-17 Linxens Holding Procédé de fabrication d’un module de carte à puce avec composant électronique soudé

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61157990A (ja) * 1984-12-29 1986-07-17 Kyodo Printing Co Ltd Ｉｃカ−ド
EP0234954A3 (en) * 1986-02-28 1988-04-27 Intellicard International, Inc. Magnetic card with identification code
JPH0437596A (ja) * 1990-06-01 1992-02-07 Toshiba Corp 配線基板装置
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
DE19805282A1 (de) * 1998-02-10 1999-08-19 Siemens Ag Flächiger Träger mit einer Anzeigeeinrichtung
FR2776796B1 (fr) * 1998-03-31 2000-12-01 Gemplus Card Int Procede de fabrication de cartes a puce
US6239976B1 (en) * 1998-11-24 2001-05-29 Comsense Technologies, Ltd. Reinforced micromodule
FR2789505B1 (fr) * 1999-02-08 2001-03-09 Gemplus Card Int Procede de fabrication de support de memorisation portable de type carte a puce

Also Published As

Publication number Publication date
FR2846446A1 (fr) 2004-04-30
CA2503688C (fr) 2011-06-28
DE60310599D1 (de) 2007-02-01
WO2004040507A1 (fr) 2004-05-13
WO2004040507A8 (fr) 2005-05-19
CN1708770A (zh) 2005-12-14
CA2503688A1 (fr) 2004-05-13
EP1556832B1 (fr) 2006-12-20
AU2003285440A1 (en) 2004-05-25
ES2276132T3 (es) 2007-06-16
EP1556832A2 (fr) 2005-07-27
US20060237542A1 (en) 2006-10-26
MXPA05004469A (es) 2005-11-23
JP2006504193A (ja) 2006-02-02
ATE349049T1 (de) 2007-01-15
CN100424722C (zh) 2008-10-08
US9792541B2 (en) 2017-10-17
DE60310599T2 (de) 2007-10-25
FR2846446B1 (fr) 2005-02-18

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