ATE349049T1 - Chipkarte mit einem auftauchenden bauelement und herstellungsverfahren - Google Patents

Chipkarte mit einem auftauchenden bauelement und herstellungsverfahren

Info

Publication number
ATE349049T1
ATE349049T1 AT03778441T AT03778441T ATE349049T1 AT E349049 T1 ATE349049 T1 AT E349049T1 AT 03778441 T AT03778441 T AT 03778441T AT 03778441 T AT03778441 T AT 03778441T AT E349049 T1 ATE349049 T1 AT E349049T1
Authority
AT
Austria
Prior art keywords
component
production method
chip card
microcircuit
appearance component
Prior art date
Application number
AT03778441T
Other languages
English (en)
Inventor
Francois Launay
Jacques Venambre
Original Assignee
Oberthur Card Syst Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Card Syst Sa filed Critical Oberthur Card Syst Sa
Application granted granted Critical
Publication of ATE349049T1 publication Critical patent/ATE349049T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Credit Cards Or The Like (AREA)
  • Ceramic Capacitors (AREA)
  • Details Of Resistors (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
AT03778441T 2002-10-28 2003-10-23 Chipkarte mit einem auftauchenden bauelement und herstellungsverfahren ATE349049T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0213465A FR2846446B1 (fr) 2002-10-28 2002-10-28 Carte a puce comportant un composant debouchant et un procede de fabrication

Publications (1)

Publication Number Publication Date
ATE349049T1 true ATE349049T1 (de) 2007-01-15

Family

ID=32088335

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03778441T ATE349049T1 (de) 2002-10-28 2003-10-23 Chipkarte mit einem auftauchenden bauelement und herstellungsverfahren

Country Status (12)

Country Link
US (1) US9792541B2 (de)
EP (1) EP1556832B1 (de)
JP (1) JP4287378B2 (de)
CN (1) CN100424722C (de)
AT (1) ATE349049T1 (de)
AU (1) AU2003285440A1 (de)
CA (1) CA2503688C (de)
DE (1) DE60310599T2 (de)
ES (1) ES2276132T3 (de)
FR (1) FR2846446B1 (de)
MX (1) MXPA05004469A (de)
WO (1) WO2004040507A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8371225B2 (en) 2005-07-20 2013-02-12 Multiclip Co. Ltd. Device, method, and apparatus for lifting a railway rail

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2997535B1 (fr) 2012-10-30 2016-07-08 Oberthur Technologies Procede de fabrication d'une carte a puce a plusieurs composants et carte ainsi obtenue
US20170243104A1 (en) * 2013-03-14 2017-08-24 X-Card Holdings, Llc Information carrying card for displaying one time passcodes, and method of making the same
US10789524B2 (en) 2013-09-08 2020-09-29 Amatech Group Limited Smartcard with a booster antenna and a wireless connection between modules
US11410010B2 (en) 2014-08-21 2022-08-09 Amatech Group Limiied Smartcard with a coupling frame and a wireless connection between modules
FR3115904B1 (fr) * 2020-10-30 2023-11-17 Linxens Holding Procédé de fabrication d’un module de carte à puce avec composant électronique soudé

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61157990A (ja) * 1984-12-29 1986-07-17 Kyodo Printing Co Ltd Ｉｃカ−ド
EP0234954A3 (en) * 1986-02-28 1988-04-27 Intellicard International, Inc. Magnetic card with identification code
JPH0437596A (ja) * 1990-06-01 1992-02-07 Toshiba Corp 配線基板装置
US5581445A (en) * 1994-02-14 1996-12-03 Us3, Inc. Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module
DE19805282A1 (de) * 1998-02-10 1999-08-19 Siemens Ag Flächiger Träger mit einer Anzeigeeinrichtung
FR2776796B1 (fr) * 1998-03-31 2000-12-01 Gemplus Card Int Procede de fabrication de cartes a puce
US6239976B1 (en) * 1998-11-24 2001-05-29 Comsense Technologies, Ltd. Reinforced micromodule
FR2789505B1 (fr) * 1999-02-08 2001-03-09 Gemplus Card Int Procede de fabrication de support de memorisation portable de type carte a puce

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8371225B2 (en) 2005-07-20 2013-02-12 Multiclip Co. Ltd. Device, method, and apparatus for lifting a railway rail

Also Published As

Publication number Publication date
AU2003285440A1 (en) 2004-05-25
US9792541B2 (en) 2017-10-17
WO2004040507A1 (fr) 2004-05-13
CN1708770A (zh) 2005-12-14
ES2276132T3 (es) 2007-06-16
CN100424722C (zh) 2008-10-08
FR2846446A1 (fr) 2004-04-30
US20060237542A1 (en) 2006-10-26
CA2503688A1 (fr) 2004-05-13
JP2006504193A (ja) 2006-02-02
CA2503688C (fr) 2011-06-28
EP1556832B1 (de) 2006-12-20
EP1556832A2 (de) 2005-07-27
WO2004040507A8 (fr) 2005-05-19
JP4287378B2 (ja) 2009-07-01
DE60310599D1 (de) 2007-02-01
FR2846446B1 (fr) 2005-02-18
DE60310599T2 (de) 2007-10-25
MXPA05004469A (es) 2005-11-23

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties