JP4282539B2 - 基板処理装置および半導体装置の製造方法 - Google Patents

基板処理装置および半導体装置の製造方法 Download PDF

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Publication number
JP4282539B2
JP4282539B2 JP2004133372A JP2004133372A JP4282539B2 JP 4282539 B2 JP4282539 B2 JP 4282539B2 JP 2004133372 A JP2004133372 A JP 2004133372A JP 2004133372 A JP2004133372 A JP 2004133372A JP 4282539 B2 JP4282539 B2 JP 4282539B2
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Prior art keywords
substrate
cooling gas
boat
process tube
pod
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Expired - Fee Related
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JP2004133372A
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Japanese (ja)
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JP2005317734A (ja
JP2005317734A5 (enExample
Inventor
正昭 上野
真一 島田
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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JP2004133372A 2004-04-28 2004-04-28 基板処理装置および半導体装置の製造方法 Expired - Fee Related JP4282539B2 (ja)

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JP2004133372A JP4282539B2 (ja) 2004-04-28 2004-04-28 基板処理装置および半導体装置の製造方法

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JP2004133372A JP4282539B2 (ja) 2004-04-28 2004-04-28 基板処理装置および半導体装置の製造方法

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JP2005317734A JP2005317734A (ja) 2005-11-10
JP2005317734A5 JP2005317734A5 (enExample) 2007-06-14
JP4282539B2 true JP4282539B2 (ja) 2009-06-24

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101814243B1 (ko) * 2014-03-24 2018-01-02 가부시키가이샤 히다치 고쿠사이 덴키 반응관, 기판 처리 장치 및 반도체 장치의 제조 방법
US20210305072A1 (en) * 2020-03-24 2021-09-30 Nissin Ion Equipment Co., Ltd. Substrate cooling device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5117856B2 (ja) * 2005-08-05 2013-01-16 株式会社日立国際電気 基板処理装置、冷却ガス供給ノズルおよび半導体装置の製造方法
KR100929815B1 (ko) 2007-12-27 2009-12-07 세메스 주식회사 냉각 장치 및 이를 이용한 기판 냉각 방법
JP5658463B2 (ja) * 2009-02-27 2015-01-28 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP6257000B2 (ja) * 2014-09-30 2018-01-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および反応管
CN113451183B (zh) * 2020-06-03 2023-03-31 重庆康佳光电技术研究院有限公司 一种晶圆盒

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101814243B1 (ko) * 2014-03-24 2018-01-02 가부시키가이샤 히다치 고쿠사이 덴키 반응관, 기판 처리 장치 및 반도체 장치의 제조 방법
US20210305072A1 (en) * 2020-03-24 2021-09-30 Nissin Ion Equipment Co., Ltd. Substrate cooling device

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