JP4261374B2 - 積層構造体及びその製造方法、並びに、超音波トランスデューサ - Google Patents

積層構造体及びその製造方法、並びに、超音波トランスデューサ Download PDF

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Publication number
JP4261374B2
JP4261374B2 JP2004003946A JP2004003946A JP4261374B2 JP 4261374 B2 JP4261374 B2 JP 4261374B2 JP 2004003946 A JP2004003946 A JP 2004003946A JP 2004003946 A JP2004003946 A JP 2004003946A JP 4261374 B2 JP4261374 B2 JP 4261374B2
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JP
Japan
Prior art keywords
substrate
electrode layer
layer
columnar structures
laminated structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004003946A
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English (en)
Japanese (ja)
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JP2005198152A (ja
JP2005198152A5 (enExample
Inventor
利明 国安
弘 前田
和弘 西田
隆行 藤原
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Fujifilm Corp
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Fujifilm Corp
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Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2004003946A priority Critical patent/JP4261374B2/ja
Priority to US11/030,069 priority patent/US7199509B2/en
Publication of JP2005198152A publication Critical patent/JP2005198152A/ja
Publication of JP2005198152A5 publication Critical patent/JP2005198152A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/064—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface with multiple active layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/28—Details, e.g. general constructional or apparatus details providing acoustic coupling, e.g. water
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H10N30/874—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices embedded within piezoelectric or electrostrictive material, e.g. via connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/106—Number of transducers one or more transducer arrays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/268—Monolayer with structurally defined element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP2004003946A 2004-01-09 2004-01-09 積層構造体及びその製造方法、並びに、超音波トランスデューサ Expired - Fee Related JP4261374B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004003946A JP4261374B2 (ja) 2004-01-09 2004-01-09 積層構造体及びその製造方法、並びに、超音波トランスデューサ
US11/030,069 US7199509B2 (en) 2004-01-09 2005-01-07 Multilayered structure and method of manufacturing the same, and ultrasonic transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004003946A JP4261374B2 (ja) 2004-01-09 2004-01-09 積層構造体及びその製造方法、並びに、超音波トランスデューサ

Publications (3)

Publication Number Publication Date
JP2005198152A JP2005198152A (ja) 2005-07-21
JP2005198152A5 JP2005198152A5 (enExample) 2006-07-13
JP4261374B2 true JP4261374B2 (ja) 2009-04-30

Family

ID=34818702

Family Applications (1)

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JP2004003946A Expired - Fee Related JP4261374B2 (ja) 2004-01-09 2004-01-09 積層構造体及びその製造方法、並びに、超音波トランスデューサ

Country Status (2)

Country Link
US (1) US7199509B2 (enExample)
JP (1) JP4261374B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7378776B2 (en) * 2005-09-06 2008-05-27 Ariose Electronics Co. Ltd. Piezoelectric ceramic composition and piezoelectric elements using the same
US7886801B2 (en) * 2006-11-08 2011-02-15 National Research Council Of Canada Apparatus and process for stacking pieces of material
SG154342A1 (en) * 2008-01-08 2009-08-28 Opulent Electronics Internat P Insulated metal substrate fabrication
US8286492B2 (en) * 2009-12-09 2012-10-16 The Boeing Company Mode decomposition of sound waves using amplitude matching
US9166141B2 (en) * 2011-09-09 2015-10-20 Dvx, Llc Process of manufacturing a piezopolymer transducer with matching layer
US9530955B2 (en) 2011-11-18 2016-12-27 Acist Medical Systems, Inc. Ultrasound transducer and processing methods thereof
JP5874416B2 (ja) * 2012-01-31 2016-03-02 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法およびパワーモジュール用基板
US9536511B2 (en) 2013-12-31 2017-01-03 Acist Medical Systems, Inc. Ultrasound transducer stack
US9987809B2 (en) * 2014-12-31 2018-06-05 General Electric Company System and method for manufacturing an ultrasound probe lens
US11333016B2 (en) 2020-01-22 2022-05-17 Halliburton Energy Services, Inc. Ultrasonic transducer for measuring wellbore characteristics

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4803763A (en) * 1986-08-28 1989-02-14 Nippon Soken, Inc. Method of making a laminated piezoelectric transducer
JP3352140B2 (ja) 1993-03-31 2002-12-03 オリンパス光学工業株式会社 誘電体積層部品とその製造方法
JPH09261978A (ja) * 1996-03-25 1997-10-03 Nippon Cement Co Ltd 積層体素子および振動駆動装置
DE19757877A1 (de) * 1997-12-24 1999-07-01 Bosch Gmbh Robert Verfahren zur Herstellung piezoelektrischer Aktoren und piezoelektrischer Aktor

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Publication number Publication date
US20060154075A1 (en) 2006-07-13
JP2005198152A (ja) 2005-07-21
US7199509B2 (en) 2007-04-03

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