JP4241675B2 - 回路パターン形成装置および回路パターン形成方法 - Google Patents

回路パターン形成装置および回路パターン形成方法 Download PDF

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Publication number
JP4241675B2
JP4241675B2 JP2005181625A JP2005181625A JP4241675B2 JP 4241675 B2 JP4241675 B2 JP 4241675B2 JP 2005181625 A JP2005181625 A JP 2005181625A JP 2005181625 A JP2005181625 A JP 2005181625A JP 4241675 B2 JP4241675 B2 JP 4241675B2
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JP
Japan
Prior art keywords
solution
conductive
insulating
dots
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005181625A
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English (en)
Japanese (ja)
Other versions
JP2007005426A (ja
JP2007005426A5 (enExample
Inventor
孝志 毛利
裕二 鶴岡
雅朗 古川
誠一 神谷
敦人 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2005181625A priority Critical patent/JP4241675B2/ja
Priority to US11/455,637 priority patent/US7775177B2/en
Publication of JP2007005426A publication Critical patent/JP2007005426A/ja
Publication of JP2007005426A5 publication Critical patent/JP2007005426A5/ja
Application granted granted Critical
Publication of JP4241675B2 publication Critical patent/JP4241675B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2005181625A 2005-06-22 2005-06-22 回路パターン形成装置および回路パターン形成方法 Expired - Fee Related JP4241675B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005181625A JP4241675B2 (ja) 2005-06-22 2005-06-22 回路パターン形成装置および回路パターン形成方法
US11/455,637 US7775177B2 (en) 2005-06-22 2006-06-20 Circuit pattern forming device and circuit pattern forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005181625A JP4241675B2 (ja) 2005-06-22 2005-06-22 回路パターン形成装置および回路パターン形成方法

Publications (3)

Publication Number Publication Date
JP2007005426A JP2007005426A (ja) 2007-01-11
JP2007005426A5 JP2007005426A5 (enExample) 2007-05-17
JP4241675B2 true JP4241675B2 (ja) 2009-03-18

Family

ID=37565774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005181625A Expired - Fee Related JP4241675B2 (ja) 2005-06-22 2005-06-22 回路パターン形成装置および回路パターン形成方法

Country Status (2)

Country Link
US (1) US7775177B2 (enExample)
JP (1) JP4241675B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8147903B2 (en) * 2005-06-22 2012-04-03 Canon Kabushiki Kaisha Circuit pattern forming method, circuit pattern forming device and printed circuit board
JP4241675B2 (ja) 2005-06-22 2009-03-18 キヤノン株式会社 回路パターン形成装置および回路パターン形成方法
US7867561B2 (en) * 2005-06-22 2011-01-11 Canon Kabushiki Kaisha Circuit pattern forming method and circuit pattern forming device
JP5023764B2 (ja) * 2007-03-30 2012-09-12 ブラザー工業株式会社 パターン形成方法及びパターン形成装置。
US10091891B2 (en) * 2014-07-11 2018-10-02 Voltera Inc. Apparatus and method for printing circuitry
US10414092B2 (en) * 2015-02-09 2019-09-17 Voltera Inc. Interchangeable fabrication head assembly
US10847887B2 (en) * 2017-10-05 2020-11-24 Eastman Kodak Company Method for fabricating a transparent antenna
CN111164828B (zh) * 2017-10-05 2021-12-03 伊斯曼柯达公司 透明天线
DE102021121778A1 (de) 2021-08-23 2023-02-23 Notion Systems GmbH Verfahren zum Drucken wenigstens einer präzisen Linie mittels Inkjet-Druck
WO2025242276A1 (en) * 2024-05-20 2025-11-27 Abb Schweiz Ag Method of providing electrically conductive pattern, and control system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163499A (ja) 1997-11-28 1999-06-18 Nitto Boseki Co Ltd プリント配線板の製造方法及びこの製造方法によるプリント配線板
JP4741045B2 (ja) 1998-03-25 2011-08-03 セイコーエプソン株式会社 電気回路、その製造方法および電気回路製造装置
JP2003318133A (ja) 2002-04-22 2003-11-07 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、半導体チップの実装構造、半導体装置、発光装置、電気光学装置、電子機器、並びに非接触型カード媒体
DE60323313D1 (de) * 2002-10-03 2008-10-16 Canon Kk Verfahren, Vorrichtung und Programm zum Tintenstrahldrucken
JP4227395B2 (ja) * 2002-11-14 2009-02-18 キヤノン株式会社 液滴吐出状態判定方法及び装置とインクジェットプリンタ及びそのプログラムと記憶媒体
US8147903B2 (en) 2005-06-22 2012-04-03 Canon Kabushiki Kaisha Circuit pattern forming method, circuit pattern forming device and printed circuit board
JP4241675B2 (ja) 2005-06-22 2009-03-18 キヤノン株式会社 回路パターン形成装置および回路パターン形成方法
US7867561B2 (en) 2005-06-22 2011-01-11 Canon Kabushiki Kaisha Circuit pattern forming method and circuit pattern forming device

Also Published As

Publication number Publication date
US20060288932A1 (en) 2006-12-28
US7775177B2 (en) 2010-08-17
JP2007005426A (ja) 2007-01-11

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