JP2007005426A5 - - Google Patents

Download PDF

Info

Publication number
JP2007005426A5
JP2007005426A5 JP2005181625A JP2005181625A JP2007005426A5 JP 2007005426 A5 JP2007005426 A5 JP 2007005426A5 JP 2005181625 A JP2005181625 A JP 2005181625A JP 2005181625 A JP2005181625 A JP 2005181625A JP 2007005426 A5 JP2007005426 A5 JP 2007005426A5
Authority
JP
Japan
Prior art keywords
dots
insulating
conductive
base material
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005181625A
Other languages
English (en)
Japanese (ja)
Other versions
JP4241675B2 (ja
JP2007005426A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005181625A priority Critical patent/JP4241675B2/ja
Priority claimed from JP2005181625A external-priority patent/JP4241675B2/ja
Priority to US11/455,637 priority patent/US7775177B2/en
Publication of JP2007005426A publication Critical patent/JP2007005426A/ja
Publication of JP2007005426A5 publication Critical patent/JP2007005426A5/ja
Application granted granted Critical
Publication of JP4241675B2 publication Critical patent/JP4241675B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005181625A 2005-06-22 2005-06-22 回路パターン形成装置および回路パターン形成方法 Expired - Fee Related JP4241675B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005181625A JP4241675B2 (ja) 2005-06-22 2005-06-22 回路パターン形成装置および回路パターン形成方法
US11/455,637 US7775177B2 (en) 2005-06-22 2006-06-20 Circuit pattern forming device and circuit pattern forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005181625A JP4241675B2 (ja) 2005-06-22 2005-06-22 回路パターン形成装置および回路パターン形成方法

Publications (3)

Publication Number Publication Date
JP2007005426A JP2007005426A (ja) 2007-01-11
JP2007005426A5 true JP2007005426A5 (enExample) 2007-05-17
JP4241675B2 JP4241675B2 (ja) 2009-03-18

Family

ID=37565774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005181625A Expired - Fee Related JP4241675B2 (ja) 2005-06-22 2005-06-22 回路パターン形成装置および回路パターン形成方法

Country Status (2)

Country Link
US (1) US7775177B2 (enExample)
JP (1) JP4241675B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8147903B2 (en) * 2005-06-22 2012-04-03 Canon Kabushiki Kaisha Circuit pattern forming method, circuit pattern forming device and printed circuit board
US7867561B2 (en) * 2005-06-22 2011-01-11 Canon Kabushiki Kaisha Circuit pattern forming method and circuit pattern forming device
JP4241675B2 (ja) 2005-06-22 2009-03-18 キヤノン株式会社 回路パターン形成装置および回路パターン形成方法
JP5023764B2 (ja) * 2007-03-30 2012-09-12 ブラザー工業株式会社 パターン形成方法及びパターン形成装置。
US10091891B2 (en) * 2014-07-11 2018-10-02 Voltera Inc. Apparatus and method for printing circuitry
US10414092B2 (en) * 2015-02-09 2019-09-17 Voltera Inc. Interchangeable fabrication head assembly
US10847887B2 (en) * 2017-10-05 2020-11-24 Eastman Kodak Company Method for fabricating a transparent antenna
CN111164828B (zh) * 2017-10-05 2021-12-03 伊斯曼柯达公司 透明天线
DE102021121778A1 (de) 2021-08-23 2023-02-23 Notion Systems GmbH Verfahren zum Drucken wenigstens einer präzisen Linie mittels Inkjet-Druck
WO2025242276A1 (en) * 2024-05-20 2025-11-27 Abb Schweiz Ag Method of providing electrically conductive pattern, and control system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163499A (ja) 1997-11-28 1999-06-18 Nitto Boseki Co Ltd プリント配線板の製造方法及びこの製造方法によるプリント配線板
JP4741045B2 (ja) 1998-03-25 2011-08-03 セイコーエプソン株式会社 電気回路、その製造方法および電気回路製造装置
JP2003318133A (ja) 2002-04-22 2003-11-07 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、半導体チップの実装構造、半導体装置、発光装置、電気光学装置、電子機器、並びに非接触型カード媒体
EP1405724B1 (en) * 2002-10-03 2008-09-03 Canon Kabushiki Kaisha Ink-jet printing method, ink-jet printing apparatus, and program
JP4227395B2 (ja) * 2002-11-14 2009-02-18 キヤノン株式会社 液滴吐出状態判定方法及び装置とインクジェットプリンタ及びそのプログラムと記憶媒体
US8147903B2 (en) * 2005-06-22 2012-04-03 Canon Kabushiki Kaisha Circuit pattern forming method, circuit pattern forming device and printed circuit board
US7867561B2 (en) * 2005-06-22 2011-01-11 Canon Kabushiki Kaisha Circuit pattern forming method and circuit pattern forming device
JP4241675B2 (ja) 2005-06-22 2009-03-18 キヤノン株式会社 回路パターン形成装置および回路パターン形成方法

Similar Documents

Publication Publication Date Title
JP2006334995A5 (enExample)
JP2011056942A5 (enExample)
KR102167813B1 (ko) 시험 패턴 및 통전 프로브를 이용하여 3차원 대상체 인쇄에서의 미작동 잉크젯들 검출시스템
JP2008520474A5 (enExample)
JP2018024144A5 (enExample)
JP2011011382A5 (ja) 記録装置の制御方法
US9056465B2 (en) Ink-jet print head with integrated optical monitoring of the nozzle function
JP2012035477A5 (ja) 記録装置及び記録方法
JP2005199696A5 (enExample)
JP2011126174A5 (ja) インクジェット記録装置および予備吐出発数の決定方法
JP2005169628A5 (enExample)
JP2007005426A5 (enExample)
JP2007176112A5 (enExample)
US20120249639A1 (en) Liquid ejecting apparatus and method of controlling the same
JP2011161897A5 (ja) インクジェット記録装置及びインクジェット記録装置の制御方法
JP2006341518A5 (enExample)
JP5485987B2 (ja) 印刷のための物体検出
JP2011520667A5 (enExample)
KR102182440B1 (ko) 광학센서 및 가역 열적 기판들을 이용하여 3차원 대상물 인쇄에서의 미작동 잉크젯들 검출시스템
JP5986122B2 (ja) 吐出検出装置、吐出検出方法、及び印刷装置
JP2008193061A5 (enExample)
EP1642724A3 (en) A droplet ejection apparatus, a method of using the same
JPH10193643A5 (enExample)
JP2020097232A (ja) 液体吐出装置
JP2007301771A5 (enExample)