JP4238772B2 - 載置台構造及び熱処理装置 - Google Patents

載置台構造及び熱処理装置 Download PDF

Info

Publication number
JP4238772B2
JP4238772B2 JP2004130294A JP2004130294A JP4238772B2 JP 4238772 B2 JP4238772 B2 JP 4238772B2 JP 2004130294 A JP2004130294 A JP 2004130294A JP 2004130294 A JP2004130294 A JP 2004130294A JP 4238772 B2 JP4238772 B2 JP 4238772B2
Authority
JP
Japan
Prior art keywords
mounting table
cover member
quartz glass
opaque
column
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004130294A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004356624A (ja
JP2004356624A5 (es
Inventor
裕雄 川崎
輝夫 岩田
学 網倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004130294A priority Critical patent/JP4238772B2/ja
Publication of JP2004356624A publication Critical patent/JP2004356624A/ja
Publication of JP2004356624A5 publication Critical patent/JP2004356624A5/ja
Application granted granted Critical
Publication of JP4238772B2 publication Critical patent/JP4238772B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004130294A 2003-05-07 2004-04-26 載置台構造及び熱処理装置 Expired - Fee Related JP4238772B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004130294A JP4238772B2 (ja) 2003-05-07 2004-04-26 載置台構造及び熱処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003129249 2003-05-07
JP2004130294A JP4238772B2 (ja) 2003-05-07 2004-04-26 載置台構造及び熱処理装置

Publications (3)

Publication Number Publication Date
JP2004356624A JP2004356624A (ja) 2004-12-16
JP2004356624A5 JP2004356624A5 (es) 2006-08-03
JP4238772B2 true JP4238772B2 (ja) 2009-03-18

Family

ID=34067005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004130294A Expired - Fee Related JP4238772B2 (ja) 2003-05-07 2004-04-26 載置台構造及び熱処理装置

Country Status (1)

Country Link
JP (1) JP4238772B2 (es)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672597B2 (ja) * 2005-06-02 2011-04-20 日本碍子株式会社 基板処理装置
JP2007157552A (ja) * 2005-12-06 2007-06-21 Ge Speciality Materials Japan Kk 石英ガラス製加熱装置
KR20080078905A (ko) 2006-01-13 2008-08-28 니뽄 가이시 가부시키가이샤 히터의 지지 구조
JP2007311726A (ja) * 2006-05-22 2007-11-29 Sharp Corp 気相成長装置および気相成長方法。
JP5347214B2 (ja) * 2006-06-12 2013-11-20 東京エレクトロン株式会社 載置台構造及び熱処理装置
US20110266274A1 (en) * 2006-11-27 2011-11-03 Toshiki Ebata Quartz encapsulated heater assembly
JP5029257B2 (ja) 2007-01-17 2012-09-19 東京エレクトロン株式会社 載置台構造及び処理装置
JP4992630B2 (ja) * 2007-09-19 2012-08-08 東京エレクトロン株式会社 載置台構造及び処理装置
KR100943427B1 (ko) * 2008-02-04 2010-02-19 주식회사 유진테크 기판지지유닛 및 기판처리장치, 그리고 기판지지유닛을제조하는 방법
JP5352103B2 (ja) * 2008-03-27 2013-11-27 東京エレクトロン株式会社 熱処理装置および処理システム
JP5249689B2 (ja) * 2008-09-16 2013-07-31 東京エレクトロン株式会社 プラズマ処理装置および基板載置台
US8613288B2 (en) * 2009-12-18 2013-12-24 Lam Research Ag High temperature chuck and method of using same
JP5299359B2 (ja) * 2010-06-11 2013-09-25 信越半導体株式会社 エピタキシャル成長装置
JP2012028428A (ja) * 2010-07-21 2012-02-09 Tokyo Electron Ltd 載置台構造及び処理装置
WO2012067239A1 (ja) * 2010-11-19 2012-05-24 京セラ株式会社 載置用部材およびこれを用いた温度制御載置装置
US9984866B2 (en) 2012-06-12 2018-05-29 Component Re-Engineering Company, Inc. Multiple zone heater
JP5807160B2 (ja) * 2012-12-13 2015-11-10 パナソニックＩｐマネジメント株式会社 ノンプラズマドライエッチング装置
US10593521B2 (en) * 2013-03-12 2020-03-17 Applied Materials, Inc. Substrate support for plasma etch operations
TWI632589B (zh) * 2013-03-15 2018-08-11 康波能再造工程公司 供使用於半導體製造製程的晶圓夾頭
KR101678677B1 (ko) * 2015-05-11 2016-11-22 이새봄 기판 히팅 플레이트 및 이를 적용하는 기판 가열 장치
KR101771217B1 (ko) * 2015-06-01 2017-09-05 주식회사 좋은기술 기판 히팅 플레이트 및 이를 적용하는 기판 가열 장치
JP7057103B2 (ja) * 2017-02-14 2022-04-19 日本特殊陶業株式会社 加熱装置
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
TWI782441B (zh) * 2020-03-25 2022-11-01 日商國際電氣股份有限公司 基板處理裝置、基板載置台蓋及半導體裝置之製造方法

Also Published As

Publication number Publication date
JP2004356624A (ja) 2004-12-16

Similar Documents

Publication Publication Date Title
JP4238772B2 (ja) 載置台構造及び熱処理装置
KR100744860B1 (ko) 탑재대 구조체 및 이 탑재대 구조체를 갖는 열처리 장치
JP5347214B2 (ja) 載置台構造及び熱処理装置
JP4222086B2 (ja) 熱処理装置
US6301434B1 (en) Apparatus and method for CVD and thermal processing of semiconductor substrates
KR100335970B1 (ko) 열처리 장치
JP4889683B2 (ja) 成膜装置
KR101312676B1 (ko) 액티브 냉각 기판 지지체
JP4380236B2 (ja) 載置台及び熱処理装置
KR100881786B1 (ko) 처리 장치
KR101084830B1 (ko) 탑재대 구조체
US7429717B2 (en) Multizone heater for furnace
JP2010109316A (ja) 載置台構造及び処理装置
JPH08236451A (ja) 半導体基板のエッジ成膜の制御
JPH04294526A (ja) 半導体処理装置のための処理容器パージ・モジュールおよび反応性処理気体をパージするための方法
KR100705170B1 (ko) 막 형성 장치
JP2004533117A (ja) 基板サポートアセンブリと基板処理用装置
US8361549B2 (en) Power loading substrates to reduce particle contamination
KR20210025702A (ko) 램프헤드에서의 다중구역 램프 제어 및 개별 램프 제어
JP2012023073A (ja) 基板処理装置および基板の製造方法
JP2007141895A (ja) 載置台構造及び成膜装置
JP2009149964A (ja) 載置台構造及び熱処理装置
KR101585924B1 (ko) 탄화규소 써멀 화학기상증착장치의 가스반응로
JP5376023B2 (ja) 載置台構造及び熱処理装置
US6254687B1 (en) Chemical vapor deposition system with reduced material deposition on chamber wall surfaces

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060616

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060616

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20061003

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080826

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081022

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20081125

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20081208

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120109

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120109

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150109

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees