JP2004356624A5 - - Google Patents

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Publication number
JP2004356624A5
JP2004356624A5 JP2004130294A JP2004130294A JP2004356624A5 JP 2004356624 A5 JP2004356624 A5 JP 2004356624A5 JP 2004130294 A JP2004130294 A JP 2004130294A JP 2004130294 A JP2004130294 A JP 2004130294A JP 2004356624 A5 JP2004356624 A5 JP 2004356624A5
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JP
Japan
Prior art keywords
mounting table
cover member
structure according
table structure
opaque
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Application number
JP2004130294A
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English (en)
Japanese (ja)
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JP2004356624A (ja
JP4238772B2 (ja
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Priority to JP2004130294A priority Critical patent/JP4238772B2/ja
Priority claimed from JP2004130294A external-priority patent/JP4238772B2/ja
Publication of JP2004356624A publication Critical patent/JP2004356624A/ja
Publication of JP2004356624A5 publication Critical patent/JP2004356624A5/ja
Application granted granted Critical
Publication of JP4238772B2 publication Critical patent/JP4238772B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004130294A 2003-05-07 2004-04-26 載置台構造及び熱処理装置 Expired - Fee Related JP4238772B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004130294A JP4238772B2 (ja) 2003-05-07 2004-04-26 載置台構造及び熱処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003129249 2003-05-07
JP2004130294A JP4238772B2 (ja) 2003-05-07 2004-04-26 載置台構造及び熱処理装置

Publications (3)

Publication Number Publication Date
JP2004356624A JP2004356624A (ja) 2004-12-16
JP2004356624A5 true JP2004356624A5 (es) 2006-08-03
JP4238772B2 JP4238772B2 (ja) 2009-03-18

Family

ID=34067005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004130294A Expired - Fee Related JP4238772B2 (ja) 2003-05-07 2004-04-26 載置台構造及び熱処理装置

Country Status (1)

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JP (1) JP4238772B2 (es)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672597B2 (ja) * 2005-06-02 2011-04-20 日本碍子株式会社 基板処理装置
JP2007157552A (ja) * 2005-12-06 2007-06-21 Ge Speciality Materials Japan Kk 石英ガラス製加熱装置
KR20080078905A (ko) 2006-01-13 2008-08-28 니뽄 가이시 가부시키가이샤 히터의 지지 구조
JP2007311726A (ja) * 2006-05-22 2007-11-29 Sharp Corp 気相成長装置および気相成長方法。
JP5347214B2 (ja) * 2006-06-12 2013-11-20 東京エレクトロン株式会社 載置台構造及び熱処理装置
US20110266274A1 (en) * 2006-11-27 2011-11-03 Toshiki Ebata Quartz encapsulated heater assembly
JP5029257B2 (ja) 2007-01-17 2012-09-19 東京エレクトロン株式会社 載置台構造及び処理装置
JP4992630B2 (ja) * 2007-09-19 2012-08-08 東京エレクトロン株式会社 載置台構造及び処理装置
KR100943427B1 (ko) * 2008-02-04 2010-02-19 주식회사 유진테크 기판지지유닛 및 기판처리장치, 그리고 기판지지유닛을제조하는 방법
JP5352103B2 (ja) * 2008-03-27 2013-11-27 東京エレクトロン株式会社 熱処理装置および処理システム
JP5249689B2 (ja) * 2008-09-16 2013-07-31 東京エレクトロン株式会社 プラズマ処理装置および基板載置台
US8613288B2 (en) * 2009-12-18 2013-12-24 Lam Research Ag High temperature chuck and method of using same
JP5299359B2 (ja) * 2010-06-11 2013-09-25 信越半導体株式会社 エピタキシャル成長装置
JP2012028428A (ja) * 2010-07-21 2012-02-09 Tokyo Electron Ltd 載置台構造及び処理装置
WO2012067239A1 (ja) * 2010-11-19 2012-05-24 京セラ株式会社 載置用部材およびこれを用いた温度制御載置装置
US9984866B2 (en) 2012-06-12 2018-05-29 Component Re-Engineering Company, Inc. Multiple zone heater
JP5807160B2 (ja) * 2012-12-13 2015-11-10 パナソニックIpマネジメント株式会社 ノンプラズマドライエッチング装置
US10593521B2 (en) * 2013-03-12 2020-03-17 Applied Materials, Inc. Substrate support for plasma etch operations
TWI632589B (zh) * 2013-03-15 2018-08-11 康波能再造工程公司 供使用於半導體製造製程的晶圓夾頭
KR101678677B1 (ko) * 2015-05-11 2016-11-22 이새봄 기판 히팅 플레이트 및 이를 적용하는 기판 가열 장치
KR101771217B1 (ko) * 2015-06-01 2017-09-05 주식회사 좋은기술 기판 히팅 플레이트 및 이를 적용하는 기판 가열 장치
JP7057103B2 (ja) * 2017-02-14 2022-04-19 日本特殊陶業株式会社 加熱装置
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
TWI782441B (zh) * 2020-03-25 2022-11-01 日商國際電氣股份有限公司 基板處理裝置、基板載置台蓋及半導體裝置之製造方法

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