JP2004356624A5 - - Google Patents
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- Publication number
- JP2004356624A5 JP2004356624A5 JP2004130294A JP2004130294A JP2004356624A5 JP 2004356624 A5 JP2004356624 A5 JP 2004356624A5 JP 2004130294 A JP2004130294 A JP 2004130294A JP 2004130294 A JP2004130294 A JP 2004130294A JP 2004356624 A5 JP2004356624 A5 JP 2004356624A5
- Authority
- JP
- Japan
- Prior art keywords
- mounting table
- cover member
- structure according
- table structure
- opaque
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (24)
前記載置台の上面、側面及び下面に、耐熱性を有する上面カバー部材、側面カバー部材、下面カバー部材をそれぞれ設けると共に、前記載置台の下面側に、耐熱性の不透明裏面カバー部材を設けたことを特徴とする載置台構造。 A mounting table on which the processing object is mounted in order to perform a predetermined heat treatment on the processing object in the processing container, and heating means for heating the processing object, and the mounting table is used as the processing container. In the mounting table structure having a support column that stands up and supports from the bottom of the
A heat-resistant top cover member, side cover member, and bottom cover member are provided on the top, side, and bottom surfaces of the mounting table, respectively, and a heat-resistant opaque back cover member is provided on the bottom surface of the mounting table. A mounting table structure characterized by
前記載置台と前記支柱とをそれぞれ石英ガラスにより形成し、前記載置台内に加熱手段を埋め込むと共に、前記支柱を円筒体状に形成し、前記加熱手段に対する給電線を前記載置台の中心部より引き出して前記円筒体状の支柱内を下方に向けて挿通させるようにしたことを特徴とする載置台構造。 A mounting table that mounts the object to be processed for performing a predetermined heat treatment on the object to be processed in the processing container, and a column that supports the mounting table upright from the bottom of the processing container. In the stand structure,
The mounting table and the support column are each formed of quartz glass, the heating unit is embedded in the mounting table, the column is formed in a cylindrical shape, and the power supply line to the heating unit is formed from the center of the mounting table. A mounting table structure that is pulled out and inserted downward in the cylindrical column.
請求項1乃至22のいずれかに記載された載置台構造と、
前記処理容器内へ所定の処理ガスを供給するガス供給手段と、
を備えたことを特徴とする熱処理装置。 A processing vessel that can be evacuated;
The mounting table structure according to any one of claims 1 to 22,
Gas supply means for supplying a predetermined processing gas into the processing container;
A heat treatment apparatus comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004130294A JP4238772B2 (en) | 2003-05-07 | 2004-04-26 | Mounting table structure and heat treatment apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003129249 | 2003-05-07 | ||
JP2004130294A JP4238772B2 (en) | 2003-05-07 | 2004-04-26 | Mounting table structure and heat treatment apparatus |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004356624A JP2004356624A (en) | 2004-12-16 |
JP2004356624A5 true JP2004356624A5 (en) | 2006-08-03 |
JP4238772B2 JP4238772B2 (en) | 2009-03-18 |
Family
ID=34067005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004130294A Expired - Fee Related JP4238772B2 (en) | 2003-05-07 | 2004-04-26 | Mounting table structure and heat treatment apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4238772B2 (en) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4672597B2 (en) * | 2005-06-02 | 2011-04-20 | 日本碍子株式会社 | Substrate processing equipment |
JP2007157552A (en) * | 2005-12-06 | 2007-06-21 | Ge Speciality Materials Japan Kk | Heating device made of quartz |
JP5134375B2 (en) | 2006-01-13 | 2013-01-30 | 日本碍子株式会社 | Heater support structure |
JP2007311726A (en) * | 2006-05-22 | 2007-11-29 | Sharp Corp | Apparatus and method for vapor deposition |
JP5347214B2 (en) * | 2006-06-12 | 2013-11-20 | 東京エレクトロン株式会社 | Mounting table structure and heat treatment apparatus |
WO2008066804A1 (en) * | 2006-11-27 | 2008-06-05 | Momentive Performance Materials Inc. | Quartz encapsulated heater assembly |
JP5029257B2 (en) | 2007-01-17 | 2012-09-19 | 東京エレクトロン株式会社 | Mounting table structure and processing device |
JP4992630B2 (en) * | 2007-09-19 | 2012-08-08 | 東京エレクトロン株式会社 | Mounting table structure and processing device |
KR100943427B1 (en) * | 2008-02-04 | 2010-02-19 | 주식회사 유진테크 | Substrate supporting unit and substrate processing apparatus, manufacturing method of the substrate supporting unit |
JP5352103B2 (en) * | 2008-03-27 | 2013-11-27 | 東京エレクトロン株式会社 | Heat treatment apparatus and treatment system |
JP5249689B2 (en) * | 2008-09-16 | 2013-07-31 | 東京エレクトロン株式会社 | Plasma processing apparatus and substrate mounting table |
US8613288B2 (en) * | 2009-12-18 | 2013-12-24 | Lam Research Ag | High temperature chuck and method of using same |
JP5299359B2 (en) * | 2010-06-11 | 2013-09-25 | 信越半導体株式会社 | Epitaxial growth equipment |
JP2012028428A (en) * | 2010-07-21 | 2012-02-09 | Tokyo Electron Ltd | Mounting table structure and processing apparatus |
WO2012067239A1 (en) * | 2010-11-19 | 2012-05-24 | 京セラ株式会社 | Member for mounting and temperature controlled mounting device |
US9984866B2 (en) | 2012-06-12 | 2018-05-29 | Component Re-Engineering Company, Inc. | Multiple zone heater |
JP5807160B2 (en) * | 2012-12-13 | 2015-11-10 | パナソニックIpマネジメント株式会社 | Non-plasma dry etching equipment |
US10593521B2 (en) * | 2013-03-12 | 2020-03-17 | Applied Materials, Inc. | Substrate support for plasma etch operations |
EP2973659A4 (en) * | 2013-03-15 | 2016-11-09 | Component Re Engineering Company Inc | Multiple zone heater |
KR101678677B1 (en) * | 2015-05-11 | 2016-11-22 | 이새봄 | substrate heating plate and apparatus adopting the plate |
KR101771217B1 (en) * | 2015-06-01 | 2017-09-05 | 주식회사 좋은기술 | substrate heating plate and apparatus adopting the plate |
JP7057103B2 (en) * | 2017-02-14 | 2022-04-19 | 日本特殊陶業株式会社 | Heating device |
US11289355B2 (en) | 2017-06-02 | 2022-03-29 | Lam Research Corporation | Electrostatic chuck for use in semiconductor processing |
TWI782441B (en) * | 2020-03-25 | 2022-11-01 | 日商國際電氣股份有限公司 | Substrate processing apparatus, substrate stage cover, and manufacturing method of semiconductor device |
-
2004
- 2004-04-26 JP JP2004130294A patent/JP4238772B2/en not_active Expired - Fee Related
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