KR101678677B1 - substrate heating plate and apparatus adopting the plate - Google Patents

substrate heating plate and apparatus adopting the plate Download PDF

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Publication number
KR101678677B1
KR101678677B1 KR1020150065547A KR20150065547A KR101678677B1 KR 101678677 B1 KR101678677 B1 KR 101678677B1 KR 1020150065547 A KR1020150065547 A KR 1020150065547A KR 20150065547 A KR20150065547 A KR 20150065547A KR 101678677 B1 KR101678677 B1 KR 101678677B1
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KR
South Korea
Prior art keywords
heating
plate
heat generating
heat
layer
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KR1020150065547A
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Korean (ko)
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KR20160132686A (en
Inventor
이새봄
정동준
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이새봄
주식회사 좋은기술
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Priority to KR1020150065547A priority Critical patent/KR101678677B1/en
Publication of KR20160132686A publication Critical patent/KR20160132686A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)

Abstract

A heating plate for heating a substrate and a heating device for applying the same are disclosed. A substrate heating plate includes: an upper plate on which a substrate is placed; A heating unit having a heating line for heating the upper plate and an insulating plate having a fixing groove into which the heating line is inserted; The fixing plate has at least two inclined surfaces contacting and supporting both sides of the lower portion of the heat ray.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate heating plate,

The present invention relates to a substrate heating plate and a substrate heating apparatus using the same, and more particularly, to a heating plate for heating a substrate such as a semiconductor wafer and a heating apparatus using the same.

In general, semiconductor devices such as memory devices, processors, and the like are manufactured through a complicated process accompanied by a high temperature heat treatment process.

For example, the fabrication process of a memory device is fabricated through a number of processes such as ion implantation, deposition, diffusion, photolithography, and the like. Most of these processes are performed while heating the substrate to a high temperature. The heating of the substrate is performed by a disk-shaped heating plate.

The heating plate includes an upper plate on which the wafer is placed, a heating plate (heating portion) positioned below the upper plate, and a lower plate fixing the heating portion to the upper plate at a lower portion of the heating portion.

The problem with the conventional heating plate having such a general structure is that the temperature of the entire upper plate is not uniform. Particularly, the hot wire and the upper plate are not in tight contact with each other, and on the other hand, the temperature of the peripheral portion is lower than that of the central portion, so that the heated substrate is not uniformly heated as a whole. In order to improve the adherence between the heat ray and the upper plate, a plurality of fastening members induce close contact between the heat generating portion and the upper plate. However, due to uneven support of the heat ray in the heat generating portion It does not. In addition, the temperature of the peripheral portion is still low despite the fact that the heating line is arranged so as to generate a large amount of heat in the peripheral portion in the heating portion. This unevenness of temperature means temperature unevenness of the substrate to be heat-treated, and it is therefore difficult to maintain uniformity of the overall product characteristics of the semiconductor elements formed on the substrate to a certain level.

The present invention provides a heating plate substrate having a structure capable of improving temperature uniformity as a whole, a substrate heating plate to which the same is applied, and a substrate heating apparatus to which the same is applied.

The present invention provides a substrate heating plate capable of uniformly temperature as a whole and an overall temperature increase, and a heating apparatus to which the same is applied.

A substrate heating plate according to the present invention comprises:

An upper plate on which a substrate is placed;

A heating unit having a heating line for heating the upper plate and an insulating plate having a fixing groove into which the heating line is inserted; And,

And a lower plate for closely fixing the heat generating portion to the upper plate,

The fixing groove has at least two inclined surfaces contacting and supporting both sides of the lower portion of the heat ray.

According to an embodiment of the present invention, the fixing groove in which the hot wire is inserted and supported may have a cross-sectional shape of "V"

According to another embodiment of the present invention, the first fixing groove and the second fixing groove having at least two inclined surfaces for supporting both sides of the twisted pair are formed on both sides of the insulating plate, And the first heating line and the second heating line may be respectively disposed in the two fixing grooves.

According to another embodiment of the present invention, the heat generating portion may have a multilayer structure in which one or more heat generating portions are laminated.

According to a specific embodiment of the present invention, the first heat line may be formed corresponding to the entirety of the upper plate, and the second heat line may be formed corresponding to a part of the upper plate.

According to a more specific embodiment of the present invention, the second heat line may be formed to correspond to a peripheral portion excluding the center portion of the top plate.

A substrate heating apparatus according to the present invention comprises:

A heating plate for heating the upper plate, and a lower plate for fixing the heating unit to the upper plate;

A table for supporting the heating plate; And

And a support for supporting the heating plate at a predetermined height above the table,

The heating unit includes an insulating plate having a heating line for heating the upper plate and a fixing groove having at least two inclined surfaces for supporting both sides of the bottom of the heating line.

Since the heat ray is supported in the fixing groove by the fixing grooves supporting the both lower sides of the heat ray, the heat ray can be uniformly and evenly adhered to the upper plate as a whole. Therefore, the entire upper plate can be heated uniformly. In addition, since the heat ray (heat generating layer) or the heat generating portion has a multi-layer structure instead of a single layer, the temperature of the top plate directly heating the substrate can be easily increased, and the partial heat The temperature of the specific region can be increased by laminating the second heat lines. In particular, by making the second heat line correspond to the peripheral portion of the first heat line, the temperature of the edge portion of the upper plate can be raised or adjusted easily, and the temperature can be maintained within a certain range have. According to the present invention, the heating temperature for the semiconductor substrate can be uniformly maintained as a whole, and thus the product deviation of the semiconductor device to be manufactured can be reduced.

1 is a schematic perspective view of a substrate heating apparatus to which a heating plate according to an embodiment of the present invention is applied.
2 is a schematic side view of a substrate heating apparatus according to an embodiment of the present invention.
3 illustrates a structure of a heat generating portion in a substrate heating apparatus according to an embodiment of the present invention.
4 is a schematic cross-sectional view showing a relationship between a fixing groove of an insulating plate and a heat line inserted in a heating plate according to an embodiment of the present invention.
5 is a schematic cross-sectional view showing a deformation of an inclined surface of a fixing groove and a close contact state of a heat ray when the insulating plate is pressed on the upper plate in the heating plate according to an embodiment of the present invention.
Fig. 6 schematically shows the arrangement of heat lines to a heat generating portion in a heating plate according to another embodiment of the present invention.
FIG. 7 is a plan view showing an upper surface of an insulating plate having a first heat line in a heating plate according to another embodiment of the present invention. FIG.
8 is a bottom view showing a bottom surface of an insulating plate having a second heat line in a heating plate according to another embodiment of the present invention.
9 is a side view showing a laminated structure of a heat generating portion in a heating plate according to another embodiment of the present invention.
10 is a plan view of a first heat generating portion of a heating plate according to another embodiment of the present invention.
11 is a plan view of a second heat generating portion of a heating plate according to another embodiment of the present invention.

Hereinafter, a substrate heating apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view of a substrate heating apparatus to which a heating plate according to an embodiment of the present invention is applied, and FIG. 2 is a side view thereof.

1 and 2, in the substrate heating apparatus according to the present invention, a heating plate HP includes a heating plate 10, a lower plate 30, a heating plate 10 and a lower plate 30, And a heat generating portion 20 having a heating structure of a plurality of layers sandwiched between the heat generating portions 20. This heating plate HP is fixed to the square table 40 by the support structure provided at the lower center and the periphery thereof. A power line 71 connected to the heat generating unit 20 and a sensor line 72 for detecting temperature are exposed on the bottom surface of the heating plate HP.

In the lower part of the heating plate HP according to the present invention, a plurality of column supports 50 and 60 for supporting the heating plate HP are provided as in a general substrate heating apparatus. The support portions (50, 60) fix the heating plate (HP) at a predetermined height above the table (40).

FIG. 3 is a schematic side view of a heat generating unit, which is applied to a heating plate HP according to one embodiment of the present invention.

Referring to FIG. 3, a heat ray 22a (heat generating layer) is formed on one side of the insulating plate 21, which is an element of the heat generating portion 20, in the drawing. The heating layer or heat line 22a is a nichrome wire, and the insulating plate 21 is formed of a heat-resistant insulating material such as mica.

Fig. 4 shows the structure of a fixing groove 21a in which a heating wire is inserted in the heating platen according to the present invention. 4, the fixing groove 21a formed in the insulating plate 21 has a V-shaped structure having two inclined surfaces 21b and 21b contacting both lower sides of the heat ray 22a. At this time, the upper portion of the heat wire 22a protrudes outside the fixing groove 21a by a predetermined height h. Its height is about 30% of the diameter of the line of heat. The fixing groove 21a has at least two inclined surfaces contacting both sides of the lower portion of the heat ray 22a, and preferably has a V-shaped cross-sectional shape.

The hot wire 22a inserted into the V-shaped fixing groove 21a is pressed by a press or the like in the hot plate assembling process. 5 is a partially enlarged cross-sectional view of the heat generating portion 20 assembled with the upper plate 10.

5, the lower side surface of the heat ray 22a presses the inclined surface 21b of the fixing groove 21a, and therefore, the inclined surface 21b is provided with a deformed portion 21b 'are formed. The deformed portion 21b 'is elastically deformed, so that the heat ray 22a is brought into close contact with the bottom surface of the upper plate 10. [ Although not shown in the drawing, an insulating plate may be disposed on the heat line 22a because the upper plate 10 is formed of a conductive metal. When the upper plate itself has total or partial insulation, You will not need it.

In such a structure, the portion supporting the heat ray 22a is provided by the inclined surfaces 21b. According to this structure, the upper surface of the heat ray 22a coincides with the surface of the insulating plate 21, and stably adheres to the bottom surface of the upper plate 10. [ This state is maintained at all portions of the heat line 22a and the adhesion between the upper plate 10 and the heat line 22a is improved so that the heat can be stably transferred to the top plate 10. [

Conventional fixing grooves have a substantially rectangular cross section having a flat bottom surface and vertical wall surfaces on both sides thereof. In this structure, the deformation portion for improving the adhesion is formed only in the bottom portion of the fixing groove, so that it is difficult to secure a satisfactory elastic deformation portion, and at this time, the heat ray is stably supported in the fixing groove by a gap or the like, I can not. In comparison with the size of the deformed portion, there are two deformed portions due to both inclined surfaces according to the present invention, but the conventional one is the bottom portion. Therefore, the supporting structure of the hot wire by the fixing groove having at least two inclined surfaces will be naturally stable as compared with the conventional fixing groove having the simple square cross section and the heat transmission efficiency is much higher.

The fixing groove 21a having at least two inclined surfaces 21b and 21b for supporting / contacting both sides of the bottom of the heat ray 22a can be modified to have a hexagonal or hexagonal structure .

Hereinafter, another embodiment of the present invention will be described in order to maintain a more uniform temperature throughout the top plate 10 in addition to a good heat transfer structure by the above-described structure.

The hot plate of the embodiment described below has the heat wire support structure as described above. Hereinafter, the heating wire is referred to as a heating layer for convenience.

FIG. 6 is a side elevation view of a heating unit 20 having a multi-layer heating structure applied to a heating plate HP according to another embodiment of the present invention.

Referring to FIG. 6, first and second heating layers 22a and 22b are formed or provided on both sides of one insulating plate 21 of the heating unit 20 of the heating plate HP according to an embodiment of the present invention Lt; / RTI > That is, the heat generating portion 20 includes a heat generating layer 22a on one side (upper surface in the drawing) and a heat generating layer 22b on the other side (lower surface in the drawing) unlike the conventional structure.

The heating layers 22a and 22b have a structure in which a heating wire is spirally wound on a corresponding side of the insulating plate 21 in the form of a spiral and is inserted into a fixing groove having the same inclined surface as described above. The layer 22a is formed on the entire surface of the insulating plate 21 so that heat is generated in the entire region A + B + A of the insulating plate 21 and the second heat generating layer 22b is formed on the bottom face of the insulating plate 21 Is formed only in the region A of the periphery A so that heat is generated only in the region A of the donut shape.

7 is a plan view showing an upper surface of an insulating plate 21 formed with a first heat generating layer 22a by a hot wire and FIG. 8 is a plan view showing a bottom surface of the insulating plate 21 having a second heat generating layer 22b formed by a heating wire, .

First, as shown in FIG. 7, the first heating layer 22a is formed entirely on the insulating plate 21, and peripheral portions thereof are densely arranged compared to the central portion, so that the amount of heat generated in the peripheral portion is designed to be high. 8, the second heat generating layer 22b on the bottom surface of the insulating plate 21 is formed at the edge portion of the donut shape at the bottom surface of the insulating plate 21 so as to generate heat at the periphery of the bottom surface of the insulating plate 21 .

According to the heat generated from both sides of the insulating plate 21, the heat is concentrated by the first heating layer 22a and the second heating layer 22b in the donut-shaped portion around the insulating plate 21 to overlap the second heating layer 22b The heat generated in the central portion of the insulating plate 21 is prevented.

According to the present invention, the entire top plate 10 is heated by the first heating layer 22a, and the peripheral portion of the top plate 10 is heated by the second heating layer 22b. According to this, the temperature at the lower peripheral portion is compensated by the temperature of the periphery of the heating plate compared to the central portion of the heating plate, which is a problem in the conventional heating plate, thereby reducing the temperature difference between the central portion and the peripheral portion as a whole.

9 is a side view showing a laminated structure of the heat generating portion 20 in the heating plate according to another embodiment of the present invention.

The heat generating portion 20 according to the present embodiment includes a first heat generating portion 20a and a second heat generating portion 20b stacked in a sandwich structure. The first heating plate 22a is formed on the first insulating plate 21a of the first heating unit 20a and the second heating plate 21b of the second heating unit 20b is formed on the second heating plate 21b. The second heating layer 22b is formed only in the donut-shaped region A as shown in Fig. According to this structure, a configuration is provided in which the second heat generating layer in the above-described embodiment is supported by a separate second insulating plate 21b.

10 is a plan view of the first heat generating portion 20a in which the first heat generating layer 22a is formed on the first insulating plate 21a. As shown in FIG. 7, the first heat generating layer 22a of the first heat generating portion 20a is disposed so as to generate heat on the entire surface of the first insulating plate 21a.

11 shows a structure in which the second heating layer 22b is disposed on the second insulating plate 21b in the second heating portion 20b coupled to the first heating portion 20a. The second heating layer 22b is formed only in the donut-shaped region around the second insulating plate 21b except for the center portion thereof. Therefore, the second heat generating layer 22b generates heat only at the peripheral portion of the second insulating plate 21b.

Therefore, when the first heat generating portion 20a and the second heat generating portion 20b are combined to form one heat generating portion 20, the first heat generating layer 21a of the first heat generating portion 20a, And the second heat generating layer 22b of the second heat generating portion 20b supplies heat to the peripheral portion of the top plate 10. [ Therefore, even if the heat is supplied to the periphery of the upper plate 10 and the heat is discharged through the periphery of the upper plate 10, the peripheral portion of the upper plate 10 may not be lowered in temperature than the central portion thereof .

In the above-described embodiment, the structure for compensating for the temperature decrease at the peripheral portion of the top plate 10 has been described. According to another embodiment of the present invention, a structure capable of further increasing the temperature of the top plate 10 Can be provided.

That is, when the first heating layer 22a and the second heating layer 22b are formed on one insulating plate 21 or the first and second insulating plates 21a and 21b as in the above embodiment, As in the case of the heating layer 22a, the second heating layer 22b may be entirely arranged so that the entire upper plate can be heated. According to the present invention, it is possible to heat the upper plate at a higher temperature by the heat generating unit of the multi-layer according to the present invention compared to the conventional heating plate by the heat generating unit.

However, according to another embodiment of the present invention, it is also possible to stack three or more heating units or a plurality of heating units with a sandwich structure according to another embodiment of the present invention.

As described above, the present invention is not limited to the above-described embodiments, and it is needless to say that variations can be made by those skilled in the art without departing from the spirit of the present invention.

Accordingly, the scope of claim of the present invention is not limited within the scope of the detailed description, but will be defined by the following claims and technical ideas thereof.

10: Top plate
20: Heating part (heating plate)
20a: a first heating portion
20b: the second heating portion
21: Insulating plate
21a: first insulating plate
21b: second insulating plate
22a: First heating layer (hot line)
22b: a second heating layer (hot wire)
30: Lower plate
40: Table
50, 60:

Claims (8)

An upper plate on which a substrate is placed;
A heating unit having a heating line for heating the upper plate, and an insulating plate having a fixing groove for inserting the heating wire so as to protrude to a predetermined height; And,
And a lower plate for closely fixing the heat generating portion to the upper plate,
Wherein the fixing groove has at least two inclined portions contacting and supporting both sides of the lower portion of the heat ray,
Wherein each of the inclined portions is formed with a deforming portion that surrounds both sides of the hot line and the deforming portion is formed when the projecting portion of the hot line is pressed by the upper plate when the upper plate and the lower plate are tightly fixed, Heating plate. The method according to claim 1,
Wherein the fixing groove has a V-shaped cross-sectional shape having two inclined surfaces. The method according to claim 1,
Wherein the heat generating portion has a multilayered heating structure including a first heating layer and a second heating layer superimposed on the first heating layer. 4. The method according to any one of claims 1 to 3,
Wherein the heat generating portion includes a first heat generating portion and a second heat generating portion each having a first insulating plate and a second insulating plate each having a first heat generating layer and a second heat generating layer formed thereon. 5. The method of claim 4,
Wherein the second heating layer is formed to correspond to a peripheral portion of the upper plate except for a center portion thereof. The method of claim 3,
Wherein the second heating layer is formed to correspond to a peripheral portion of the upper plate except for a center portion thereof. A substrate heating plate according to any one of claims 1 to 3;
A table for supporting the heating plate; And
And a plurality of supports for fixing the heating plate to the table. 8. The method of claim 7,
Wherein the heating portion includes a first heating portion and a second heating portion each having a first heating plate and a second heating plate on which a first heating layer and a second heating layer are formed.
KR1020150065547A 2015-05-11 2015-05-11 substrate heating plate and apparatus adopting the plate KR101678677B1 (en)

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KR1020150065547A KR101678677B1 (en) 2015-05-11 2015-05-11 substrate heating plate and apparatus adopting the plate

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Application Number Priority Date Filing Date Title
KR1020150065547A KR101678677B1 (en) 2015-05-11 2015-05-11 substrate heating plate and apparatus adopting the plate

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KR101678677B1 true KR101678677B1 (en) 2016-11-22

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356624A (en) 2003-05-07 2004-12-16 Tokyo Electron Ltd Mounting stand structure and heat treatment equipment
KR101324210B1 (en) 2012-10-10 2013-11-06 주성엔지니어링(주) Substrate processing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5254295B2 (en) * 2010-09-22 2013-08-07 株式会社東芝 Deposition equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004356624A (en) 2003-05-07 2004-12-16 Tokyo Electron Ltd Mounting stand structure and heat treatment equipment
KR101324210B1 (en) 2012-10-10 2013-11-06 주성엔지니어링(주) Substrate processing apparatus

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