JP4238693B2 - 光デバイス - Google Patents

光デバイス Download PDF

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Publication number
JP4238693B2
JP4238693B2 JP2003358308A JP2003358308A JP4238693B2 JP 4238693 B2 JP4238693 B2 JP 4238693B2 JP 2003358308 A JP2003358308 A JP 2003358308A JP 2003358308 A JP2003358308 A JP 2003358308A JP 4238693 B2 JP4238693 B2 JP 4238693B2
Authority
JP
Japan
Prior art keywords
holding member
sealing member
optical device
sealing
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003358308A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005123477A (ja
JP2005123477A5 (sr
Inventor
好伸 末広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2003358308A priority Critical patent/JP4238693B2/ja
Priority to US10/891,422 priority patent/US7391153B2/en
Priority to DE102004063978.7A priority patent/DE102004063978B4/de
Priority to DE102004034166.4A priority patent/DE102004034166B4/de
Priority to CNB2004100712619A priority patent/CN100472820C/zh
Priority to CN2009100096747A priority patent/CN101476710B/zh
Publication of JP2005123477A publication Critical patent/JP2005123477A/ja
Publication of JP2005123477A5 publication Critical patent/JP2005123477A5/ja
Application granted granted Critical
Publication of JP4238693B2 publication Critical patent/JP4238693B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2003358308A 2003-07-17 2003-10-17 光デバイス Expired - Fee Related JP4238693B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003358308A JP4238693B2 (ja) 2003-10-17 2003-10-17 光デバイス
DE102004063978.7A DE102004063978B4 (de) 2003-07-17 2004-07-15 Lichtemittierende Vorrichtung
DE102004034166.4A DE102004034166B4 (de) 2003-07-17 2004-07-15 Lichtemittierende Vorrichtung
US10/891,422 US7391153B2 (en) 2003-07-17 2004-07-15 Light emitting device provided with a submount assembly for improved thermal dissipation
CNB2004100712619A CN100472820C (zh) 2003-07-17 2004-07-16 发光器件
CN2009100096747A CN101476710B (zh) 2003-07-17 2004-07-16 发光器件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003358308A JP4238693B2 (ja) 2003-10-17 2003-10-17 光デバイス

Publications (3)

Publication Number Publication Date
JP2005123477A JP2005123477A (ja) 2005-05-12
JP2005123477A5 JP2005123477A5 (sr) 2007-09-13
JP4238693B2 true JP4238693B2 (ja) 2009-03-18

Family

ID=34614917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003358308A Expired - Fee Related JP4238693B2 (ja) 2003-07-17 2003-10-17 光デバイス

Country Status (1)

Country Link
JP (1) JP4238693B2 (sr)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351964A (ja) * 2005-06-17 2006-12-28 Matsushita Electric Works Ltd 発光素子実装用基板及びその製造方法
JP4679268B2 (ja) * 2005-06-29 2011-04-27 シーアイ化成株式会社 発光ダイオード複合素子
JP4679267B2 (ja) * 2005-06-29 2011-04-27 シーアイ化成株式会社 発光ダイオード複合素子
KR100694847B1 (ko) 2005-09-26 2007-03-13 알티전자 주식회사 발광 다이오드 및 그 제조방법
JP2007150233A (ja) * 2005-11-02 2007-06-14 Trion:Kk 色温度可変発光デバイス
JP4013077B2 (ja) 2005-11-21 2007-11-28 松下電工株式会社 発光装置およびその製造方法
JP3992059B2 (ja) * 2005-11-21 2007-10-17 松下電工株式会社 発光装置の製造方法
JP2007173369A (ja) * 2005-12-20 2007-07-05 Rohm Co Ltd 半導体発光素子及び半導体発光素子の製造方法
JP2007234846A (ja) * 2006-03-01 2007-09-13 Ngk Spark Plug Co Ltd 発光素子用セラミックパッケージ
JP2008004640A (ja) * 2006-06-20 2008-01-10 Toyoda Gosei Co Ltd 発光装置
US8410501B2 (en) * 2007-01-11 2013-04-02 Panasonic Corporation Light source
KR100850666B1 (ko) * 2007-03-30 2008-08-07 서울반도체 주식회사 메탈 ｐｃｂ를 갖는 ｌｅｄ 패키지
JP4969332B2 (ja) * 2007-06-19 2012-07-04 シャープ株式会社 基板及び照明装置
JP5139916B2 (ja) * 2008-08-06 2013-02-06 シチズン電子株式会社 発光装置
JP5379465B2 (ja) * 2008-12-17 2013-12-25 パナソニック株式会社 発光装置
JP5305950B2 (ja) * 2009-01-29 2013-10-02 京セラ株式会社 発光装置及びこれを用いた照明装置
JP5370238B2 (ja) * 2010-03-30 2013-12-18 豊田合成株式会社 発光装置の製造方法
US9232634B2 (en) 2011-01-17 2016-01-05 Canon Components, Inc. Flexible circuit board for mounting light emitting element, illumination apparatus, and vehicle lighting apparatus
JP2013157592A (ja) * 2012-01-05 2013-08-15 Canon Components Inc 発光素子実装用フレキシブル回路基板
JP5274586B2 (ja) 2011-01-17 2013-08-28 キヤノン・コンポーネンツ株式会社 フレキシブル回路基板
JP6427313B2 (ja) * 2013-11-01 2018-11-21 株式会社タムラ製作所 発光装置
JP6398996B2 (ja) * 2014-01-24 2018-10-03 Ａｇｃ株式会社 発光素子用基板および発光装置
JP2016184653A (ja) * 2015-03-26 2016-10-20 京セラ株式会社 発光素子収納用パッケージおよび発光装置
JP6537883B2 (ja) * 2015-05-14 2019-07-03 スタンレー電気株式会社 半導体発光素子および半導体発光素子アレイ
CN107926114B (zh) * 2015-09-03 2021-08-06 亮锐控股有限公司 制作led设备的方法
CN107565002B (zh) 2016-06-30 2022-03-25 日亚化学工业株式会社 发光装置及其制造方法
JP6477734B2 (ja) * 2016-06-30 2019-03-06 日亜化学工業株式会社 発光装置及びその製造方法
JP7291675B2 (ja) * 2020-07-30 2023-06-15 日本特殊陶業株式会社 半導体パッケージアレイ

Also Published As

Publication number Publication date
JP2005123477A (ja) 2005-05-12

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