JP4236716B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP4236716B2 JP4236716B2 JP28256297A JP28256297A JP4236716B2 JP 4236716 B2 JP4236716 B2 JP 4236716B2 JP 28256297 A JP28256297 A JP 28256297A JP 28256297 A JP28256297 A JP 28256297A JP 4236716 B2 JP4236716 B2 JP 4236716B2
- Authority
- JP
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- Prior art keywords
- conductive layer
- region
- film
- layer
- tft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 104
- 239000010408 film Substances 0.000 claims description 200
- 239000012535 impurity Substances 0.000 claims description 47
- 229910052710 silicon Inorganic materials 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 22
- 239000010703 silicon Substances 0.000 claims description 22
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 20
- 238000002425 crystallisation Methods 0.000 claims description 18
- 230000008025 crystallization Effects 0.000 claims description 18
- 230000006870 function Effects 0.000 claims description 15
- 239000010409 thin film Substances 0.000 claims description 12
- 230000001737 promoting effect Effects 0.000 claims description 4
- -1 Of the third region Chemical compound 0.000 claims 1
- 239000010410 layer Substances 0.000 description 206
- 238000000034 method Methods 0.000 description 71
- 239000011159 matrix material Substances 0.000 description 60
- 230000015572 biosynthetic process Effects 0.000 description 54
- 239000000758 substrate Substances 0.000 description 50
- 238000004519 manufacturing process Methods 0.000 description 38
- 230000008569 process Effects 0.000 description 37
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 35
- 229910052698 phosphorus Inorganic materials 0.000 description 35
- 239000011574 phosphorus Substances 0.000 description 35
- 238000005247 gettering Methods 0.000 description 34
- 238000005530 etching Methods 0.000 description 26
- 229910052796 boron Inorganic materials 0.000 description 25
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 24
- 238000000059 patterning Methods 0.000 description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 238000010586 diagram Methods 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 17
- 230000003197 catalytic effect Effects 0.000 description 16
- 239000011229 interlayer Substances 0.000 description 16
- 229910021417 amorphous silicon Inorganic materials 0.000 description 15
- 150000002500 ions Chemical class 0.000 description 15
- 239000004973 liquid crystal related substance Substances 0.000 description 13
- 230000008901 benefit Effects 0.000 description 12
- 239000013078 crystal Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 238000005224 laser annealing Methods 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011521 glass Substances 0.000 description 11
- 238000000137 annealing Methods 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 10
- 238000013461 design Methods 0.000 description 9
- 230000005684 electric field Effects 0.000 description 9
- 238000005468 ion implantation Methods 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000000969 carrier Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 238000001994 activation Methods 0.000 description 4
- 238000006356 dehydrogenation reaction Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 231100000812 repeated exposure Toxicity 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000010532 solid phase synthesis reaction Methods 0.000 description 2
- 229930091051 Arenine Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910020286 SiOxNy Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000007715 excimer laser crystallization Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002789 length control Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- FBMUYWXYWIZLNE-UHFFFAOYSA-N nickel phosphide Chemical compound [Ni]=P#[Ni] FBMUYWXYWIZLNE-UHFFFAOYSA-N 0.000 description 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Landscapes
- Shift Register Type Memory (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28256297A JP4236716B2 (ja) | 1997-09-29 | 1997-09-29 | 半導体装置 |
| US09/157,939 US6121660A (en) | 1997-09-23 | 1998-09-22 | Channel etch type bottom gate semiconductor device |
| KR1019980040090A KR100567145B1 (ko) | 1997-09-23 | 1998-09-23 | 반도체장치및그제조방법 |
| US09/645,578 US6680223B1 (en) | 1997-09-23 | 2000-08-25 | Semiconductor device and method of manufacturing the same |
| US10/428,092 US6924528B2 (en) | 1997-09-23 | 2003-05-02 | Semiconductor device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28256297A JP4236716B2 (ja) | 1997-09-29 | 1997-09-29 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11103068A JPH11103068A (ja) | 1999-04-13 |
| JPH11103068A5 JPH11103068A5 (enExample) | 2005-05-26 |
| JP4236716B2 true JP4236716B2 (ja) | 2009-03-11 |
Family
ID=17654104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28256297A Expired - Fee Related JP4236716B2 (ja) | 1997-09-23 | 1997-09-29 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4236716B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4118484B2 (ja) * | 2000-03-06 | 2008-07-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4574261B2 (ja) * | 2004-07-16 | 2010-11-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4906039B2 (ja) * | 2004-08-03 | 2012-03-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4879530B2 (ja) * | 2004-09-08 | 2012-02-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4700317B2 (ja) * | 2004-09-30 | 2011-06-15 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| JP5238132B2 (ja) * | 2005-02-03 | 2013-07-17 | 株式会社半導体エネルギー研究所 | 半導体装置、モジュール、および電子機器 |
| TWI857906B (zh) | 2006-09-29 | 2024-10-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| TWI330406B (en) * | 2006-12-29 | 2010-09-11 | Au Optronics Corp | A method for manufacturing a thin film transistor |
| JP2008311545A (ja) * | 2007-06-18 | 2008-12-25 | Hitachi Displays Ltd | 表示装置 |
| US7633089B2 (en) * | 2007-07-26 | 2009-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device provided with the same |
| KR101432764B1 (ko) * | 2008-11-13 | 2014-08-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| WO2011007711A1 (ja) * | 2009-07-14 | 2011-01-20 | シャープ株式会社 | 薄膜トランジスタ、表示装置、及び薄膜トランジスタの製造方法 |
-
1997
- 1997-09-29 JP JP28256297A patent/JP4236716B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11103068A (ja) | 1999-04-13 |
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