JP4227580B2 - 温度および投与量が調節可能な原子層堆積 - Google Patents
温度および投与量が調節可能な原子層堆積 Download PDFInfo
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- 238000000231 atomic layer deposition Methods 0.000 title claims description 56
- 239000000376 reactant Substances 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 31
- 239000002356 single layer Substances 0.000 claims description 30
- 239000007789 gas Substances 0.000 claims description 29
- 229910044991 metal oxide Inorganic materials 0.000 claims description 29
- 150000004706 metal oxides Chemical class 0.000 claims description 29
- 239000010410 layer Substances 0.000 claims description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 23
- 239000010703 silicon Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 238000000151 deposition Methods 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052914 metal silicate Inorganic materials 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 238000002955 isolation Methods 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 238000010926 purge Methods 0.000 description 30
- 239000000463 material Substances 0.000 description 29
- 230000003287 optical effect Effects 0.000 description 13
- 239000002243 precursor Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000007423 decrease Effects 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 3
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
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- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45529—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making a layer stack of alternating different compositions or gradient compositions
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H01L21/314—Inorganic layers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
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- H01L21/02178—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
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Description
Claims (16)
- 基板にフイルムを堆積する方法であって、
シリコン基板の表面上に堆積される金属酸化膜フイルムに対する第1特性を、当該シリコン基板と前記金属酸化膜フイルムとの界面から決定する段階と、
前記シリコン基板上に前記第1特性を有する前記金属酸化膜フイルムを堆積させるために第1原子層堆積(ALD)条件を設定する段階と、
前記第1原子層堆積(ALD)条件を用いて、前記第1特性を有する前記金属酸化膜フイルムの、少なくとも1つの単分子層を成長させる段階と、
少なくとも1つの前記単分子層上に堆積される前記金属酸化膜フイルムの特性であって、前記第1特性とは異なる第2特性を決定する段階と、
少なくとも1つの前記単分子層上に、前記第2特性を有する前記金属酸化膜フイルムを堆積させるために後続のALD条件を設定する段階と、
前記後続のALD条件を使用して、少なくとも1つの後続の単分子層のフイルムを前記単分子層の上に成長させる段階と、
を備え、
前記第1のALD条件を使用して、少なくとも1つの単分子層のフイルムを成長させる段階が、漏電に対する絶縁性が乏しいが、前記界面から酸化シリコン及び金属ケイ酸塩が存在しない前記第1特性を有する前記金属酸化膜フイルムを堆積させ、
前記後続のALD条件を使用して前記少なくとも1つの後続の単分子層フイルムを前記単分子層の上に成長させる段階が、前記第1特性を有する前記金属酸化膜フイルムよりも漏電に対して良好な絶縁性を有する前記第2特性を有する前記金属酸化膜フイルムを堆積させ、
前記第1のALD条件を設定する段階が、第1ALD反応装置温度を設定する段階を備え、
前記後続のALD条件を設定する段階が、前記第1ALD反応装置温度よりも高い、少なくとも1つの後続のALD反応装置温度を設定する段階を備える
方法。 - 前記第1ALD条件を設定する段階が、第1反応物流量を設定する段階を備える、請求項1に記載の方法。
- 前記後続のALD条件を設定する段階が、前記第1反応物流量と異なる少なくとも1つの後続の反応物流量を設定する段階を備える、請求項2に記載の方法。
- 装置であって、
原子層堆積(ALD)反応装置と
前記ALD反応装置に接続されるコントローラと
を備え、前記コントローラが前記反応装置の温度を制御すために接続され、かつ当該コントローラが、
シリコン基板の表面上に堆積される金属酸化膜フイルムに対する第1特性を、前記シリコン基板と前記金属酸化膜フイルムとの界面から決定し、
前記シリコン基板上に、前記第1特性を有する前記金属酸化膜フイルムを堆積させるために第1原子層堆積(ALD)条件を設定し、
前記第1原子層堆積(ALD)条件を用いて、前記第1特性を有する前記金属酸化膜フイルムの、少なくとも1つの単分子層を前記基板上に成長させ、
少なくとも1つの前記単分子層上に堆積される前記金属酸化膜フイルムの特性であって、前記第1特性とは異なる第2特性を決定する段階と、
少なくとも1つの前記単分子層上に、前記第2特性を有する前記金属酸化膜フイルムを堆積させるために後続のALD条件を設定し、
前記後続のALD条件を使用して、少なくとも1つの後続の単分子層のフイルムを前記単分子層の上に成長させ、
前記第1のALD条件を使用して、少なくとも1つの単分子層のフイルムを前記単分子層の上に成長させる場合に、漏電に対する絶縁性が乏しいが、前記界面から酸化シリコン及び金属ケイ酸塩が存在しない前記第1特性を有する前記金属酸化膜フイルムを成長させ、
前記後続のALD条件を使用して前記少なくとも1つの後続の単分子層のフイルムを前記単分子層の上に成長させる場合に、前記少なくとも1つの単分子のフイルムを前記基板に成長させる段階における反応温度よりも高い反応温度を設定することにより、前記第1特性を有する金属酸化膜フイルムよりも漏電に対して良好な絶縁性を有する前記第2特性を有する前記金属酸化膜フイルムを成長させる
装置。 - 前記コントローラが、第1ALD条件と後続のALD条件を不連続的に設定するために更に接続される、請求項4に記載の装置。
- 前記コントローラが、第1ALD条件と後続のALD条件を連続的に設定するために更に接続される、請求項4に記載の装置。
- 前記コントローラが、前記反応装置への第1反応物および第2反応物の流量を制御するために接続される、請求項4に記載の装置。
- 前記第1反応物が酸素ベースの反応物である、請求項7に記載の装置。
- 前記第1反応物が窒素ベースの反応物である、請求項7に記載の装置。
- 装置であって、
シリコン基板と、
前記シリコン基板に配置された金属酸化膜の層と
を備え、
前記金属酸化膜の層が、前記シリコン基板に接する少なくとも1つの単分子層を備え、
前記少なくとも1つの単分子層が、漏電に対する絶縁性の乏しい第1の電気的性質を有し、かつ前記シリコン基板との界面には酸化シリコン及び金属ケイ酸塩を有さず、
前記金属酸化膜の層が、前記少なくとも1つの第1単分子層の上に少なくとも1つの後続の単分子層を備え、
前記少なくとも1つの後続の単分子層が、前記第1の電気的性質とは異なる電気的性質であって、前記第1の電気的性質よりも漏電に対して良好な絶縁性を有し、
前記少なくとも1つの後続の単分子層は、前記少なくとも1つの単分子層を前記シリコン基板に成長させる場合の反応温度よりもより高い反応温度に設定することにより前記少なくとも1つの単分子層の上に成長される装置。 - 前記金属酸化膜の層に堆積されるゲート電極を更に備える、請求項10に記載の装置。
- 前記金属酸化膜の層の第1および第2のサイドおよび前記ゲート電極の第1および第2のサイドにそれぞれ形成される第1および第2の垂直サイドウォール型誘電性スペーサを更に備える、請求項11に記載の装置。
- 前記シリコン基板中に形成される第1および第2の浅溝素子分離(STI)領域を更に備える、請求項12に記載の装置。
- システムであって、
トランスポンダと
前記トランスポンダに接続されるエルビウム・ドープ・ファイバ・アンプ(EDFA)と
を備え、
前記トランスポンダが、
シリコン基板と、
前記シリコン基板上に堆積する金属酸化膜の層と
を備え、
前記金属酸化膜の層が、基板に接する少なくとも1つの単分子層を備え、
前記少なくとも1つの単分子層が、漏電に対する絶縁性の乏しい第1の電気的性質を有し、かつ前記シリコン基板との界面には酸化シリコン及び金属ケイ酸塩を有さず、
前記金属酸化膜の層が、前記少なくとも1つの単分子層の上に少なくとも1つの後続の単分子層を備え、
前記少なくとも1つの後続の単分子層が、前記第1の電気的性質とは異なる電気的性質であって、前記第1の電気的性質よりも漏電に対して良好な絶縁性を有し、
前記少なくとも1つの後続の単分子層は、前記少なくとも1つの単分子層を前記シリコン基板に成長させる場合の反応温度よりもより高い反応温度に設定することにより前記少なくとも1つの単分子層の上に成長される
システム。 - 前記EDFAに接続されるマルチプレクサを更に備える、請求項14に記載のシステム。
- 前記EDFAに接続されるアド−ドロップ・マルチプレクサを更に備える、請求項15に記載のシステム。
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US10/674,883 US7306956B2 (en) | 2003-09-30 | 2003-09-30 | Variable temperature and dose atomic layer deposition |
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US8633299B2 (en) * | 2003-06-20 | 2014-01-21 | Kensey Nash Bvf Technology Llc | High density fibrous polymers suitable for implant |
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JP2007516599A (ja) | 2003-08-04 | 2007-06-21 | エーエスエム アメリカ インコーポレイテッド | ゲルマニウム上の堆積前の表面調製 |
US7704896B2 (en) * | 2005-01-21 | 2010-04-27 | Asm International, N.V. | Atomic layer deposition of thin films on germanium |
US7524765B2 (en) * | 2005-11-02 | 2009-04-28 | Intel Corporation | Direct tailoring of the composition and density of ALD films |
KR100819002B1 (ko) * | 2006-10-20 | 2008-04-02 | 삼성전자주식회사 | 비휘발성 메모리 소자 제조 방법 |
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US5480818A (en) * | 1992-02-10 | 1996-01-02 | Fujitsu Limited | Method for forming a film and method for manufacturing a thin film transistor |
KR100269306B1 (ko) * | 1997-07-31 | 2000-10-16 | 윤종용 | 저온처리로안정화되는금속산화막으로구성된완충막을구비하는집적회로장치및그제조방법 |
US6001741A (en) * | 1998-04-15 | 1999-12-14 | Lucent Technologies Inc. | Method for making field effect devices and capacitors with improved thin film dielectrics and resulting devices |
US6200893B1 (en) * | 1999-03-11 | 2001-03-13 | Genus, Inc | Radical-assisted sequential CVD |
US6203613B1 (en) * | 1999-10-19 | 2001-03-20 | International Business Machines Corporation | Atomic layer deposition with nitrate containing precursors |
US20020195056A1 (en) * | 2000-05-12 | 2002-12-26 | Gurtej Sandhu | Versatile atomic layer deposition apparatus |
US6660660B2 (en) * | 2000-10-10 | 2003-12-09 | Asm International, Nv. | Methods for making a dielectric stack in an integrated circuit |
US20020144786A1 (en) * | 2001-04-05 | 2002-10-10 | Angstron Systems, Inc. | Substrate temperature control in an ALD reactor |
TW523879B (en) * | 2002-03-28 | 2003-03-11 | Macronix Int Co Ltd | UV-programmed p-type mask ROM and fabrication thereof |
JP4734231B2 (ja) * | 2003-03-14 | 2011-07-27 | アイクストロン・インコーポレーテッド | 原子層堆積のサイクル時間改善のための方法と装置 |
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US8633299B2 (en) * | 2003-06-20 | 2014-01-21 | Kensey Nash Bvf Technology Llc | High density fibrous polymers suitable for implant |
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