JP4210166B2 - グレートーンマスクの製造方法 - Google Patents
グレートーンマスクの製造方法 Download PDFInfo
- Publication number
- JP4210166B2 JP4210166B2 JP2003188242A JP2003188242A JP4210166B2 JP 4210166 B2 JP4210166 B2 JP 4210166B2 JP 2003188242 A JP2003188242 A JP 2003188242A JP 2003188242 A JP2003188242 A JP 2003188242A JP 4210166 B2 JP4210166 B2 JP 4210166B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- semi
- light
- resist
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 60
- 239000010408 film Substances 0.000 claims description 252
- 239000000758 substrate Substances 0.000 claims description 44
- 238000005530 etching Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 33
- 238000002834 transmittance Methods 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 11
- 238000010894 electron beam technology Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 description 23
- 238000001312 dry etching Methods 0.000 description 7
- 238000004380 ashing Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 5
- 229910016006 MoSi Inorganic materials 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 230000002194 synthesizing effect Effects 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/34—Phase-edge PSM, e.g. chromeless PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003188242A JP4210166B2 (ja) | 2003-06-30 | 2003-06-30 | グレートーンマスクの製造方法 |
TW093118769A TWI247965B (en) | 2003-06-30 | 2004-06-28 | Method for manufacturing gray tone mask |
KR1020040050389A KR100733480B1 (ko) | 2003-06-30 | 2004-06-30 | 그레이 톤 마스크의 제조 방법 |
CNB2004100625381A CN1284044C (zh) | 2003-06-30 | 2004-06-30 | 灰调掩模的制造方法 |
KR1020060126296A KR100960746B1 (ko) | 2003-06-30 | 2006-12-12 | 그레이 톤 마스크의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003188242A JP4210166B2 (ja) | 2003-06-30 | 2003-06-30 | グレートーンマスクの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005024730A JP2005024730A (ja) | 2005-01-27 |
JP4210166B2 true JP4210166B2 (ja) | 2009-01-14 |
Family
ID=34186842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003188242A Expired - Lifetime JP4210166B2 (ja) | 2003-06-30 | 2003-06-30 | グレートーンマスクの製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4210166B2 (zh) |
KR (2) | KR100733480B1 (zh) |
CN (1) | CN1284044C (zh) |
TW (1) | TWI247965B (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4614696B2 (ja) | 2004-06-24 | 2011-01-19 | Hoya株式会社 | グレートーンマスクの製造方法 |
JP4693451B2 (ja) * | 2005-03-22 | 2011-06-01 | Hoya株式会社 | グレートーンマスクの製造方法及び薄膜トランジスタ基板の製造方法 |
KR100922800B1 (ko) | 2005-05-27 | 2009-10-21 | 엘지디스플레이 주식회사 | 하프톤 마스크와 그 제조방법 및 이를 이용한 표시장치의 제조방법 |
KR100800301B1 (ko) * | 2005-07-05 | 2008-02-01 | 주식회사 에스앤에스텍 | 그레이톤 블랭크마스크 및 포토마스크 제조방법 |
WO2007010866A1 (ja) * | 2005-07-15 | 2007-01-25 | Ulvac Coating Corporation | グレートーンマスク用ブランクス、及びそれを用いたグレートーンマスク及びその製造方法 |
TW200712756A (en) * | 2005-07-15 | 2007-04-01 | Ulvac Coating Corp | Blanks for gray tone mask, gray tone mask using said blanks, and process for producing said blanks |
JP5110821B2 (ja) * | 2005-08-12 | 2012-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4695964B2 (ja) * | 2005-11-09 | 2011-06-08 | アルバック成膜株式会社 | グレートーンマスク及びその製造方法 |
TWI269935B (en) | 2005-12-30 | 2007-01-01 | Quanta Display Inc | Mask and fabrication method thereof and application thereof |
CN1808267B (zh) * | 2006-02-13 | 2010-12-01 | 友达光电股份有限公司 | 掩膜及其制造方法及其应用 |
KR100822296B1 (ko) * | 2006-04-10 | 2008-04-15 | 엘지마이크론 주식회사 | 다단 구조를 가지는 하프톤 마스크 및 그 제조 방법 |
KR100802448B1 (ko) * | 2006-04-12 | 2008-02-13 | 엘지마이크론 주식회사 | 에칭 스토퍼층을 구비한 하프톤 마스크 및 그 제조 방법 |
JP2008064903A (ja) * | 2006-09-06 | 2008-03-21 | National Institute Of Advanced Industrial & Technology | 三次元構造物作製装置、センサー作製装置、及び三次元構造物作製方法 |
JP5015537B2 (ja) * | 2006-09-26 | 2012-08-29 | Hoya株式会社 | フォトマスクの製造方法及びパターンの転写方法 |
US20080182179A1 (en) * | 2007-01-25 | 2008-07-31 | Allied Integrated Patterning Corp. | Gray tone mask and method for manufacturing the same |
JP5429590B2 (ja) * | 2007-07-10 | 2014-02-26 | Nltテクノロジー株式会社 | ハーフトーンマスク |
TWI431408B (zh) * | 2007-07-23 | 2014-03-21 | Hoya Corp | 光罩資訊之取得方法、光罩之品質顯示方法、顯示裝置之製造方法以及光罩製品 |
JP2009086384A (ja) * | 2007-09-29 | 2009-04-23 | Hoya Corp | フォトマスク及びフォトマスクの製造方法、並びにパターン転写方法 |
JP4968011B2 (ja) * | 2007-11-19 | 2012-07-04 | セイコーエプソン株式会社 | 半導体装置 |
JP2009128558A (ja) | 2007-11-22 | 2009-06-11 | Hoya Corp | フォトマスク及びフォトマスクの製造方法、並びにパターン転写方法 |
JP2009258693A (ja) | 2008-03-27 | 2009-11-05 | Hoya Corp | 多階調フォトマスク及びそれを用いたパターン転写方法 |
JP2009237419A (ja) * | 2008-03-28 | 2009-10-15 | Hoya Corp | 多階調フォトマスク及びその製造方法、並びにパターン転写方法 |
TW201030451A (en) * | 2008-09-30 | 2010-08-16 | Hoya Corp | Multi-tone photomask and method of manufacturing the same |
CN101382732B (zh) * | 2008-10-20 | 2011-09-07 | 友达光电股份有限公司 | 制作图案化材料层的方法 |
JP5274393B2 (ja) * | 2009-06-30 | 2013-08-28 | アルバック成膜株式会社 | ハーフトーンマスクの製造方法 |
JP2012008546A (ja) * | 2010-05-24 | 2012-01-12 | Hoya Corp | 多階調フォトマスクの製造方法、及びパターン転写方法 |
JP2012008545A (ja) * | 2010-05-24 | 2012-01-12 | Hoya Corp | 多階調フォトマスクの製造方法、及びパターン転写方法 |
JP6266919B2 (ja) * | 2013-08-19 | 2018-01-24 | Hoya株式会社 | 転写用マスクの製造方法 |
US11561470B2 (en) * | 2017-03-29 | 2023-01-24 | Toray Industries, Inc. | Negative photosensitive resin composition, cured film, element provided with cured film, organic EL display provided with cured film, and method for producing same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100484517B1 (ko) * | 2000-12-19 | 2005-04-20 | 호야 가부시키가이샤 | 그레이톤 마스크 및 그 제조 방법 |
-
2003
- 2003-06-30 JP JP2003188242A patent/JP4210166B2/ja not_active Expired - Lifetime
-
2004
- 2004-06-28 TW TW093118769A patent/TWI247965B/zh active
- 2004-06-30 CN CNB2004100625381A patent/CN1284044C/zh not_active Expired - Fee Related
- 2004-06-30 KR KR1020040050389A patent/KR100733480B1/ko active IP Right Review Request
-
2006
- 2006-12-12 KR KR1020060126296A patent/KR100960746B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20070003741A (ko) | 2007-01-05 |
TW200506506A (en) | 2005-02-16 |
KR20050002661A (ko) | 2005-01-10 |
CN1577084A (zh) | 2005-02-09 |
KR100960746B1 (ko) | 2010-06-01 |
JP2005024730A (ja) | 2005-01-27 |
CN1284044C (zh) | 2006-11-08 |
KR100733480B1 (ko) | 2007-06-28 |
TWI247965B (en) | 2006-01-21 |
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