JP4187208B2 - ヒーター - Google Patents

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Publication number
JP4187208B2
JP4187208B2 JP2004004069A JP2004004069A JP4187208B2 JP 4187208 B2 JP4187208 B2 JP 4187208B2 JP 2004004069 A JP2004004069 A JP 2004004069A JP 2004004069 A JP2004004069 A JP 2004004069A JP 4187208 B2 JP4187208 B2 JP 4187208B2
Authority
JP
Japan
Prior art keywords
heat generating
resistance value
parallel connection
resistance
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004004069A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005197161A5 (enExample
JP2005197161A (ja
Inventor
義信 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP2004004069A priority Critical patent/JP4187208B2/ja
Priority to US11/024,245 priority patent/US7115839B2/en
Publication of JP2005197161A publication Critical patent/JP2005197161A/ja
Publication of JP2005197161A5 publication Critical patent/JP2005197161A5/ja
Application granted granted Critical
Publication of JP4187208B2 publication Critical patent/JP4187208B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
JP2004004069A 2004-01-09 2004-01-09 ヒーター Expired - Fee Related JP4187208B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004004069A JP4187208B2 (ja) 2004-01-09 2004-01-09 ヒーター
US11/024,245 US7115839B2 (en) 2004-01-09 2004-12-28 Heaters

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004004069A JP4187208B2 (ja) 2004-01-09 2004-01-09 ヒーター

Publications (3)

Publication Number Publication Date
JP2005197161A JP2005197161A (ja) 2005-07-21
JP2005197161A5 JP2005197161A5 (enExample) 2006-09-21
JP4187208B2 true JP4187208B2 (ja) 2008-11-26

Family

ID=34818788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004004069A Expired - Fee Related JP4187208B2 (ja) 2004-01-09 2004-01-09 ヒーター

Country Status (2)

Country Link
US (1) US7115839B2 (enExample)
JP (1) JP4187208B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4756695B2 (ja) 2006-02-20 2011-08-24 コバレントマテリアル株式会社 面状ヒータ
JP2008108703A (ja) * 2006-09-28 2008-05-08 Covalent Materials Corp 面状ヒータ及びこのヒータを備えた半導体熱処理装置
US8993939B2 (en) * 2008-01-18 2015-03-31 Momentive Performance Materials Inc. Resistance heater
JP6253289B2 (ja) * 2013-07-19 2017-12-27 古河機械金属株式会社 気相成長装置及び気相成長用加熱装置
JP6622052B2 (ja) * 2015-10-14 2019-12-18 日本特殊陶業株式会社 セラミックヒータ及び静電チャック
JP6397588B2 (ja) * 2016-07-19 2018-09-26 日本碍子株式会社 静電チャックヒータ
US10679873B2 (en) * 2016-09-30 2020-06-09 Ngk Spark Plug Co., Ltd. Ceramic heater
JP2018063974A (ja) 2016-10-11 2018-04-19 東京エレクトロン株式会社 温度制御装置、温度制御方法、および載置台
JP7050455B2 (ja) * 2017-03-15 2022-04-08 日本特殊陶業株式会社 静電チャックの製造方法
JP7365805B2 (ja) * 2019-07-26 2023-10-20 日本特殊陶業株式会社 保持装置の製造方法および保持装置
JP7703415B2 (ja) * 2021-09-29 2025-07-07 日本特殊陶業株式会社 保持装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338919A (en) * 1991-12-28 1994-08-16 Rohm Co., Ltd. Heater for sheet material and method for adjusting resistance of same
JP2617064B2 (ja) 1992-07-28 1997-06-04 日本碍子株式会社 半導体ウェハー加熱装置およびその製造方法
JPH086412A (ja) * 1994-06-20 1996-01-12 Canon Inc 加熱装置および画像形成装置
JP4040814B2 (ja) * 1998-11-30 2008-01-30 株式会社小松製作所 円盤状ヒータ及び温度制御装置
JP3582518B2 (ja) * 2001-04-18 2004-10-27 住友電気工業株式会社 抵抗発熱体回路パターンとそれを用いた基板処理装置

Also Published As

Publication number Publication date
US20050173413A1 (en) 2005-08-11
US7115839B2 (en) 2006-10-03
JP2005197161A (ja) 2005-07-21

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