JP4174248B2 - ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 - Google Patents

ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 Download PDF

Info

Publication number
JP4174248B2
JP4174248B2 JP2002192279A JP2002192279A JP4174248B2 JP 4174248 B2 JP4174248 B2 JP 4174248B2 JP 2002192279 A JP2002192279 A JP 2002192279A JP 2002192279 A JP2002192279 A JP 2002192279A JP 4174248 B2 JP4174248 B2 JP 4174248B2
Authority
JP
Japan
Prior art keywords
resin
resin composition
group
component
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002192279A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004035650A5 (enExample
JP2004035650A (ja
Inventor
武志 對比地
倫康 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gun Ei Chemical Industry Co Ltd
Original Assignee
Gun Ei Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gun Ei Chemical Industry Co Ltd filed Critical Gun Ei Chemical Industry Co Ltd
Priority to JP2002192279A priority Critical patent/JP4174248B2/ja
Publication of JP2004035650A publication Critical patent/JP2004035650A/ja
Publication of JP2004035650A5 publication Critical patent/JP2004035650A5/ja
Application granted granted Critical
Publication of JP4174248B2 publication Critical patent/JP4174248B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2002192279A 2002-07-01 2002-07-01 ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 Expired - Lifetime JP4174248B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002192279A JP4174248B2 (ja) 2002-07-01 2002-07-01 ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002192279A JP4174248B2 (ja) 2002-07-01 2002-07-01 ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤

Publications (3)

Publication Number Publication Date
JP2004035650A JP2004035650A (ja) 2004-02-05
JP2004035650A5 JP2004035650A5 (enExample) 2006-08-31
JP4174248B2 true JP4174248B2 (ja) 2008-10-29

Family

ID=31701600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002192279A Expired - Lifetime JP4174248B2 (ja) 2002-07-01 2002-07-01 ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤

Country Status (1)

Country Link
JP (1) JP4174248B2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4084597B2 (ja) * 2002-05-07 2008-04-30 群栄化学工業株式会社 アミノ基含有フェノール誘導体
JP4120780B2 (ja) * 2002-07-19 2008-07-16 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
JP4204435B2 (ja) * 2002-10-10 2009-01-07 信越化学工業株式会社 熱硬化性基を含有する透明ポリイミドシリコーン樹脂
JP4871500B2 (ja) * 2004-11-02 2012-02-08 株式会社カネカ 樹脂組成物の流動性を向上させる樹脂改質材
KR20080056177A (ko) * 2005-10-21 2008-06-20 니폰 가야꾸 가부시끼가이샤 열경화성 수지 조성물 및 그 용도
JP4737447B2 (ja) * 2007-06-01 2011-08-03 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂及びポリイミド樹脂組成物
US8410620B2 (en) 2007-09-20 2013-04-02 Nippon Kayaku Kabushiki Kaisha Primer resin for semiconductor device and semiconductor device
JP5045924B2 (ja) * 2007-11-19 2012-10-10 信越化学工業株式会社 フェノール性水酸基を有するポリイミド樹脂の製造方法
WO2011021628A1 (ja) * 2009-08-18 2011-02-24 宇部興産株式会社 ポリイミドシロキサン溶液組成物の製造方法、及びポリイミドシロキサン溶液組成物
WO2012124780A1 (ja) * 2011-03-16 2012-09-20 東レ株式会社 エポキシ樹脂組成物およびその製造方法ならびにそれを用いた半導体装置
JP5707216B2 (ja) 2011-04-26 2015-04-22 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
CN102321244B (zh) * 2011-07-22 2013-05-01 中山大学 含刚性非平面共轭结构的可溶性功能聚酰亚胺及其制备方法和应用
JP5726048B2 (ja) * 2011-11-14 2015-05-27 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
JP6960404B2 (ja) 2016-07-29 2021-11-05 株式会社カネカ ポリイミド樹脂、および樹脂組成物
JP6532518B2 (ja) * 2017-12-08 2019-06-19 信越化学工業株式会社 高効率太陽電池の製造方法
JP7271461B2 (ja) * 2020-02-19 2023-05-11 信越化学工業株式会社 有機膜形成用材料およびパターン形成方法
JP7527823B2 (ja) * 2020-03-30 2024-08-05 リンテック株式会社 フィルム状接着剤
JP7446887B2 (ja) * 2020-03-30 2024-03-11 リンテック株式会社 フィルム状接着剤
CN118027405B (zh) * 2023-03-07 2025-02-11 江汉大学 一种光引发产酸固化型聚酰亚胺及其制备方法和光引发产酸固化型光刻胶

Also Published As

Publication number Publication date
JP2004035650A (ja) 2004-02-05

Similar Documents

Publication Publication Date Title
US6645632B2 (en) Film-type adhesive for electronic components, and electronic components bonded therewith
JP4748292B2 (ja) フィルム状電子部品用接着剤及び電子部品
KR100605517B1 (ko) 폴리이미드-금속 적층체 및 폴리아미드이미드-금속 적층체
US6187874B1 (en) Adhesive for electronic parts and adhesive tape for electronic parts
JP2004035650A (ja) ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
US7820742B2 (en) Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C
JP4174274B2 (ja) ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
JP2020072198A (ja) 金属張積層板、回路基板、多層回路基板及びその製造方法
JP5533354B2 (ja) シールドフィルム及びシールド配線板
JP3243963B2 (ja) ポリイミドシロキサン組成物
CN102083886A (zh) 半导体装置用底漆树脂层及半导体装置
JP2002293933A (ja) アルコキシ基含有シラン変性ポリアミック酸樹脂組成物およびポリイミド−シリカハイブリッド硬化物
JP4022851B2 (ja) 金属付きポリイミドフィルムの製造方法および当該製造方法により得られる金属付きポリイミドフィルム
JP3344315B2 (ja) 一色塗りポリイミドシロキサン系コ−ト材および硬化膜
WO2010067485A1 (ja) シールドフィルム及びシールド配線板
CN103059787A (zh) 导热性粘合剂组合物、使用该组合物的粘合用片材以及导热性切割芯片贴膜
US7364797B2 (en) Adhesive composition and adhesive film
JP5183076B2 (ja) 半導体装置の製造方法
JP4120110B2 (ja) ポリイミド系絶縁膜用組成物、絶縁膜および絶縁膜の形成法
JP3978656B2 (ja) 金属箔積層体および両面金属箔積層体
JP4095381B2 (ja) 芳香族ポリアミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
JP3074661B2 (ja) ポリイミドシロキサン組成物
JP3707879B2 (ja) ポリイミド樹脂組成物およびフィルム接着剤とその製造方法
JP4530126B2 (ja) 接着剤組成物及び接着フイルム
JP2004059697A (ja) コーティング用樹脂組成物及び金属箔積層体回路基板

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050120

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060719

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070709

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070717

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070802

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080324

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080729

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080818

R150 Certificate of patent or registration of utility model

Ref document number: 4174248

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110822

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120822

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120822

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130822

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term