JP4166686B2 - 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法 - Google Patents

金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法 Download PDF

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Publication number
JP4166686B2
JP4166686B2 JP2003435760A JP2003435760A JP4166686B2 JP 4166686 B2 JP4166686 B2 JP 4166686B2 JP 2003435760 A JP2003435760 A JP 2003435760A JP 2003435760 A JP2003435760 A JP 2003435760A JP 4166686 B2 JP4166686 B2 JP 4166686B2
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Japan
Prior art keywords
resin
containing resin
metal fine
particles
fine particle
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Expired - Fee Related
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JP2003435760A
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English (en)
Japanese (ja)
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JP2005194327A (ja
JP2005194327A5 (enExample
Inventor
秀夫 青木
直子 山口
知章 田窪
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Toshiba Corp
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Toshiba Corp
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Publication date
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Priority to JP2003435760A priority Critical patent/JP4166686B2/ja
Priority to TW093137960A priority patent/TW200521171A/zh
Priority to US11/018,473 priority patent/US7939171B2/en
Priority to KR1020040111799A priority patent/KR100612170B1/ko
Priority to CNA2004101034389A priority patent/CN1649471A/zh
Publication of JP2005194327A publication Critical patent/JP2005194327A/ja
Publication of JP2005194327A5 publication Critical patent/JP2005194327A5/ja
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Publication of JP4166686B2 publication Critical patent/JP4166686B2/ja
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Expired - Fee Related legal-status Critical Current

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  • Paints Or Removers (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
JP2003435760A 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法 Expired - Fee Related JP4166686B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003435760A JP4166686B2 (ja) 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法
TW093137960A TW200521171A (en) 2003-12-26 2004-12-08 Resin particles and resin layer containing metal micro particles, its forming method and circuit base board
US11/018,473 US7939171B2 (en) 2003-12-26 2004-12-22 Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit
KR1020040111799A KR100612170B1 (ko) 2003-12-26 2004-12-24 금속 미립자 함유 수지 입자, 금속 미립자 함유 수지층,금속 미립자 함유 수지층의 형성 방법 및 전자 회로 기판
CNA2004101034389A CN1649471A (zh) 2003-12-26 2004-12-27 含有金属微粒的树脂颗粒、树脂层、其形成方法以及电路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003435760A JP4166686B2 (ja) 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法

Publications (3)

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JP2005194327A JP2005194327A (ja) 2005-07-21
JP2005194327A5 JP2005194327A5 (enExample) 2005-09-02
JP4166686B2 true JP4166686B2 (ja) 2008-10-15

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JP2003435760A Expired - Fee Related JP4166686B2 (ja) 2003-12-26 2003-12-26 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法

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JP (1) JP4166686B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4775550B2 (ja) * 2005-09-30 2011-09-21 Ｔｄｋ株式会社 無電解めっき膜形成方法、及び、触媒パターン形成装置
CN101491166B (zh) * 2006-06-14 2011-09-28 巴斯夫欧洲公司 在载体上生产导电表面的方法
JP2013243045A (ja) * 2012-05-21 2013-12-05 Kanto Gakuin 導電性積層体、導電性積層体の製造方法
JP6672756B2 (ja) * 2015-12-04 2020-03-25 株式会社村田製作所 電子部品および電子部品の製造方法
JP6927271B2 (ja) * 2015-12-04 2021-08-25 株式会社村田製作所 電子部品および電子部品の製造方法
TWI645973B (zh) * 2017-12-15 2019-01-01 律勝科技股份有限公司 聚醯亞胺薄化軟性基板及其製造方法
CN118946455A (zh) * 2022-03-29 2024-11-12 Tdk株式会社 导电性膜及显示装置
JPWO2023189250A1 (enExample) * 2022-03-29 2023-10-05

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