JP2005194327A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005194327A5 JP2005194327A5 JP2003435760A JP2003435760A JP2005194327A5 JP 2005194327 A5 JP2005194327 A5 JP 2005194327A5 JP 2003435760 A JP2003435760 A JP 2003435760A JP 2003435760 A JP2003435760 A JP 2003435760A JP 2005194327 A5 JP2005194327 A5 JP 2005194327A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal fine
- fine particle
- particles
- containing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 26
- 229920005989 resin Polymers 0.000 claims 26
- 239000010419 fine particle Substances 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 11
- 239000011159 matrix material Substances 0.000 claims 9
- 239000002245 particle Substances 0.000 claims 8
- 239000000654 additive Substances 0.000 claims 4
- 230000000996 additive effect Effects 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 230000005484 gravity Effects 0.000 claims 3
- 229920001187 thermosetting polymer Polymers 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000002923 metal particle Substances 0.000 claims 2
- 108091008695 photoreceptors Proteins 0.000 claims 2
- 229910001111 Fine metal Inorganic materials 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003435760A JP4166686B2 (ja) | 2003-12-26 | 2003-12-26 | 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法 |
| TW093137960A TW200521171A (en) | 2003-12-26 | 2004-12-08 | Resin particles and resin layer containing metal micro particles, its forming method and circuit base board |
| US11/018,473 US7939171B2 (en) | 2003-12-26 | 2004-12-22 | Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit |
| KR1020040111799A KR100612170B1 (ko) | 2003-12-26 | 2004-12-24 | 금속 미립자 함유 수지 입자, 금속 미립자 함유 수지층,금속 미립자 함유 수지층의 형성 방법 및 전자 회로 기판 |
| CNA2004101034389A CN1649471A (zh) | 2003-12-26 | 2004-12-27 | 含有金属微粒的树脂颗粒、树脂层、其形成方法以及电路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003435760A JP4166686B2 (ja) | 2003-12-26 | 2003-12-26 | 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005194327A JP2005194327A (ja) | 2005-07-21 |
| JP2005194327A5 true JP2005194327A5 (enExample) | 2005-09-02 |
| JP4166686B2 JP4166686B2 (ja) | 2008-10-15 |
Family
ID=34815727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003435760A Expired - Fee Related JP4166686B2 (ja) | 2003-12-26 | 2003-12-26 | 金属微粒子含有樹脂粒子、金属微粒子含有樹脂層および金属微粒子含有樹脂層の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4166686B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4775550B2 (ja) * | 2005-09-30 | 2011-09-21 | Ｔｄｋ株式会社 | 無電解めっき膜形成方法、及び、触媒パターン形成装置 |
| CN101491166B (zh) * | 2006-06-14 | 2011-09-28 | 巴斯夫欧洲公司 | 在载体上生产导电表面的方法 |
| JP2013243045A (ja) * | 2012-05-21 | 2013-12-05 | Kanto Gakuin | 導電性積層体、導電性積層体の製造方法 |
| JP6672756B2 (ja) * | 2015-12-04 | 2020-03-25 | 株式会社村田製作所 | 電子部品および電子部品の製造方法 |
| JP6927271B2 (ja) * | 2015-12-04 | 2021-08-25 | 株式会社村田製作所 | 電子部品および電子部品の製造方法 |
| TWI645973B (zh) * | 2017-12-15 | 2019-01-01 | 律勝科技股份有限公司 | 聚醯亞胺薄化軟性基板及其製造方法 |
| CN118946455A (zh) * | 2022-03-29 | 2024-11-12 | Tdk株式会社 | 导电性膜及显示装置 |
| JPWO2023189250A1 (enExample) * | 2022-03-29 | 2023-10-05 |
-
2003
- 2003-12-26 JP JP2003435760A patent/JP4166686B2/ja not_active Expired - Fee Related