JP4164241B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4164241B2
JP4164241B2 JP2001038237A JP2001038237A JP4164241B2 JP 4164241 B2 JP4164241 B2 JP 4164241B2 JP 2001038237 A JP2001038237 A JP 2001038237A JP 2001038237 A JP2001038237 A JP 2001038237A JP 4164241 B2 JP4164241 B2 JP 4164241B2
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JP
Japan
Prior art keywords
read
dummy
data line
transistor
memory cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001038237A
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English (en)
Japanese (ja)
Other versions
JP2002245775A (ja
JP2002245775A5 (enExample
Inventor
悟 半澤
健 阪田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2001038237A priority Critical patent/JP4164241B2/ja
Priority to TW090120907A priority patent/TW538414B/zh
Priority to KR1020010051579A priority patent/KR100823673B1/ko
Priority to US09/942,558 priority patent/US6512714B2/en
Publication of JP2002245775A publication Critical patent/JP2002245775A/ja
Priority to US10/315,938 priority patent/US6683813B2/en
Priority to US10/660,657 priority patent/US6751142B2/en
Publication of JP2002245775A5 publication Critical patent/JP2002245775A5/ja
Application granted granted Critical
Publication of JP4164241B2 publication Critical patent/JP4164241B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409—Read-write [R-W] circuits 
    • G11C11/4099—Dummy cell treatment; Reference voltage generators
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/14—Dummy cell management; Sense reference voltage generators

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Semiconductor Memories (AREA)
JP2001038237A 2001-02-15 2001-02-15 半導体装置 Expired - Fee Related JP4164241B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001038237A JP4164241B2 (ja) 2001-02-15 2001-02-15 半導体装置
TW090120907A TW538414B (en) 2001-02-15 2001-08-24 Semiconductor device
KR1020010051579A KR100823673B1 (ko) 2001-02-15 2001-08-25 반도체장치
US09/942,558 US6512714B2 (en) 2001-02-15 2001-08-31 Semiconductor memory device equipped with dummy cells
US10/315,938 US6683813B2 (en) 2001-02-15 2002-12-11 Semiconductor memory device equipped with dummy cells
US10/660,657 US6751142B2 (en) 2001-02-15 2003-09-12 Semiconductor memory device equipped with dummy cells

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001038237A JP4164241B2 (ja) 2001-02-15 2001-02-15 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007226094A Division JP4373464B2 (ja) 2007-08-31 2007-08-31 半導体装置

Publications (3)

Publication Number Publication Date
JP2002245775A JP2002245775A (ja) 2002-08-30
JP2002245775A5 JP2002245775A5 (enExample) 2006-11-02
JP4164241B2 true JP4164241B2 (ja) 2008-10-15

Family

ID=18901252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001038237A Expired - Fee Related JP4164241B2 (ja) 2001-02-15 2001-02-15 半導体装置

Country Status (4)

Country Link
US (3) US6512714B2 (enExample)
JP (1) JP4164241B2 (enExample)
KR (1) KR100823673B1 (enExample)
TW (1) TW538414B (enExample)

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JP4164241B2 (ja) * 2001-02-15 2008-10-15 株式会社ルネサステクノロジ 半導体装置
US20040183932A1 (en) * 2003-01-30 2004-09-23 Matsushita Electric Industrial Co., Ltd. Solid state imaging device
US6853591B2 (en) * 2003-03-31 2005-02-08 Micron Technology, Inc. Circuit and method for decreasing the required refresh rate of DRAM devices
JP4010995B2 (ja) * 2003-07-31 2007-11-21 Ｎｅｃエレクトロニクス株式会社 半導体メモリ及びそのリファレンス電位発生方法
US6831866B1 (en) 2003-08-26 2004-12-14 International Business Machines Corporation Method and apparatus for read bitline clamping for gain cell DRAM devices
US7046544B1 (en) * 2003-10-06 2006-05-16 Xilinx, Inc. SRAM cell with read-disturb immunity
US6982897B2 (en) * 2003-10-07 2006-01-03 International Business Machines Corporation Nondestructive read, two-switch, single-charge-storage device RAM devices
US7963448B2 (en) * 2004-12-22 2011-06-21 Cognex Technology And Investment Corporation Hand held machine vision method and apparatus
US9552506B1 (en) 2004-12-23 2017-01-24 Cognex Technology And Investment Llc Method and apparatus for industrial identification mark verification
JP2006190732A (ja) * 2005-01-04 2006-07-20 Toshiba Corp 自動設計方法及び半導体集積回路
JP2006261638A (ja) * 2005-02-21 2006-09-28 Sony Corp 固体撮像装置および固体撮像装置の駆動方法
US7501676B2 (en) * 2005-03-25 2009-03-10 Micron Technology, Inc. High density semiconductor memory
JP4849817B2 (ja) * 2005-04-08 2012-01-11 ルネサスエレクトロニクス株式会社 半導体記憶装置
US7180769B2 (en) * 2005-04-12 2007-02-20 Headway Technologies, Inc. World line segment select transistor on word line current source side
EP1793367A3 (en) * 2005-12-02 2009-08-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7276155B1 (en) * 2006-05-04 2007-10-02 Wastewater Technology, Inc. Waste treatment apparatus with integral membrane apparatus
US8108176B2 (en) 2006-06-29 2012-01-31 Cognex Corporation Method and apparatus for verifying two dimensional mark quality
US7984854B2 (en) * 2006-07-17 2011-07-26 Cognex Corporation Method and apparatus for multiplexed symbol decoding
US8169478B2 (en) * 2006-12-14 2012-05-01 Cognex Corporation Method and apparatus for calibrating a mark verifier
US9734376B2 (en) 2007-11-13 2017-08-15 Cognex Corporation System and method for reading patterns using multiple image frames
US8780629B2 (en) * 2010-01-15 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
TWI511236B (zh) * 2010-05-14 2015-12-01 Semiconductor Energy Lab 半導體裝置
US8792284B2 (en) * 2010-08-06 2014-07-29 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor memory device
TWI501226B (zh) * 2011-05-20 2015-09-21 Semiconductor Energy Lab 記憶體裝置及驅動記憶體裝置的方法
US8773920B2 (en) 2012-02-21 2014-07-08 International Business Machines Corporation Reference generator with programmable M and B parameters and methods of use
JP6100559B2 (ja) * 2012-03-05 2017-03-22 株式会社半導体エネルギー研究所 半導体記憶装置
US8921175B2 (en) * 2012-07-20 2014-12-30 Semiconductor Components Industries, Llc Process of forming an electronic device including a nonvolatile memory cell
KR102055375B1 (ko) 2013-01-14 2020-01-22 삼성전자 주식회사 저항체를 이용한 비휘발성 메모리 장치 및 이를 포함하는 메모리 시스템
WO2014157019A1 (en) * 2013-03-25 2014-10-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP6560508B2 (ja) 2014-03-13 2019-08-14 株式会社半導体エネルギー研究所 半導体装置
KR20150138026A (ko) 2014-05-29 2015-12-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
DE102014115204B4 (de) * 2014-10-20 2020-08-20 Infineon Technologies Ag Testen von Vorrichtungen
CN109643572A (zh) 2016-09-12 2019-04-16 株式会社半导体能源研究所 存储装置及其工作方法、半导体装置、电子构件以及电子设备
WO2018073708A1 (en) * 2016-10-20 2018-04-26 Semiconductor Energy Laboratory Co., Ltd. Storage device, driving method thereof, semiconductor device, electronic component, and electronic device
US10860320B1 (en) 2016-12-06 2020-12-08 Gsi Technology, Inc. Orthogonal data transposition system and method during data transfers to/from a processing array
US10998040B2 (en) 2016-12-06 2021-05-04 Gsi Technology, Inc. Computational memory cell and processing array device using the memory cells for XOR and XNOR computations
US10847213B1 (en) 2016-12-06 2020-11-24 Gsi Technology, Inc. Write data processing circuits and methods associated with computational memory cells
US10847212B1 (en) 2016-12-06 2020-11-24 Gsi Technology, Inc. Read and write data processing circuits and methods associated with computational memory cells using two read multiplexers
US10854284B1 (en) 2016-12-06 2020-12-01 Gsi Technology, Inc. Computational memory cell and processing array device with ratioless write port
US11227653B1 (en) 2016-12-06 2022-01-18 Gsi Technology, Inc. Storage array circuits and methods for computational memory cells
US10725777B2 (en) 2016-12-06 2020-07-28 Gsi Technology, Inc. Computational memory cell and processing array device using memory cells
US10891076B1 (en) 2016-12-06 2021-01-12 Gsi Technology, Inc. Results processing circuits and methods associated with computational memory cells
US10943648B1 (en) 2016-12-06 2021-03-09 Gsi Technology, Inc. Ultra low VDD memory cell with ratioless write port
US10777262B1 (en) 2016-12-06 2020-09-15 Gsi Technology, Inc. Read data processing circuits and methods associated memory cells
US10847651B2 (en) * 2018-07-18 2020-11-24 Micron Technology, Inc. Semiconductor devices including electrically conductive contacts and related systems and methods
US10985162B2 (en) 2018-12-14 2021-04-20 John Bennett System for accurate multiple level gain cells
US10958272B2 (en) 2019-06-18 2021-03-23 Gsi Technology, Inc. Computational memory cell and processing array device using complementary exclusive or memory cells
US10877731B1 (en) 2019-06-18 2020-12-29 Gsi Technology, Inc. Processing array device that performs one cycle full adder operation and bit line read/write logic features
US10930341B1 (en) * 2019-06-18 2021-02-23 Gsi Technology, Inc. Processing array device that performs one cycle full adder operation and bit line read/write logic features
US12432906B2 (en) 2021-11-25 2025-09-30 Samsung Electronics Co., Ltd. Memory device including dummy capacitor shielding structure and manufacturing method thereof

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JPS56163585A (en) * 1980-05-17 1981-12-16 Semiconductor Res Found Semiconductor memory
JPS6271091A (ja) * 1985-09-24 1987-04-01 Nec Corp 半導体メモリ
JPH09213812A (ja) 1996-01-31 1997-08-15 Fujitsu Ltd Ｄｒａｍセル及びｄｒａｍ
DE19842852B4 (de) * 1998-09-18 2005-05-19 Infineon Technologies Ag Integrierter Speicher
JP2001006355A (ja) * 1999-06-16 2001-01-12 Sony Corp メモリセル及びそれを用いた半導体記憶装置
JP2001093988A (ja) * 1999-07-22 2001-04-06 Sony Corp 半導体記憶装置
US6181626B1 (en) * 2000-04-03 2001-01-30 Lsi Logic Corporation Self-timing circuit for semiconductor memory devices
JP4164241B2 (ja) * 2001-02-15 2008-10-15 株式会社ルネサステクノロジ 半導体装置

Also Published As

Publication number Publication date
US6751142B2 (en) 2004-06-15
US20040046213A1 (en) 2004-03-11
TW538414B (en) 2003-06-21
US6683813B2 (en) 2004-01-27
US20030123313A1 (en) 2003-07-03
JP2002245775A (ja) 2002-08-30
US6512714B2 (en) 2003-01-28
KR20020067406A (ko) 2002-08-22
US20020136074A1 (en) 2002-09-26
KR100823673B1 (ko) 2008-04-21

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