JP4154121B2 - 電解液中の物質濃度を調整するための方法と装置 - Google Patents

電解液中の物質濃度を調整するための方法と装置 Download PDF

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Publication number
JP4154121B2
JP4154121B2 JP2000507866A JP2000507866A JP4154121B2 JP 4154121 B2 JP4154121 B2 JP 4154121B2 JP 2000507866 A JP2000507866 A JP 2000507866A JP 2000507866 A JP2000507866 A JP 2000507866A JP 4154121 B2 JP4154121 B2 JP 4154121B2
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Japan
Prior art keywords
auxiliary tank
metal
cathode
anode
electrolyte
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Expired - Lifetime
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JP2000507866A
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Japanese (ja)
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JP2001514330A (ja
Inventor
イェンス・エリック ガイスラー
ラルフ・ペーター ヴェヒター
ロレンツ コップ
マンフレート マウラー
Original Assignee
アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2000507866A 1997-08-21 1998-08-19 電解液中の物質濃度を調整するための方法と装置 Expired - Lifetime JP4154121B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19736350A DE19736350C1 (de) 1997-08-21 1997-08-21 Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens
DE19736350.4 1997-08-21
PCT/DE1998/002505 WO1999010564A2 (de) 1997-08-21 1998-08-19 Verfahren und vorrichtung zur konzentrationsregulierung von stoffen in elektrolyten

Publications (2)

Publication Number Publication Date
JP2001514330A JP2001514330A (ja) 2001-09-11
JP4154121B2 true JP4154121B2 (ja) 2008-09-24

Family

ID=7839696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000507866A Expired - Lifetime JP4154121B2 (ja) 1997-08-21 1998-08-19 電解液中の物質濃度を調整するための方法と装置

Country Status (12)

Country Link
US (1) US6350362B1 (de)
EP (1) EP1015667B1 (de)
JP (1) JP4154121B2 (de)
KR (1) KR100558129B1 (de)
CN (1) CN1153855C (de)
AT (1) ATE214745T1 (de)
CA (1) CA2301299A1 (de)
DE (2) DE19736350C1 (de)
ES (1) ES2172926T3 (de)
HK (1) HK1028427A1 (de)
TW (1) TW512188B (de)
WO (1) WO1999010564A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10013339C1 (de) * 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Regulieren der Konzentration von Metallionen in einer Elektrolytflüssigkeit sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
JP3860111B2 (ja) * 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
DE10314279A1 (de) * 2003-03-29 2004-10-14 Daimlerchrysler Ag Verfahren und Vorrichtung zum Steuern mindestens einer Betriebsgröße eines elektrolytischen Bades
US7837841B2 (en) * 2007-03-15 2010-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
JP5110269B2 (ja) * 2007-08-09 2012-12-26 上村工業株式会社 電気銅めっき方法
DE102009060676B4 (de) * 2009-12-28 2015-07-23 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut
DE102017216710A1 (de) * 2017-09-21 2019-03-21 Siemens Aktiengesellschaft Elektrolyseuranordnung
CN114277392B (zh) * 2021-12-23 2023-10-24 四川大学华西医院 一种具有离子陷阱的电解装置、电解方法和电镀方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE215589C (de)
DD215589B5 (de) * 1983-05-11 1994-06-01 Heinz Dr Rer Nat Liebscher Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19545231A1 (de) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten

Also Published As

Publication number Publication date
KR20010023153A (ko) 2001-03-26
CN1153855C (zh) 2004-06-16
CN1267342A (zh) 2000-09-20
ES2172926T3 (es) 2002-10-01
TW512188B (en) 2002-12-01
WO1999010564A2 (de) 1999-03-04
DE59803457D1 (de) 2002-04-25
HK1028427A1 (en) 2001-02-16
EP1015667B1 (de) 2002-03-20
EP1015667A2 (de) 2000-07-05
US6350362B1 (en) 2002-02-26
CA2301299A1 (en) 1999-03-04
DE19736350C1 (de) 1999-08-05
WO1999010564A3 (de) 1999-08-05
KR100558129B1 (ko) 2006-03-10
ATE214745T1 (de) 2002-04-15
JP2001514330A (ja) 2001-09-11

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