ES2172926T3 - Procedimiento y dispositivo para regular la concentracion de sustancias en electrolitos. - Google Patents

Procedimiento y dispositivo para regular la concentracion de sustancias en electrolitos.

Info

Publication number
ES2172926T3
ES2172926T3 ES98949944T ES98949944T ES2172926T3 ES 2172926 T3 ES2172926 T3 ES 2172926T3 ES 98949944 T ES98949944 T ES 98949944T ES 98949944 T ES98949944 T ES 98949944T ES 2172926 T3 ES2172926 T3 ES 2172926T3
Authority
ES
Spain
Prior art keywords
concentration
metal
regulating
compounds
reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98949944T
Other languages
English (en)
Inventor
Jens-Eric Geisler
Ralf-Peter Wachter
Lorenz Kopp
Manfred Maurer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2172926T3 publication Critical patent/ES2172926T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)

Abstract

Procedimiento para regular la concentración de iones metálicos en un electrolito empleado para la deposición de metal, el cual contiene adicionalmente compuestos de un sistema redox reversible electroquímicamente, cuya forma oxidada permite disolver el metal en un generador de iones, a través del cual se hace pasar el electrolito, de manera que los compuestos quedan reducidos, en la forma oxidada, mientras que los compuestos formados en la forma reducida vuelven a ser oxidados al efecto en los ánodos insolubles, y el metal, a partir del electrolito, que se halla por lo menos en un recipiente de galvanizado de una instalación de galvanización, es aportado sobre el material a tratar mediante el empleo de ánodos insolubles, caracterizado por el hecho de que a) por lo menos parte del líquido electrolito contenido en la instalación galvánica (13) se hace pasar a través de una o más células electrolíticas auxiliares (6) que tiene por lo menos un ánodo insoluble (8) y por lo menos un cátodo (7); y b)se establece un flujo de corriente eléctrica entre los ánodos (8) y los cátodos (7) de las células auxiliares (6) con un valor tan alto que la densidad de corriente en la superficie de los ánodos es por lo menos igual a 6 A/dm2, mientras la densidad de la corriente en la superficie de los cátodos es como
ES98949944T 1997-08-21 1998-08-19 Procedimiento y dispositivo para regular la concentracion de sustancias en electrolitos. Expired - Lifetime ES2172926T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19736350A DE19736350C1 (de) 1997-08-21 1997-08-21 Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens

Publications (1)

Publication Number Publication Date
ES2172926T3 true ES2172926T3 (es) 2002-10-01

Family

ID=7839696

Family Applications (1)

Application Number Title Priority Date Filing Date
ES98949944T Expired - Lifetime ES2172926T3 (es) 1997-08-21 1998-08-19 Procedimiento y dispositivo para regular la concentracion de sustancias en electrolitos.

Country Status (12)

Country Link
US (1) US6350362B1 (es)
EP (1) EP1015667B1 (es)
JP (1) JP4154121B2 (es)
KR (1) KR100558129B1 (es)
CN (1) CN1153855C (es)
AT (1) ATE214745T1 (es)
CA (1) CA2301299A1 (es)
DE (2) DE19736350C1 (es)
ES (1) ES2172926T3 (es)
HK (1) HK1028427A1 (es)
TW (1) TW512188B (es)
WO (1) WO1999010564A2 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10013339C1 (de) 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Regulieren der Konzentration von Metallionen in einer Elektrolytflüssigkeit sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
JP3860111B2 (ja) * 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
DE10314279A1 (de) * 2003-03-29 2004-10-14 Daimlerchrysler Ag Verfahren und Vorrichtung zum Steuern mindestens einer Betriebsgröße eines elektrolytischen Bades
US7837841B2 (en) * 2007-03-15 2010-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereof
JP4957906B2 (ja) * 2007-07-27 2012-06-20 上村工業株式会社 連続電気銅めっき方法
JP5110269B2 (ja) * 2007-08-09 2012-12-26 上村工業株式会社 電気銅めっき方法
DE102009060676B4 (de) * 2009-12-28 2015-07-23 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut
DE102017216710A1 (de) * 2017-09-21 2019-03-21 Siemens Aktiengesellschaft Elektrolyseuranordnung
CN114277392B (zh) * 2021-12-23 2023-10-24 四川大学华西医院 一种具有离子陷阱的电解装置、电解方法和电镀方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE215589C (es)
DD215589B5 (de) * 1983-05-11 1994-06-01 Heinz Dr Rer Nat Liebscher Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
DE19545231A1 (de) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten

Also Published As

Publication number Publication date
HK1028427A1 (en) 2001-02-16
TW512188B (en) 2002-12-01
KR20010023153A (ko) 2001-03-26
WO1999010564A2 (de) 1999-03-04
ATE214745T1 (de) 2002-04-15
JP2001514330A (ja) 2001-09-11
EP1015667B1 (de) 2002-03-20
US6350362B1 (en) 2002-02-26
JP4154121B2 (ja) 2008-09-24
CN1267342A (zh) 2000-09-20
CA2301299A1 (en) 1999-03-04
CN1153855C (zh) 2004-06-16
DE19736350C1 (de) 1999-08-05
WO1999010564A3 (de) 1999-08-05
EP1015667A2 (de) 2000-07-05
DE59803457D1 (de) 2002-04-25
KR100558129B1 (ko) 2006-03-10

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